轉職熱搜工作

1. 機械設備及電控組立、組裝、電控盤配線配管及測試 2. 可配合加班/國內外出差(竹北廠/湖口廠) 【自我推薦獎金】 即日起，主動應徵本職缺，並到職滿三個月(試用過後成為正職員工)，可得獎金6,000元。 獎勵期間，視招募情況可提前結束。

Responsible for the end-to-end design, integration, and optimization of Ultra-High Purity (UHP) chemical, slurry, and bulk solvent distribution systems, ensuring maximum wafer throughput, precise process control, and strict compliance with UHP standards (e.g., SEMI, SEMES) and local regulations. This role is critical to supporting cutting-edge semiconductor fabrication (FAB) processes. 【Job Description】 I. UHP System Design and Specification 1. Lead the design of UHP fluid delivery systems, including Chemical Dispense Systems (CDS), Waste Chemical Collection System (WCCS), Slurry Dispense Systems (SDS). 2. Focus on material selection to prevent contamination (e.g., PVDF, PTFE, PFA, specialized stainless steel) and maintain chemical purity (parts-per-trillion levels). 3. Develop detailed engineering packages, including UHP P&IDs, PFD, equipment layout plans, fluid mechanics calculations, and comprehensive specifications for specialized components (e.g., UHP valves, pumps, filters, analyzers, and drum/tote pumping systems). II. Process and Integration Excellence 1. Collaborate closely with Process Integration Engineers and Tool Owners to ensure chemical delivery systems meet the precise flow rates, pressure, temperature, and concentration requirements for advanced lithography, cleaning, etching, and CMP (Chemical-Mechanical Planarization) tools. 2. Define and implement effective contamination control protocols during design, construction, and startup (e.g., purging, rinsing, particle count verification). III. FAB Standards and Compliance 1. Ensure designs strictly comply with semiconductor industry standards, including SEMI, local fire codes (e.g., NFPA, IFC), and environmental regulations for highly corrosive, pyrophoric, or toxic materials. 2. Specify robust secondary containment and monitoring systems for life safety and environmental protection within the Sub-FAB and FAB cleanroom environments. IV. Project Execution and Commissioning 1. Oversee the fabrication, installation, and testing of UHP piping systems, utilizing knowledge of orbital welding, solvent bonding, and cleanliness verification techniques. 2. Develop and execute detailed Site Acceptance Test (SAT) and Functional Acceptance Test (FAT) protocols, including leak checking (e.g., helium leak testing) and particle testing. 3. Provide expert technical support during system start-up and ramp-up to guarantee stable chemical delivery.

【職務說明】 你將加入旺矽科技 AST（Advanced Semiconductor Test）事業群，參與高頻、高功率、矽光子與先進封裝測試平台的設計開發。團隊橫跨自動化探針台、晶圓測試載具、溫度控制模組與光機整合系統，是推動 AI、車用、5G/6G、CPO 測試解決方案的核心團隊。 【工作內容】 1.新產品規劃及新技術開發 2.機構模組設計 3.機台機電整合 4.機台客製化變更 【需求條件】 • 機械/機電/光機背景，熟 3D繪圖如SolidWorks • 具模組設計經驗，了解加工與裝配配合 • 對先進半導體測試應用有高度熱情者佳 【你將接觸】 • 尖端晶片測試需求（AI、車用、SiPh、mmW） • 多元技術領域：光機熱整合、精密載具、自動化模組 • 國際客戶合作與跨部門產品開發流程 https://www.youtube.com/channel/UCzy4pCa_OqlTMJz333PojIQ 工作地點：新竹縣竹北市中和街155號 【Job Title】 AST Mechanical Engineer | Precision Module Design × Advanced Wafer Test Platform Development ________________________________________ 【Job Description】 Join the Advanced Semiconductor Test (AST) division at MPI Corporation, where you’ll be part of a core team developing cutting-edge test platforms for high-frequency, high-power, silicon photonics, and advanced packaging applications. Our team specializes in automated probe stations, wafer test fixtures, thermal control modules, and opto-mechanical integration systems, enabling next-generation testing solutions for AI, automotive, 5G/6G, and CPO technologies. ________________________________________ 【Responsibilities】 1. New product planning and technology development 2. Mechanical module design 3. Mechatronic integration of test platforms 4. Customization and modification of equipment based on customer requirements ________________________________________ 【Requirements】 • Background in mechanical, mechatronics, or opto-mechanical engineering; proficiency in 3D CAD tools such as SolidWorks • Experience in module design with a strong understanding of machining and assembly fit • Passion for advanced semiconductor test applications is a strong plus ________________________________________ 【You Will Be Exposed To】 • Leading-edge IC testing applications (AI, automotive, SiPh, mmWave) • Multidisciplinary technologies: opto-mechanical-thermal integration, precision fixtures, automation modules • Cross-functional product development with international clients and internal teams Work Location: No. 155, Zhonghe Street, Zhubei City, Hsinchu County, Taiwan

1.印刷製程條件最佳化。 2.印刷樣品製作、生產參數訂定及產線品質異常排除。 3.製程作業標準訂定。 4.生產參數精進或提高生產效率降低成本。 5.新進設備測試、驗收及導入量產。

1.封裝製程開發與整合 2.製程異常分析及改善 3.標準化文件撰寫 4.封裝材料開發與應用評估 5.建立封裝材料、打線治工具的作業性評估與測試方法 6.專案工作的執行與導入

1.負責半導體設備機台電路設計與規劃。 2.繪製電路圖、配線圖及相關技術文件。 3.進行電控元件選型，如電源、馬達、Sensor、Relay、PLC 等。 4.協助機台配線、測試、調機及異常排除。 5.與機構、軟體及製造團隊合作，完成設備開發與改善

1.負責半導體設備機台電路設計與規劃 2.繪製電路圖、配線圖及相關技術文件 3.進行電控元件選型(如電源、馬達、Sensor、Relay、PlC..等) 4.協助機台配線、測試、調機及異常排除 5.與機構、軟體及製造團隊合作，完成設備開發與改善

1. 設備安全認證管理：負責全球安規認證（例如：SEMI S2/S8, UL 508A, CE-LVD/EMC）專案申請與維護。 2. 法規導入與設計審查：於研發階段提供設備法規諮詢，確保設計符合 SEMI 標準、NFPA 79 或 IEC 60204-1，並執行系統結構審查與風險評估（Risk Assessment）。 3. 技術文件編製與測試規劃：統籌編撰技術構造文件（TCF）、安全操作手冊及測試計畫（Test Plan），並針對關鍵零組件進行合規性確認。 4. 跨部門與外部窗口協調： (1) 協助研發單位解決防爆、漏液偵測及緊急電力中斷等設計合規問題。 (2) 對外：負責第三方驗證機構的技術窗口，主導現場審查（On-site Inspection）與測試失效排除。 5. 全球市場准入 (GMA) 與轉證：執行多國認證文件準備，例如：歐盟 CE/UKCA 宣告、美國 Field Evaluation 現場驗證等國。

1. 控制系統規劃及設計。 2. 程式撰寫(PLC、GP、圖控)。 3. 控制系統安裝、監造及測試工作。 4. 專案相關事項處理及後續維護工作。

1. 控制系統規劃及設計。 2. 程式撰寫(PLC、GP、圖控)。 3. 控制系統安裝、監造及測試工作。 4. 專案相關事項處理及後續維護工作。