轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

參與 5G/6G New Radio 行動通訊數位基頻 IC 與 IP 開發. 包括multi-RATs (2/3/4/5/6G) modem的架構設計, RTL 設計, 整合和驗證.

1. 4/5/6G modem Hardware platform IP and Subsys digital design and PPA optimization 2. Define hardware architecture of a digital IP/system: Include Clock, Bus (AXI/APB/NOC/…), Async design, high speed IF, new IP for sub-sys design topic 3. Subsys integration from RTL to gate level including timing closure and testability 4. Design methodology and integration flow improvement

Multi-RAT (6G/5G/4G/3G/2G) modem development. This is a common job description. You may involve at least one or more topics in the following: (1) architecture planning 1.1 Modem/SoC TOP system architecture 1.2 Modem/SoC CPU system design 1.3 Modem/SoC DSP system design 1.4 Modem/SoC BUS system design (2) digital circuit design and verification 2.1 baseband modules 2.2 digital front-end modules 2.3 RF/mixed-mode digital control modules 2.4 Computer/network system modules 2.5 High speed interface design (3) IP integration 3.1 Clock/reset, test modeand low power mode design 3.2 floorplan and synthesis development (4) Design methodology 4.1 design flow enhancement (low power/verification/etc) 4.2 chip MP quality control flow

1.RTL platform design integration (clock/reset/power/bus design and architecture, MBIST, etc.) - use for FPGA and Emulator should also be considered 2.Integration quality check (RTL/SDC/Power spec signoff check)

1.Propose design verification plan and do the execution based on IP and system HW architecture/application 2.Develop design verification environment 3.Develop required verification methodology and adopt into project 4.Develop HW emulator/FPGA platform to accelerate design verification task 5.Co-work with SW/HW engineering to valid function and shift-left SW develop 6.Debug and root cause failure with SW/HW engineering in both pre-silicon and post-silicon

1. Lead or support SoC architecture design, modeling, and technical feasibility studies across specific domains, including cellular modem, connectivity (Wi-Fi/Bluetooth/GNSS/UWB), performance, and power. 2. Lead or support SoC architecture development for smartphone, thin-modem, CPE/telematics, and gateway products, focusing on system performance and power considerations based on product requirements. 3. Lead or support technical feasibility studies of product requirements and collaborate with domain architects and product marketing teams to develop competitive product specifications.

1. 4/5/6G modem hardware architecture and digital circuit design task 2. Define hardware architecture of a digital IP/system 3. Include Clock, Bus (AXI/APB/NOC/…), Async design, high speed IF, new IP for sub-sys design topic 4. IP and Subsys digital design and PPA optimization 5. Subsys integration from RTL to gate level including timing closure and testability 6. Design methodology and integration flow improvement

1. Processor micro-architecture design 2. Cache and bus interface 3. DSP and machine learning library design 4. Simulator/modeling and architecture

北美電信商晶片認證 1.北美各電信商(ex: AT&T, Verizon, T-mobile) 的晶片認證所需的儀表, 基站, 實網等不同領域的驗證需求. 2.針對不同類型的客戶產品評估需求/風險, 提前規劃預測試協助客戶順利取得北美電信產品認 3.內部多專案與客戶專案並行時, 內部協調測試資源優化各專案進行度並避免客戶緊急問題延燒