轉職熱搜工作

1、負責機構部分的設計、開發、製作和測試 2、圖面、料號、BOM表整理 3、繪製2D/3D圖面AutoCAD (2D)、Inventor (3D) SolidEdge 繪圖軟體的操作； 4、機構問題診斷分析與改善。 5.、設備機構評估規劃、設計繪圖、升級改造 6、.製作操作校正說明書 7、其他相關協辦工作。 8、須配合不定期出差業務。(一年次數約0-5次)

1.無人機系統設計與分析 2.無人機系統測試驗證 3.設計與開發無人機測試平台 4.參與無人全機/次系統之組裝與線路配置 5.專案進度管制與行政事項協調 6.合作廠商聯繫及配合公司需要之差旅 7.長官臨時交辦事項

oscillator & TCXO 1. 製程技術模組開發。 2. 石英晶片與石英晶體相關新產品、新技術開發驗證及量產導入。 3. 樣品試作及相關工程實驗評估。 4. 新產品量產參數驗證及導入。 5. 回路調查(FAE ).

1. USB4 Controller Development 2. Short term =＞ Improve current design quality of USB4 controller 3. Long term =＞ Next gen USB4 controller architecture define and implementation

1. Package design and planning of various product. 2. Design & layout of BGA substrate. 3. Co-work with package houses for package design 4. Development of advanced package technology. 5. Package design platform development.

• Work with the architecture/micro-architecture/design teams to do white box testing. • Create testplans based on the micro-architecture document with the design team. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Build custom BFMs for co-sim based module level verification. • Add assertions and checkers to facilitate verification. • Work with the design team to do module level formal verification. • Create controlled random testcases. Pre-debug and provide debug reports. • Check functional coverage and code coverage.

1. Work on 7nm~3nm physical design implementation, methodology, and sign-off 2. Perform floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution