轉職熱搜工作

1. Perform pre-silicon and post-silicon correlation and modeling related to adaptive voltage scaling and on-die sensor 2. Develop and improve post-silicon testing methodologies related to adaptive voltage scaling and on-die sensor

• Lead the DV effort of a high-end CPU project. • Manage, coach and guide DV engineers. Follow up status and keep up the schedule. • Architect and implement top-module testbenches and their components using UVM-based methods. • Lead the effort of building in-house BFMs to facilitate co-sim based module level verification. • Architect and implement formal verification based module level testbench. • Work with the design team to create testplans. Implement checkers/assertions/coverage check points. • Work with validation folks to improve design visibility

1. 智慧型手機系統記憶體與儲存: DRAM (LPDDR4, LPDDR5, LPDDR6...) / Storage (UFS, eMMC...)驗証 2. 系統驗証方法研究與開發 3. 規畫驗証計畫 (test plan, test case) 4. 自動化測試環境開發

We are looking for a highly experienced PISI Technical Leader to join our team. The ideal candidate will have extensive experience in Power Integrity and Signal Integrity, with a strong background in high-speed IO interface simulations and PDN analysis. As a PISI Technical Leader, you will guide customers through Signal Integrity and Power Integrity signoff, model and optimize system components, and collaborate with various teams to ensure optimal package, PCB, die, interposer, and substrate designs. 1. Guide customers to complete Signal Integrity and Power Integrity signoff. 2. Model and optimize vias, connectors, sockets, breakouts, and various system components using commercial tools. 3. Perform system-level signal integrity simulation in high-speed IOs such as PCIe, SerDes 4. Architect and simulate power delivery systems, including multiple dies, substrate, interposer, PCBs, and on-die PDN models. 5. Collaborate with multiple teams, including layout, design, and customers, to optimize package, PCB, die, interposer, and substrate designs.

• SoC FPGA/ASIC 驗證和驅動程式開發 • 在Windows和UEFI平台上進行SoC SDK平台開發 • 在ARM平台上進行Windows系統分析和性能改進

參與電源產品(UPS, Inverter, Charger)開發設計，職缺包含 - 硬體線路設計 - 編寫韌體程式 - 結構包裝設計 - 熱模擬分析 電源產品功能測試驗證 新零件或新架構評估導入

1.配合客戶前端設計，根據性能要求分析，提出解決方案 2.跨部門溝通推動專案執行、管理 3.新產品設計開發 4.人員管理 5.領導團隊滿足客戶需求及公司目標