轉職熱搜工作

1、規劃及完成客戶或需求單位的實驗測試需求。 2、制定實驗室部門人力及技術計畫和執行日常運作管理。 3、督導下屬測試進展，協調平行相關部門工作職務。 4、根據測試進展及下屬之處理事務的能力，進行管理、培育、考核。 5、針對實驗室測試需求及結果，進行技術審核，建議。 6、其他上級主管交辦事項。

1. 新產品開發 2. 設計變更及產品驗證 3. 樣品製作安排及測試 4. 第二供應商導入及材料承認作業 5. 檢驗項目訂定及手法文件化 6. 競品分析 7. 既有產品的設計開發文件檔案(含各項計畫及報告)維護 8. 產品面在客端技術問題處理 9. 文獻及新知分享 10. 主管交辦、部門協辦及其他事項

1.各產銷協調與需求管理。 2.生產計畫與排程管理。 3.ERP與其他電子系統作業。 4.製令開立與進度控管。 5.產能規劃與負荷分析。 6.採購事務處理：處理採購相關作業（採購單、交期追蹤） 職位價值敘述: 1. 保產銷協調順暢與交期達成。 2. 掌握供應商交期與進料狀況，確保生產作業穩定不中斷。 3. 即時追蹤生產進度與物料狀況，快速應對異常並調整排程。 4. 建立合理安全庫存機制。

職責要求 1.辦理電力系統相關工程技術，需熟悉電驛保護協調、電力相關標準，並執行型態管理，以確保設備設計功能正常、維持營運安全。 2.協辦電力系統升級、置換等相關工程之技術研擬及現場管理作業，包含招標及技術文件撰稿、現勘、監工、測試、點移交作業等。 3.系統性設備異常營運與維修技術支援，需與採購、設備介面單位及契約承商等協作，執行專案工程履約管理作業，確保工程契約符合安全準則。 4.協助評量施工與測試作業風險，規範風險減輕需求。 5.分責承辦部門工程合約之設計審查、意見彙整與澄清、介面與排程協調、施工與測試監察進度管控與彙報等合約執行作業項目。 6.依公司政策，辦理與其他機關單位之技術協助與相關業務。 任職資格 1.大學以上，電機電子工程相關系所，英文中上可溝通及閱讀英文文件 2.具高考電機工程技師尤佳 3.熟悉工程專案管理作業與一般採購合約流程與管理 4.熟悉軌道供電系統相關子系統包括：變電系統、輸電系統、電力監控系統、配電系統及道旁機電系統等

職責要求 •Design and debug PLL/DLL architectures and circuits (integer/fractional-N; analog or digital-assisted). •Oscillators: LC or ring-oscillator (RO) VCO/DCO, frequency synthesis, phase noise/jitter analysis and budgeting. •Delay lines, measurement/ruler circuitry, phase interpolators, and calibration/trim techniques. •DCC/DCM/DCA, clock tree/distribution, and clock management units; low-jitter clock generation and distribution networks. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Behavioral modeling (e.g., Verilog-A/SystemVerilog) to explore loop dynamics, spur/jitter mitigation and system interactions. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Design TX/RX, analog front-end, serializers/deserializers, high-speed level shifters, predrivers/drivers, and termination/impedance calibration blocks. •Equalization: Feed-Forward Equalization (FFE), DFE, CTLE and related adaptation/control loops. •Clocking support for links (e.g., CDR interactions, low-jitter clock generation/distribution as needed by PHY). •SI analysis and creation/validation of IBIS/IBIS-AMI models; channel characterization (insertion loss, return loss, crosstalk) and eye diagram margin assessment. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Support interface integration and sign-off: PPA optimization, reliability checks (e.g., EM/IR, aging/overstress), and timing closure collaboration. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Reference generation: bandgap, bias circuits, reference voltages/currents; high-accuracy, low-noise design techniques. •Low offset / low-noise voltage regulators (LDO) and stability/compensation networks; PSRR and transient response optimization. •Voltage and power monitoring circuits: droop detection, voltage detectors, PowerGood and POR generation, analog sensing, and housekeeping blocks. •Power-management components, linear and/or switching-adjacent blocks, charge pumps, as applicable to the SoC/PHY environment. •Design/support ADC/DAC blocks and associated analog support circuits (sampling, references, amplifiers/comparators, clocking). •Voltage and temperature sensor design and characterization. Bandgap and PTAT-based temperature sensing; process corner detection circuits. Sensor readout, digitization, and calibration techniques. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Design high-speed TX/RX analog buffer circuits for LPDDR6 memory interfaces, including output drivers, input receivers, level shifters, termination, impedance calibration, biasing, and reference circuits. •Define and implement programmable drive strength, slew-rate control, and on-die termination schemes to meet LPDDR6 electrical and timing requirements. •Translate system and interface specifications into detailed transistor-level circuit architectures and design specifications. •Own end-to-end block/IP delivery, including architecture studies, schematic design, pre-layout simulation, post-layout extraction, and sign-off. •Build and maintain verification test benches; validate performance across PVT corners, mismatch/Monte Carlo, aging, and post-extraction parasitics. •Analyze high-speed performance metrics such as eye margin, jitter, timing skew, voltage noise sensitivity, and simultaneous switching effects. •Work closely with layout engineers to provide floorplanning guidance, review critical layouts, and ensure robust matching, isolation, and parasitic control. •Support interface integration and sign-off, including power, performance, area (PPA) optimization and reliability checks (e.g., EM/IR, overstress, aging). •Support testchip and product silicon bring-up, characterization, and correlation with simulation results; drive root-cause analysis and ECOs as needed. •Collaborate effectively with digital design, verification, layout, package, SI/PI, product, and test teams. 任職資格 •BS or MS in Electrical/Electronics Engineering or related field. •Typically 5+ years of relevant experience in analog/mixed-signal IC design, with emphasis on high-speed I/O or memory interface circuits. •Strong fundamentals in CMOS device operation, analog circuit design, feedback and stability, noise/jitter analysis, and deep-submicron effects. •Hands-on experience designing high-speed TX/RX buffers, termination and impedance calibration circuits, and voltage-domain level shifters. •Proficiency with industry-standard design tools, typically including Cadence Virtuoso, Spectre/ADE or HSPICE, and post-layout extraction flows. •Ability to clearly communicate design intent, document trade-offs, and drive results in a cross-functional environment. •Basic written English proficiency required. Candidates must be able to read and write emails in simple English to communicate effectively with non-Mandarin-speaking colleagues. Preferred / Nice-to-Have Experience •Experience with memory or high-speed interface protocols such as LPDDR, DDR, HBM, or similar interfaces. •Experience with post-layout sign-off, EM/IR analysis, and reliability-aware analog design. •Familiarity with signal integrity concepts, channel effects, and interaction between I/O circuits and package/channel parasitics. •Experience supporting silicon validation, ATE characterization, and simulation-to-silicon correlation. •Scripting or automation experience using Python, SKILL, Verilog-A, or similar for simulation regression and result analysis.

1.建立軟硬體整合產品的測試計畫與驗收標準，涵蓋功能、效能、穩定性、安全性等面向 2.撰寫並執行測試案例（Test Cases），涵蓋 嵌入式系統、AI 軟體與平台整合之軟硬體功能驗證 3.搭建測試環境，包含設備、網路架構、嵌入式系統 4.分析測試結果，記錄與追蹤問題 (Issue tracking)，與開發團隊協作進行 Debug 5.協助建立自動化測試流程（如 CI/CD Pipeline 測試） 6.主管交辦事項

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