轉職熱搜工作

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.

1.負責生產製造與機台效率管理應用系統之設計、開發及維運。 2.負責功能測試、效能調效與使用者問題追蹤與處理。 3.具專案規劃、專案執行、進度管理、主動解決問題以及良好的溝通協調等能力 4.協助研究新技術與應用軟體

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

1.化學氣體進行上機實驗及執行FTIR(氣相)檢測工作 2.孰悉化學氣體反應，操作特殊、高壓、易燃鋼瓶氣體 3.管理氣體鋼瓶及訂購 4.客戶端機台測試 及數據報告撰寫 5.工研院檢測數據驗算 6.廢液槽酸鹼調配 7.主管交辦事項 8.獨立主導產品檢測實驗，並分析危害與安全管理 9.全台據點的偶發性配合檢測 10.解決其他部門委託的化學相關問題

1. 半導體精密設備相關模組機構設計 2. 設備開發與製程、週邊介面整合設計研發 3. 機構設計與加工廠製造討論 4. 協助配合業者提出相關專案

1.新產品可行性評估 2.新產品設計及開發 3.樣品製作(進度追蹤/異常分析及改善/跨部門溝通協調) 4.新產能力地圖建立(可靠度/安全性/電性) 5.新產品導入試產及量產 6.客戶端品質問題處理

1. 電子電路設計，包含電路圖規劃與設計、Layout 佈局走線分析確認 2. 電子電路元件分析與選擇、並依據電路圖建立可製造生產的SOP文件 3. 使用示波器、電錶等相關儀器，驗證與測試電子電路 4. 嵌入式系統程式之軟、韌體測試驗證與開發 熟悉AI邊緣運算模組設計技術、系統級模組與系統級封裝設計技術者尤佳 我們需要對跨領域技術整合有熱忱的創新開拓者，學習快速的穩健成長型人才，更需要不怕失敗具科學家精神的勇者。歡迎有研發熱忱的應屆畢業生或上班族，加入我們的行列！

1. 實驗室設備系統維運 2. 熟悉塗佈/曝光黃光設備、PVD/CVD 鍍膜設備、乾/濕式蝕刻設備 3. 配合計畫需求運作維護，改善既有設備缺陷 4. 實驗室環境建置、改善規劃與執行最佳化 5. 設備系統運作、能耗分析與節電方案執行確效

本職缺強力類比晶片人才，工作內容如下說明，具備任一領域專長者即歡迎投遞履歷 1. 影像感測器讀出電路 2. ADC/DAC混模晶片設計 3. 仿生與混和信號運算系統晶片 4. 感測晶片設計 5. 電源晶片設計 6. PLL、SerDes晶片設計

1. 保養日常設備，維持設備正常運作。 2. 控制設備稼動率、增加生產量並維持產能狀況。 3. 判斷設備異常的原因，並排除問題。 1. Perform routine maintenance on equipment to ensure normal operation. 2. Control equipment utilization rate, increase production output, and maintain production capacity. 3. Identify the causes of equipment abnormalities and troubleshoot issues. 4. Must have degrees in Mechanical Engineering, Electrical Engineering and Electronics Engineering or have relate working experiences in those areas.