轉職熱搜工作
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<Data center>數位IC整合技術經理_新竹/台北
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 8~9年工作經驗1. SoC IC implementation 規劃設計 2. DFT 規劃設計 以及timing closure signoff 3. 設計方法流程開發及優化 4. 工作地點:新竹/台北展開 -
SoC Debug System IC Designer
面議(經常性薪資達4萬元或以上) 40000元 台北市內湖區 工作經歷不拘1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. BUS topology and debug mechanism circuit design 5. Support SoC debug flow and issue localization 6. Collaborate with cross-functional teams to optimize debug performance 7. Documentation and test specification for SoC debug features展開 -
<Automotive>SOC clock architect
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗1. Develop scalable platform clocking architecture for automotive SoC 2. Enhance SoC clock architecture and technology development to address the automotive SoC requirements 3. Drive clock architecture and designs to optimize power, performance, and implementation, including physical design and timing closure展開 -
Senior DV engineer (micro-processor)
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗• Work with the architecture/micro-architecture/design teams to do white box testing. • Create testplans based on the micro-architecture document with the design team. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Build custom BFMs for co-sim based module level verification. • Add assertions and checkers to facilitate verification. • Work with the design team to do module level formal verification. • Create controlled random testcases. Pre-debug and provide debug reports. • Check functional coverage and code coverage.展開 -
資深工程師_ChuPei
面議(經常性薪資達4萬元或以上) 40000元 新竹縣竹北市 2~3年工作經驗1. Work on 7nm~3nm physical design implementation, methodology, and sign-off 2. Perform floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution展開 -
RF IC design engineer
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 工作經歷不拘The candidate will design, supervise layout, help characterize transceiver front-end circuits for WiFi and Bluetooth production.展開 -
<Automotive>Functional Safety Architect
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 7~8年工作經驗1. Interpret customers’ functional safety requirements into SoC requirements 2. Define the SoC level architectures to meet functional safety requirements 3. Communicate and coordinate safety designs with cross-function IP teams 4. Perform system safety analysis (ex: FMEDA)展開 -
<Automotive>SoC Chip Design Engineer for DFT/DFM
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 3~4年工作經驗We are seeking a highly skilled DFT/DFM Engineer to join our automotive ADAS SoC chip design team. The successful candidate will be responsible for DFT and DFM methodologies, design, and implementation for our advanced automotive system-on-chip (SoC) designs. The candidate will also collaborate with the design and layout teams to integrate DFT/DFM requirements. • SoC testing architecture design • Support project NPI(new product introduction) to MP(mass production) (test program development, coverage enhancement, yield improvement, cost reduction) • Cowork w/ IP, test engineer, process team, board design to fulfill CP/FT/SLT test requirement.展開 -
<Automotive>車用網絡安全漏洞分析認證工程師
面議(經常性薪資達4萬元或以上) 40000元 新竹縣竹北市 4~5年工作經驗解讀客戶的網絡安全需求 從網絡安全需求中推導出功能和安全概念 制定和審查安全系統架構 與 IP 團隊和客戶溝通和協調安全設計 執行系統安全分析(例如:TARA)展開 -
<Data center>Senior Signal and Power Integrity Engineer
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 8~9年工作經驗We are looking for a highly experienced PISI Technical Leader to join our team. The ideal candidate will have extensive experience in Power Integrity and Signal Integrity, with a strong background in high-speed IO interface simulations and PDN analysis. As a PISI Technical Leader, you will guide customers through Signal Integrity and Power Integrity signoff, model and optimize system components, and collaborate with various teams to ensure optimal package, PCB, die, interposer, and substrate designs. 1. Guide customers to complete Signal Integrity and Power Integrity signoff. 2. Model and optimize vias, connectors, sockets, breakouts, and various system components using commercial tools. 3. Perform system-level signal integrity simulation in high-speed IOs such as PCIe, SerDes 4. Architect and simulate power delivery systems, including multiple dies, substrate, interposer, PCBs, and on-die PDN models. 5. Collaborate with multiple teams, including layout, design, and customers, to optimize package, PCB, die, interposer, and substrate designs.展開
