轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22581&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer As an Intelligent Manufacturing Engineer, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations. (1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide. (2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency. (3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity. 2. CIM Intelligent Manufacturing Engineer (1) Software Developers: Design and develop intelligent manufacturing solutions for factory automation, manufacturing scheduling and dispatching, decision making and engineering analysis. (2) Dispatching Algorithm Developers: Heterogeneous data integration and corresponding solution design and development. (3) Quality Management Engineer: Server maintenance and related setting support including routine upgrades, troubleshooting with AP teams, high-availability architecture, virtual machines solutions, firewall rule, IIS, Nginx, database middle etc. 3. Data Analyst & Data Scientist (1) Application of statistics, machine learning, data mining, pattern recognition and other data analysis by AI techniques. (2) Your main responsibility will be to collect, explore, and extract insights from very large scale structured and unstructured data and explain these insights with the help of data visualization tools to support fab operations. 4. AMHS (Automated Material Handling System) Engineer (1) AMHS (Software) system & AI development/(Hardware) layout design & transport simulation. (2) Enhance System Performance, Quality and Reliability. (3) Coordinate cross-organization AMHS projects. 5. PIDS/WAT (Wafer Acceptance Test) Engineer (1) New WAT tool data matching and release. (2) WAT quality/manufacturing efficiency improvement. (3) WAT tool, recipe, and system management. (4) WAT productivity and quality improvement. (5) WAT tool and systematic issue troubleshooting. 6. PIDS/NTO (New Tape Out) Engineer (1) Handle mask tape out and manufacturing flow creation. (2) Manage projects related to NTO system development and enhancement. 7. Quality Management Engineer (1) Manage audit, defense, and quality systems. (2) To perform data analysis and simulation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22585&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.

參與以 VLM(視覺語言模型)為核心的機器人任務規劃系統開發,探索如何讓機器人「看懂環境、聽懂指令、做出行動」,具體任務包含: 1. 研讀 VLM / VLA(Vision-Language-Action)相關論文,並進行關鍵技術實作與驗證 2. 設計 Prompt 策略,將自然語言或視覺輸入拆解為機器人可執行的動作序列(Action + 參數) 3. 協助建構任務規劃模組,串接 VLM 推論結果與機器人動作夾帶參數的執行框架 4. 使用 NVIDIA Omniverse Isaac Sim 進行機器人模擬,驗證任務規劃正確性 5. 撰寫技術文件,記錄模型設計、Prompt 工程與測試結果

職缺簡介 我們誠摯邀請具備遠見的策略與技術專家加入智慧服務型機器人團隊，帶領策略規劃、生態系發展與技術方向推進。此職位將聚焦於推動 Agentic AI 系統技術創新，並促進其在醫療照護、旅宿服務、物流與巡檢等重要服務場域的應用落地。 主要工作內容 1. 策略領導 - 制定並執行智慧型機器人長期策略規劃，與組織發展方向一致。 - 領導跨部門計畫，定義 Agentic AI 驅動服務型機器人的技術藍圖。 2. 技術前瞻與生態建構 - 持續掌握全球服務型機器人與 AI 技術趨勢，預測技術演進方向。 - 分析市場動態，辨識挑戰與機會，提出策略性建議。 - 提供系統架構、平台設計與可擴展 AI 部署的專業意見。 - 規劃並優先排序包含多模態 AI、數位雙生模擬、邊緣運算與 Agent 架構等關鍵研發項目。 3. 團隊領導與營運監督 - 指導跨領域工程與研究團隊，確保執行成果與策略願景一致。 - 管理專案執行，包含可場域部署的智慧型機器人系統。 - 推動 Agentic AI、多模態整合與自主系統等技術創新。

1. ROS2 控制模組開發: 協助編寫與測試 ROS / ROS2 節點,包含機器人基本運動控制、狀態機與通訊邏輯。 2. 邊緣 AI 模型部署實驗: 協助將對話/視覺/動作 AI 模型部署至嵌入式平台(如 NVIDIA Jetson),並進行延遲與效能測試。

研讀並實作相關RL, IL 論文,並與團隊進行模型雛形建置、訓練與布署,具體任務包含: 1. 使用 NVIDIA Omniverse Isaac Sim/ Isaac Lab 進行機器人模擬 2. 進行軌跡資料蒐集用於模仿學習模型訓練 3. 撰寫技術文件,協助記錄模擬流程與訓練架構設計

機器人數位雙生控制整合,具體任務包含: 1. 使用 NVIDIA Omniverse Isaac Sim/ Isaac Lab 進行機器人模擬 2. 使用深度相機完成eye to hand或eye in hand標定 3. 使用ROS2串接整合數位雙生、感測器與機器人

研讀並實作相關模仿學習(Imitation Learning, IL)、強化學習(Reinforcement Learning, RL)論文,並與團隊共同推進控制策略模型的雛型建置、訓練與實機部署(Sim-to-Real),具體任務包含: 1. 使用 NVIDIA Omniverse Isaac Sim / Isaac Lab 建構機器人模擬環境,進行控制策略訓練 2. 進行軌跡資料蓄集,用於 IL 模型訓練 3. 實作 Sim-to-Real 轉移流程,包含領域隨機化(Domain Randomization, DR)、物理參數隨機化等技術,縮小模擬與實體之間的表現落差 4. 對訓練完成的控制策略進行實機上線驗證,記錄模擬與實機間的表現差異分析 5. 撰寫技術文件,協助記錄模擬流程、訓練架構與 Sim-to-Real 實驗結果