轉職熱搜工作
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Application Specialist (新竹)
面議(經常性薪資達4萬元或以上) 新竹市 3~4年工作經驗o Supply/sustain on-site OCD / XPS / Raman / SIMS metrology solution support multiple modules, i.e., Litho/CMP/Etch/Dep. o Communicate and establish good relationship with customers for process & issue understanding. o Involve up-to-date new metrology technics / products / applications and perform pre-sales demo / presentations to customers. o Co-work with HQ or other subsidiaries (i.e., IL/US/CN/JP/SG) to develop new application solutions, able to support / work abroad. o Pro-actively maintain semiconductor knowledge from industry and international academic conferences. o Be highly sensitive in collecting market information. o Own presales activities for tools adoption/utilization. o Be flexible to cross-divisional activities per company’s requirements. if you are interested of this position please send your CV of below link: https://www.novami.com/comeetitem/3984c/展開 5日回覆 -
IT Front-End Developer
面議(經常性薪資達4萬元或以上) 40000元 新竹市 3~4年工作經驗【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=449&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC IT is looking for a Front-End Web Developer with experience in front-end and client development to take our products to the next level. You’ll be part of a highly collaborative, cross-functional Agile squad consisting of Front-end and Back-end Engineers, UI/UX Designers, and Product Managers. In this role, you will play a key part in bridging the gap between design and technical implementation. Key Responsibilities: 1. Build and maintain a unified, reusable UI component library to ensure consistency and scalability across all products. 2. Work closely with UI/UX designers, product managers, and senior engineers to translate design concepts into friendly, high-quality user experiences. 3. Partner with back-end engineers to architect, develop, and implement the best technical solutions. 4. Continuously optimize applications for maximum speed, responsiveness, and compatibility across various platforms and devices. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【中科大雅】設備技術經理
面議(經常性薪資達4萬元或以上) 40000元 台中市大雅區 6~7年工作經驗1.專案review與進度管理 2.新設備導入/標準攻堅/設備能力提昇-專案管理與跨功能單位活動整合 3.新設備導入專案(新技術/UPH)- 專案管理與跨功能單位活動整合展開 -
2027 台積電預辦登積計畫 2027 TSMC RDSS & AO Program
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22573&source=1111&tags=AO+2027_1111 因為期待無限可能,所以選擇台積電! 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境,並提供高於業界平均水準的薪酬與福利。加入台積電,您將有機會與世界一流的卓越夥伴共事,透過最先進的製程技術,共同成就改變世界的偉大事業。每一項突破與創新,都凝聚了我們的努力與心血。 2027年台積電預辦登積計畫:招募2027年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您,透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會!參與2027年預聘暨研發替代役熱門職缺,您將可: ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日:2026/10/31 如您對此計畫感興趣,台積電將前往校園辦理徵才活動;活動當天安排畢業校友與同學們互動交流,機會難得,敬請把握。 此外,為同學安排了校園實體與線上說明會,歡迎踴躍報名參加,以便了解公司市場趨勢、組織概況,並掌握求職技巧! 報名連結請參考官網 建議您根據學習領域與專業,投遞申請以下2~4個職位。符合主管需求者,將會收到面談邀請通知。 ▋歡迎志同道合的你,一起加入台積電 ▋世界上的每一個夢,都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you‘ll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2027 TSMC RDSS&AO Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Please refer to the career website Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below. ▋2027 台積電預辦登積計畫熱門職缺 2027 TSMC RDSS&AO Recruitment Hot Jobs : (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Advanced Packaging Technology Development (APTD) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 E-Beam Operation Engineer (EBO) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management (MM) 3-4 Human Resources (HR)展開 -
身心障礙人才招募專區
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19387&source=1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務,生產12,682 種不同產品,被廣泛地運用在各種終端市場,例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台灣積體電路製造股份有限公司(台積公司)致力於打造友善且包容的工作環境,並積極維護身心障礙者的就業權益。依據《身心障礙者權益保障法》,我們特別規劃了身心障礙人才專區,竭誠歡迎持有有效身心障礙手冊或證明的您加入台積公司,與我們攜手共創科技的未來! 若您目前尚未找到合適的職缺,我們邀請您先行登錄身心障礙人才招募專區。 我們的招募團隊將細心審閱您投遞的履歷,若您的資歷符合我們正在招募的正職、約聘或實習生等職缺需求,我們將儘快與您聯繫。 此外,若您對以下職缺有興趣,亦歡迎您到實際的官網職缺投遞。若您的條件符合招募需求,我們將盡快與您聯絡! R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D)-身心障礙人才招募 1-2 Design and Technology Platform Engineer (DTP)-身心障礙人才招募 1-3 Specialty Engineer (Specialty)-身心障礙人才招募 1-4 研發製程中心-工程技術員-身心障礙人才招募 Operations (營運組織) 2-1 Process Integration Engineer (PIE)-身心障礙人才招募 2-2 Process Engineer (PE)-身心障礙人才招募 2-3 Equipment Engineer (EQ)-身心障礙人才招募 2-4 Intelligent Manufacturing Engineer (IMC/MFG)-身心障礙人才招募 2-5 Facility Engineer (FAC)-身心障礙人才招募 2-6 Product Engineer (PE)-身心障礙人才招募 2-7 Advanced Packaging Technology and Service Engineer (APTS)-身心障礙人才招募 2-8 Quality & Reliability Engineer (Q&R)-身心障礙人才招募 2-9 Module Associate Engineer (MAE)-身心障礙人才招募 2-10 技術員-身心障礙人才招募 Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT)-身心障礙人才招募 3-2 Corporate Planning Organization (CPO)-身心障礙人才招募 3-3 Materials Management Engineer (MM)-身心障礙人才招募 3-4 Human Resources Specialist (HR)-身心障礙人才招募 3-5 Finance Associate (FIN)-身心障礙人才招募 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。展開 -
