轉職熱搜工作

• Chip to Chip 介面類比 PHY 電路，例如 UCIe 標準或客製化的 Die to Die 連結類比電路設計 • HBM/DDR/LPDDR類比PHY電路設計與混合模式/高速電路設計等。

-規劃並執行高速介面（如 PCIe, USB, DP, UFS, CSI, UCIe）IP PHY 驗證。 -建立並維護測試平台，進行 System 與 Electrical 測試。 -使用 Scope, BERT, LA, Signal Analyzer 等儀器進行 Signal Integrity 與 Compliance Test。 -分析測試結果，協助 DE 及 SW 團隊解決問題。 -設計並開發硬體 PCB 評估板，支援系統驗證。

1. SOC platform 架構與RTL implementation 2. 負責 IP/子模組之 RTL 整合，組成 SoC (System-on-Chip) 或子系統的頂層設計。 3. 依據設計規格，串接不同來源或平台的 RTL，確保各模組間介面相容與功能正確。 4. 撰寫與維護整合 RTL 的頂層模組、配置腳本及連結測試環境。 5. 針對整合後的設計進行功能模擬、靜態時序分析（STA）、Lint、CDC 及等驗證工作，並協助 debug。 6. 與軟硬體、驗證、後端設計等團隊密切合作，確保整合流程順利與產品交付時程。 7. 編寫設計文件及協助設計交付相關事務。

Role and Responsibilities • Responsible for GPU cluster uArch specification, PPA (power, performance and area) optimization for industry-leading GPU hardware IP • Collaborate with Arch/Model/SW team, develop cluster level HW specification that meets feature functionality and PPA metrics • Collaborate with Arch/SW/Design team to identify and solve performance bottlenecks, power/area inefficiency issues • Guide IP design process all the way from RTL coding, verification to tape out and post-silicon debug • Proficiently use AI agent and tools to improve RTL coding, function debug and PPA analysis productivity • Execute & deliver to meet milestones/schedules. • Analyze and debug code pre-silicon and post-silicon issues. • Analyze and influence future GPU architectures. • Construct reliable & trustable relationships across teams internally & externally. • Delivering best in class GPU IP for mobile, automotive, laptop and ASIC applications

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification

We are looking for candidates that can communicate complex engineering subjects effectively to cross functioning technical teams and upper management. Strong DFT and testing skills will be put to good use. Successful handling with many external teams from pre-silicon phase cross to post-silicon on advance silicon and assembly process. Key Responsibilities • Drive DFT Excellence: Define DFT architecture specifications that enhance ATE and production test environments, optimize test costs, and improve quality across future MTK ASIC product portfolios. • Product test planning capability: Manage comprehensive post-silicon flow optimization, and test deployment for new product launches • Manufacturing Integration: Serve as a key contributor within MTK’s Global Quality and Operations organization to deliver optimal manufacturing test solutions from early product conception through post-silicon validation • Design Collaboration & Quality Assurance: Partner closely with design teams to ensure accurate implementation of DFT structures and compliance with specifications.

* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification.

1. High Speed digital design implementation 2. Integration from RTL to gate level, including flow QC, timing closure and issue analysis & solving 3. Signoff on design with mixed-signal interface 4. Design methodology and integration flow improvement

1. Familiar with HSIO spec (PCIE, USB, UFS, DP, ...etc) and system usage scenario 2. Familiar with Windows and Android OS 3. Experienced with PC south bridge design 4. Experienced with PC USB host chipset design

1. Define power states and management hardware architecture for optimal power performance. 2. Design microprocessor-based power management controller and HW assistance designs. 3. Define power architecture by performing power rail tradeoff analysis with adaptive voltage scaling consideration