轉職熱搜工作

《DBS. Asia’s Best Bank》 and now the 《World’s Best Digital Bank》 → https://www.dbs.com/livemore/worlds-best-digital-bank.html Business Function Group Technology and Operations (T&O) enables and empowers the bank with an efficient, nimble and resilient infrastructure through a strategic focus on productivity, quality & control, technology, people capability and innovation. In Group T&O, we manage the majority of the Bank‘s operational processes and inspire to delight our business partners through our multiple banking delivery channels. Responsibilities: 1. Manage and deliver collaborative services both for BAU and project, scope covers entire end user services in TW (End points, Printer services, VC, etc.). 2. Ensure the infrastructure service align with DBS policy and regulatory requirement. 3. Familiar with Microsoft Windows client / Office 365 / Mobile Services and MS Patch/Software deployment 4. Troubleshoot and rescue during failure. 5. Collaborate as a team player with stakeholders to clarify and prioritize requirements, working closely with both regional and local teams to facilitate the development, testing, and implementation. Requirements: 1. Five years of working experience in IT operations and support. 2. Project management experience in client service. 3. Strong analytical and problem-solving skills. 4. Microsoft MSCE/MCITP is a plus. 5. Fluent in written and spoken English.

1、車用MCU韌體開發 2、車用CAN/LIN/Ethernet開發及驗證 3、系統整合測試及效能驗證 4、工廠試產問題排除與量產導入 5、協助強制性法規認證測試 6、與硬體工程團隊合作進行專案開發及問題解決

一、具自動化控制設計、塑膠射出成型經驗者優。 二、產業機械設計或機電整合，熟應用solidworks者。 三、具機械識圖能力、伺服控制與理論計算，空、油壓基本槪念，有相關機械設計經驗者尤佳。 四、繪圖及承接製令單工作。

1.負責各類機電施工圖繪製，並協助各施工所完成圖面之送審。 2.負責以BIM建模軟體(例：Revit)建置機電模型，檢討碰撞及修改，完成送審作業。

1. 繪製機械零件製圖、組裝圖及建立BOM表 2. 熟悉板金展開與原理 3. 熟悉CAD軟體如：AutoCAD, SolidWorks 4. 熟悉CREO elements/direct (加分) 5. 現場作業人員進行圖面製作說明討論 6. 主管交辦事項。

BMC(Baseboard Management Controller基板管理控制器). Firmware supported on worldwide tier one customer projects of Clouding & Enterprise server. 1. 伺服器BMC韌體設計開發 2. 既有專案維護 3. 跨單位技術上的溝通探討 4. 了解客戶需求與熟悉產品規格

1. RF高頻電路設計、PCB Layout Design 2. 行動通訊模組、車用Wi-Fi模組設計與開發 3. 3GPP產品測試驗證報告與技術文件撰寫 4. RF特性能驗證與系統整合測試 5. 協助客戶產品設計及工廠試產問題排除與量產導入 6. 須與軟體工程團隊合作進行專案開發