轉職熱搜工作

1. 高/低速訊號完整性測試計畫 2. 訊號問題分析 3. 客戶溝通 4. 訊號量測技術研究與導入 1. High/Low speed signal validation 2. System HW validaion 3. High speed bus length review 4. System margin test 5. PCB impedance/insertion loss test

Job Summary/Key Responsibilities . To design, develop, and integrate diagnostic software solutions for servers, storage, and AI accelerator platforms, enabling automated testing and efficient issue resolution in collaboration with hardware and firmware teams. · Design and implement diagnostic software for hardware platforms. · Develop automation tools and scripts for testing and validation. · Integrate diagnostics with production and lab environments. · Troubleshoot hardware and software issues with cross-functional teams. · Document diagnostic procedures, tools, and technical guides. · Evaluate and adopt new tools or technologies to enhance diagnostics.

1.測試軟體與Web平台開發 開發與維護測試平台，包含負責開發測試程式及Web操作介面. 2.伺服器測試及功能開發 開發伺服器功能測試程式，並進行整合測試與效能調試。 3.軟體部署與測試環境管理規劃 規劃與建置部署流程，並負責測試環境的配置與維護，確保測試軟體平台的一致性與自動化發布.

Description: You will play a key role in specifying, designing, developing, validating and releasing key functional test stations for factory Mass Production use. Partition tests across module, sub-assembly, and system level that is optimized for cycle time, yield, cost, and risk. Responsibilities: Designing, developing instrumentation hardware, software & firmware platforms required to test and calibrate product key functional modules Prototyping, bring-up, debug and characterization of instruments for AR/VR products Preparing and delivering tester’s technical documentations and presentations Establish acceptance criteria, guard-bands, and GR&R plans; drive DFT/DFM/DFX with design teams Vendor liaison, including supporting instrumentation bring up and qualification that meet project timelines

1.Develop and maintain BMC firmware for AI servers, including OpenBMC platform bring-up and feature development (embedded Linux experience acceptable if no prior OpenBMC exposure). 2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 5.Integrate Secure Boot / TPM / SPDM security frameworks. 6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 7.Prepare design documents, test plans, mass production support materials, and debug reports.

1.依產品軟硬體設計及客戶需求，開發並維護測試程式。 2.規劃並建置產線之測試環境。 3.協助產品測試生產與問題排除。 4.與客戶合作開發新功能與架構。

1.光學模組(QSFP/QSFP-DD/OSFP)韌體開發 2.光學模組測試機台自動化設備軟體撰寫 3.光學模組相關測試工具軟體開發 4.辦公室IT設備維護

1.負責 N客戶 CPO/NPO 交換機的 CM 軟體維護，並支援 NPI（新產品導入）流程。 2.負責網通機架系統整合，包含線材佈線的視覺化設計以及相關的 NPI 驗證作業。 3.負責 ODM 交換機／伺服器之 BMC 與 Diagnostics 軟體的設計與開發。 協助與支援 CPO/NPO 專案之執行與推進。 4.熟悉 BMC OpenBMC 或 AMI SP-X 軟體開發者尤佳。 5.熟悉嵌入式系統平台開發者尤佳。 6.需配合工作需求進行海外出差（出差地點以越南河內為主）。

1.參與伺服器平台軟體與韌體功能之開發與維護，包含系統設計、實作與驗證。 2.分析伺服器硬體架構與線路設計，掌握系統運作原理與軟硬體整合方式。 3.開發與實作各式硬體介面與通訊協定（如 I²C、SPI、UART、PCIe 等），確保系統穩定運作。 4.於 Linux 或嵌入式環境中進行開發、除錯與效能優化，熟悉版本控制與自動化流程。 5.撰寫並維護技術文件，確保軟韌體設計具可追蹤性與可維護性。 6.與跨部門團隊（硬體、測試、工廠製造等）協作，推進專案開發進度與功能整合。 7.協助工廠端進行問題分析與除錯，支援產品導入與量產穩定性改善。