轉職熱搜工作

1. 使用 VHDL/Verilog 進行 CPLD 電路邏輯開發。 2. 執行模擬、合成與晶片燒錄，並進行 Debug。 3. 設計 I²C、SPI、UART 等數位介面，與硬體電路整合。 4. 確保設計符合時序需求，並優化資源與功耗。 5. 產出設計規格書/測試報告，並與韌體、製造團隊協同作業。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5304&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Automation Systems Integration Engineer in TSMC‘s Intelligent Manufacturing Center (IMC) has four missions: 1. To be familiar with TSMC‘s automation system architecture and software development lifecycle, define user requirements, and assist in providing integrated solutions to improve production line issues, such as process automation, enhancement of personnel/machine productivity, or optimization of quality monitoring. 2. To be enthusiastic about learning new technological knowledge and willing to understand the details of semiconductor production processes, possess data analysis capabilities to thoroughly investigate problems, and guide users in proposing complete and rational end-user requirements. 3. To have project tracking and management skills, proactively identify problems and actively seek resources for assistance, effectively intervene and manage conflicts when they arise, with frequent opportunities to present briefings for communication management. 4. In the event of system anomalies in the responsible fab area, one must responsibly understand the extent of the anomaly‘s impact and report back to supervisors, and collaborate with the relevant system personnel to resolve the issue within a reasonable time frame to avoid significant production line losses. Responsibilities: 1. Serve as a bridge between users and the system development team, assisting in finding system opportunity, defining requirements and continuously improving system experiences. 2. Collaborate with users to define precise system requirement and solution to improve tool efficiency, people productivity and quality defense. 3. Cooperate with cross-team members to manage project progress and be goal-oriented to deliver achievements. Work Location: Longtan, Hsinchu, Zhunan, Taichung, Tainan, Kaohsiung Fixed Rotation: On-call 1 week every 1.5 months. Event: In case of incidents affecting the production line, remote connection to the company is required for resolution. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

負責測試智慧城市應用之功能、效能與安全性，建立自動化測試流程與品質驗證標準 1. 熟悉自動化測試框架（如Selenium、Cypress） 2. 具備CI/CD下測試流程設計經驗 3. 熟悉API測試與效能測試工具 4. 能撰寫測試計畫與測試案例

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5309&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Intelligent Process Control Systems Department (IPCS) in TSMC‘s Intelligent Manufacturing Center (IMC) assists fabs in analyzing process issues. By employing techniques such as experimental design, statistical analysis, optimization algorithms, and machine learning, the department establishes R2R (Run-to-Run) process control models. Subsequently, in collaboration with the system development team, an automated control platform is established and rolled out across various fab zones. This integration aims to enhance staff efficiency and improve overall product quality. Responsibilities: 1. By employing methods such as control system development, algorithm design, and control performance diagnostics, we provide advanced control systems for the semiconductor industry. 2. We use machine learning and optimization algorithms to build models that deliver solutions meeting the needs of the fab zones. 3. We establish automated platforms that utilize techniques such as machine learning and AI for automatic parameter optimization, which reduces staff workload and enhances quality. 4. In collaboration with the system development team, we systematically implement and roll out innovative methods or improvements across various fab zones to boost staff efficiency and product quality. Work Location: Hsinchu/Taichung/Tainan Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.鏡片組機構設計/光波導組裝設計/光引擎開發工作。 2.機構組裝問題FACA /可靠度失效分析。 3.公差設計/量測設計/尺寸管控。 4.材料性能驗證

1.執行NB特案機種的系統熱傳與噪音工程設計 2.建構TPE & VN團隊與人員培訓 3.建構TPE & VN熱傳與噪音設計實驗室

1.監控系統異常狀況，維持正常運作並即時修正錯誤 2.軟硬體的安裝與維護 3.定期撰寫監測效能報告 4.拉線配管，例如電腦週邊、網路設備、軟體及資訊系統展示、設定教學等。

1.具備光學鍍膜10年以上經驗，專精In-line or Batch Sputter or PVD管理. 2.專精光學模擬軟體macleod使用，光學膜層設計能力及材料特性分析 3.負責工程部門日常管理

1. 電子產品組裝/包裝流程確立以及製程優化，點膠/鐳雕/超聲波壓合/氣密測試等製程驗證及改善。 2. 治工具設計方案評估及review，驗收及問題點改善。 3. 產品組裝包裝生產異常分析及對策樹立。 4. ME團隊管理與能力提升，工程師分析難點指導，工程師報告review。 5. 客戶稽核以及客訴應對。 6. 主導新產品/新線體/新廠建立或產品廠別移轉的組裝包裝製程認證。 7. PFMEA/DFM/FA/DOE/MSA等報告製作