【校園徵才】-身心障礙人才招募專區
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19388&source=1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務,生產12,682 種不同產品,被廣泛地運用在各種終端市場,例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台灣積體電路製造股份有限公司(台積公司)致力於打造友善且包容的工作環境,並積極維護身心障礙者的就業權益。依據《身心障礙者權益保障法》,我們特別規劃了身心障礙人才專區,竭誠歡迎持有有效身心障礙手冊或證明的您加入台積公司,與我們攜手共創科技的未來! 台積電 2026 秋季校園徵才說明會:Accessibility專場徵才《線上說明會》 📌時程 • 活動時間:10/14 (三) 12:15-13:15 • 進行方式:Teams線上會議 (活動前通知活動線上連結) • 線上講座內容:認識台積、職缺介紹、員工福利、履歷填寫技巧分享、問題交流 • 活動報名:https://careers.tsmc.com/su/52db228203c6c471 若您目前尚未找到合適的職缺,我們邀請您先行登錄身心障礙人才招募專區。 我們的招募團隊將細心審閱您投遞的履歷,若您的資歷符合我們正在招募的正職、約聘或實習生等職缺需求,我們將儘快與您聯繫。 此外,若您對以下職缺有興趣,亦歡迎您主動去官網看每個職缺並申請。若您的條件符合招募需求,我們將盡快與您聯絡! R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D)-身心障礙人才招募 1-2 Design and Technology Platform Engineer (DTP)-身心障礙人才招募 1-3 Specialty Engineer (Specialty)-身心障礙人才招募 1-4 研發製程中心-工程技術員-身心障礙人才招募 Operations (營運組織) 2-1 Process Integration Engineer (PIE)-身心障礙人才招募 2-2 Process Engineer (PE)-身心障礙人才招募 2-3 Equipment Engineer (EQ)-身心障礙人才招募 2-4 Intelligent Manufacturing Engineer (IMC/MFG)-身心障礙人才招募 2-5 Facility Engineer (FAC)-身心障礙人才招募 2-6 Product Engineer (PE)-身心障礙人才招募 2-7 Advanced Packaging Technology and Service Engineer (APTS)-身心障礙人才招募 2-8 Quality & Reliability Engineer (Q&R)-身心障礙人才招募 2-9 Module Associate Engineer (MAE)-身心障礙人才招募 2-10 技術員-身心障礙人才招募 Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT)-身心障礙人才招募 3-2 Corporate Planning Organization (CPO)-身心障礙人才招募 3-3 Materials Management Engineer (MM)-身心障礙人才招募 3-4 Human Resources Specialist (HR)-身心障礙人才招募 3-5 Finance Associate (FIN)-身心障礙人才招募 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。展開 -
Specialty Technology Module R&D Engineer_台南
面議(經常性薪資達4萬元或以上) 40000元 台南市善化區 1~2年工作經驗【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=392&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC. Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. Responsibilities: 1. R&D Process Engineer (Etch) (1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products. (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements. 2. R&D Process Engineer (1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module. (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. (3) Maintain processes POR and SPC control. 3. R&D Integration Engineer (1) Responsible for lot handling and process flow setup. (2) Process flow optimization to improve WAT or yield performance. (3) Need support holiday on-duty. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Materials Management (MM)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22588&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Buyer & Planner Job Title:Global Procurement and Supply Planning Professionals (1) Develop and manage world class supplier partnerships with leading sourcing, procurement, supply chain management solutions and deliver continuous improvements in business results, quality, cost, delivery, service and sustainability toward reliable and cost-effective supply chain. (2) Develop procurement strategies and enhance/execute collaborations across diverse suppliers, groups and stakeholders while optimizing the solution for TSMC. (3) Conduct demand forecasting and supply planning to ensure requirements are fulfilled. (4) Manage suppliers to ensure reliable delivery and replenishment. (5) Lead/coordinate cross functional enhancement project(s) for supply chain excellence. You are welcome to apply for the current job openings listed below: A. Global Procurement and Sourcing Professionals - Equipment and Parts/Accessory, General Affairs, Indirect Materials, Facility and Automation, IT. B. Global Supply Planning Professionals - Materials and Parts 2. Logistics Management (LWM & IEB) Job Title:Global Logistics Digital Transformation Engineer (1) Reinforce concrete domain knowledge through daily operations, such as shipment handling and logistics provider management, and review existing processes to identify areas for improvement to achieve excellence in the logistics model. (2) Assist in the development of new fit-for-purpose digital solutions to improve operational efficiency and develop a global logistics network with local regulatory compliance solutions. (3) Lead cross-functional team members to innovate logistics and warehouse processes using leading-edge technology (e.g., ASRS, AGV, robots, B2B data flow, and RPA). (4) Lead team members and implement training programs to develop specialists in global transportation and supply chain management logistics. (5) Lead or coordinate cross-functional enhancement projects for excellence in the logistics