轉職熱搜工作

【工作職責】 製程研發與優化： 負責三酸陽極處理製程，並針對不同材料進行技術開發與參數最佳化。 量產導入與控管： 主導前期樣品打樣與測試，確保技術順利且穩定地轉換至規模化量產模式。 產線管理與維護： 負責陽極實驗線之日常管理與設備基礎維護。 品檢及品保作業： 支援日常生產品檢作業及判斷，確保產出品質符合規範。 其他： 跨部門協作及執行主管交辦之其他專案事項。 【條件要求】 具備三酸陽極處理製程之實務經驗與操作熟悉度。 加分條件： 具備實際陽極處理研發/生產經驗者優先錄取。 【專屬福利與獎金】 研發分紅機制： 凡技術開發成功並順利導入規模量產，公司將提供【研發獎金】以玆鼓勵。 穩定調薪制度： 重視員工穩定度與貢獻，凡年度績效考核優等且達全勤標準者，每年調薪。

1. 蒐集與分析市場訊息, 2. 協助產品規劃, 提出新產品及或者產品更新及升級 3. 跨部門協作, 與公司及工廠討論案子, 提出方案並反饋給業務

1. 執行原材料、半成品及最終產品的外觀、尺寸、功能及性能之檢測，根據標準操作程序記錄檢測結果。 2. 使用各種精密測量工具（如卡尺、千分尺、量規）進行專用生產機械及零件的檢驗，並確保檢測數據準確性。 3. 繪製並製作品管圖表，記錄檢驗結果及進行數據分析，以掌握品質變異狀況並解決問題。 4. 熟悉專用生產機械結構和相關標準，協助進行不合格原因的追查、分析、報告及改進。 5. 參與制定和優化檢驗標準及品質管理流程，進行製程管制以確保產品品質水平穩定。 6. 定期校準和維護檢測設備，確保設備的可靠性及精確性，並培訓新進檢驗人員操作規範。 7. 執行品質改進項目，提出品質改善建議，並有效對接研發及生產部門以解決品質技術問題。 期待對品質管理與專用生產機械有熱情的你加入我們的團隊，與我們一起追求卓越，創造高品質的產品！

1. HPLC, GPC, IC, LC-MS, GC-FID, GC-MS, ICP-MS與非層析類設備方法開發 2. 方法開發之檢驗技術文件撰寫與技轉方法至工廠端 3. 各RD專案樣品之檢驗分析

1.陶瓷材料研發與改善 2.參與新產品與新材料開發，提升產品競爭力 3.規劃並執行實驗，驗證新材料、新技術與製程可行性 4.具豐富材料研發、製程開發或半導體相關產業經驗，熟悉材料分析、製程改善及量產導入流程 5.豐富的研發及專案管理經驗及跨部門整合經驗

1.負責產品機構設計與結構評估。 2.繪製機構設計圖面(3D 與 2D)。 3.協助彙整產品 BOM 表以及成本表 3.負責機構材料的測試與選用。 5.負責模具開模、DFM確認、試模、產品檢討、修改模具。 ※ 感謝您對本職缺的關注。若您的經歷與職缺需求相符，我們將於 3～5 個工作天內主動 與您聯繫。 如未達合適條件，恕不另行個別通知，懇請見諒與包涵。我們期待未來有機會能與您合作！ DOSUN 品牌價值始終致力於自行車騎乘安全，堅信安全的夜間自行車活動不僅僅來自於充足的照明，而是提供所有用路人一個友善的用路環境後所帶來的安全體驗。 DOSUN從設計、研發、生產、行銷都致力於給消費者最好的服務。產品設計上，聆聽使用者的心聲與需求，將各系列自行車燈產品推陳出新，結合更多經驗以提昇各方面品質。 2021年開始DOSUN秉持品牌核心理念跨入電動輔助自行車。 以運動休閒為本質，利用本身對於深耕自行車產業的經驗及車燈電控上的科技。使自行車朋友們更能專注於享受騎車過程所帶來的感受，提供各階段年齡的朋友一個全新的生活體驗。 銷售服務上，在全球皆有與DOSUN合作的經銷商，不論您身在何方皆能為您提供最完整的服務。 遵循著LOGO的設計，結合燈與人的可愛圖騰，因為 DOSUN 深知「產品和技術應符合人的本性」，並依此理念努力打造移動式照明產品的領導品牌，持續發揚陽光、快樂、正向的 DOSUN 品牌優良特質。 DOSUN品牌體驗館/組車廠：桃園市龜山區 DOSUN品牌體驗館/辦公室：台中市大甲區 DOSUN品牌體驗館：高雄市鼓山區 保險類：勞保、提撥勞退金、健保、團體保檢 制度類：制服、優秀員工獎金、資深員工獎金、介紹獎金 設備類：員工餐廳(免費供餐)、汽機車停車場、咖啡吧、哺乳室 補助類：員工婚喪喜慶補助、住院慰問、生育補助、員工(含子女)獎助學金、 在職進修補助假制度：符合勞基法休假制度、派外訓練假 獎金/禮品類：年終獎金、分紅獎金、生產績效獎金、提案改善獎金、研發設計獎金、生日 禮金及小蛋糕、三節禮金(勞動/端午/中秋)、 禮品(勞動/母.父親/中秋節，依盈餘而定) 員工活動與特惠：國內外旅遊、尾牙、在職員工年度健康檢查、特約商店、部門聚餐、 中秋活動/家庭日、公司產品團購、員工認股

1.生產製程改善 2.生產專業學習 3.協助海外建廠工作 4.節能改善 5.冷修、擴廠能力培訓 6.研究開發 7.(大學~碩士)月薪34,000~45,000(碩士級升正式，依工作表現調薪)。 註：鹿港廠目前無法提供宿舍，請見諒！

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=21826&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Join our R&D Advanced Packaging team and be at the forefront of developing world class packaging solutions that will power the world‘s most advanced electronics, enable AI platform solution foundries, and influence the entire industry ecosystem. Job Responsibilities: 1. Lead the development and integration of novel advanced packaging technologies, processes, and materials. 2. Design, execute, and analyze experiments to optimize packaging performance, reliability, and cost. 3. Collaborate cross-functionally with design, module, and operations teams to ensure seamless integration and manufacturability. 4. Identify and troubleshoot complex technical challenges in packaging integration, driving root cause analysis and solutions. 5. Contribute to the strategic roadmap for advanced packaging, evaluating new technologies and intellectual property. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.