model. Please refer to TSMC ESG Spotlight 3. Green Supply Chain (ESG/Auditor) Job Title:Responsible Supply Chain Management Engineer (1) 2+ years of working experience in related fields. (2) Master’s degree or above in Environmental Studies, Economics, Sustainability, Engineering (Civil, Electrical, Mechanical, or General) or related field. (3) Fluent in spoken and written languages skills for both Chinese and English. (4) Strong negotiation skills and ability to lead cross functional projects. (5) Strong understanding of greenhouse gas emissions accounting or reporting standards (e.g., GHG Protocol, SBT, RE100), and experience with corporate Scope 3 reporting and management. (6) Capable of managing large data sets is a plus. You are welcome to apply for the current job openings listed below: A. Logistics Transportation Digital Transformation Engineer B. Supply Chain Logistic Management Engineer Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Corporate Planning Organization (CPO)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22587&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency, and reach profit maximization. 2. We drive for business effectiveness to bring the world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. We seek individuals who meet the following criteria: 1. Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. 2. Have skills in logical thinking and communication, learning agility, and business acumen. The following are detailed job descriptions: 1. Account PC Planner (1) Provide delivery schedule and logistic services to key customer. (2) Coordinate the internal planning team including planning team and backend for delivery. (3) Manage logistic service-related projects and Hub. 2. Fab Production Control Planner (1) Production control related systems initiate/ analyze. (2) Production control related data maintenance. (3) Project management. (4) Mask CLIP setting and delivery management. (5) Co-work with EBO/FPC/APC/Fab for mask support plan. 3. Fab Rationalization Engineer (1) Demand to supply rationalization, maximize capacity utilization. (2) Analyze product and new tape out portfolio for fab utilization effectiveness. (3) Provide FR proposals to optimize fab loading and customer‘s requirements. (4) Synergize demand planning and fab rationalization to maximize fab operational effectiveness and demand support. 4. Operation Resources Planning Engineer (1) Capacity planning and management. (2) Productivity improvement. (3) Capital investment evaluation and control. (4) Fab space layout planning. 5. DevOps Engineer (1) Collaborate with Users, Analyst and Architect on business needs and translate requirements into technical needs. (2) Identify and understand the data sources that are relevant for analysis. (3) Become a subject domain expert in company data especially for corporate planning. (4) Consolidate the requirements and use data engineering skills to design a robust DataMart. (5) Participate in design, architecture review and deployment of planning system and data warehouse solutions. (6) Design for automation and monitoring mechanism in a continuous integration environment. (7) Bring new technology with POC to solve existing business challenges. 6. ML/AI Engineer (1) Research and evaluate pioneering ML/DL/LLM methodologies to address business challenges. (2) Collaborate with engineering teams to conduct data exploration and build data pipelines. (3) Analyze and extract valuable information from vast amount of market data. (4) Implement prototypes and present results to stakeholders. 7. Corporate Planning Associate The CPO Associate Program is designed for young talent eager to accelerate their growth and define the future of TSMC. As an Associate, you will rotate through a variety of roles in your first year to gain broad exposure to TSMC’s Corporate Planning Organization (CPO). The rotation may cover several of the following divisions: operations resource planning, production planning, business operations, advanced packaging supply chain solutions, integrated and intelligent planning, and AI4BI. After successfully completing the rotation program, you will be placed in a role that matches your interests while meeting business needs. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開 -
【2027 TSMC RDSS & AO】Advanced Packaging Technology Development (APTD)
面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22577&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the APTD (Advanced Packaging Technology Development) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, COUPE and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, COUPE and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Wet/Etch/Polymer/Bonding/Thinning/Joint/Saw/Trim/Material module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.展開
