轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=550&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

一、資格條件:相關科技大學、技術學院大學部或專科部化學、化工、材料相關管理科系畢業。 二、工作性質:環氧樹脂研究開發 三、工作時間:常日班08:00-17:00 四、薪資福利:37,500元〜40,000元 五、休假方式:週休二日 六、應徵方式： (一)請於3月18日前將履歷表、可供證明文件(如身分證)、成績單、畢業證書等影本，郵寄南亞塑膠公司樹林管理課張小姐收，信封右上角註明『應徵樹林技術處』字樣，合則約試，不合者恕不退件。 (二)應徵者之個人資料造假不實本公司將取消錄取資格或予以免職，且管制禁止入廠，如涉及刑責者，並將移送法辦。應徵者之資料不予退件，由本企業統一銷燬，不另做他用。 (三)履歷郵寄地址：新北市樹林區味王街55號。 三、應徵者洽詢電話: 樹林管理課 侯小姐：02-26806311 分機2201或(T1專線412-2201)。 台北管理處 周先生：03-3284191 分機191 或(T1專線415-191)。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=21826&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Join our R&D Advanced Packaging team and be at the forefront of developing world class packaging solutions that will power the world‘s most advanced electronics, enable AI platform solution foundries, and influence the entire industry ecosystem. Job Responsibilities: 1. Lead the development and integration of novel advanced packaging technologies, processes, and materials. 2. Design, execute, and analyze experiments to optimize packaging performance, reliability, and cost. 3. Collaborate cross-functionally with design, module, and operations teams to ensure seamless integration and manufacturability. 4. Identify and troubleshoot complex technical challenges in packaging integration, driving root cause analysis and solutions. 5. Contribute to the strategic roadmap for advanced packaging, evaluating new technologies and intellectual property. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16521&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Join our R&D Advanced Packaging team and become the critical compass, expertly guiding seamless integration and module optimization. You will be instrumental in pioneering cutting-edge advanced packaging solutions – the very foundation that powers the world‘s most advanced electronics and enables world-class AI platform foundries. Your predictive insights will be the definitive key to achieving unparalleled success, fundamentally reshaping the entire industry ecosystem. Responsibilities: 1. Develop and apply advanced simulation models for complex advanced packaging structures. 2. Perform comprehensive analyses to predict and optimize packaging performance, reliability, and manufacturability. 3. Collaborate closely with design, integration, and process teams to translate simulation insights into tangible design and process improvements. 4. Validate simulation models against experimental data, driving continuous improvement in model accuracy and predictive capability. 5. Contribute to the strategic roadmap for advanced packaging simulation, exploring new methodologies, tools, and intellectual property. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

工作內容︰ 1、防火塗料配方及製程研發及功能驗証。 2、防火材料(Fire stop)配方開發及驗証。 3、防火產品組合應用功能性驗証測試。 4、既有產品品質提昇，產品可靠度及穩定性試驗。 5、新產品專案規劃執行。 6、移轉製程技術給生產單位。

1. 有機化學物之合成與研發，具有氟碳化合物合成經驗與專長者尤佳，將針對奈米粒子與高分子材料進行技術開發。 2.具博士學位，需有獨立深入思考能力與創新能力，且對創業有旺盛企圖心，擅長團隊合作。 3.將與國立大學研究單位合作，進行尖端技術開發，適合未來有志於創業者，將建立新公司。

☆此為【承恩科技股份有限公司】楊梅廠區的職缺☆ 1.協助製程開發與材料備料 2.主管交辦事項 ~希望前來應徵的您能盡量完善履歷內容，若有相關證照也請一併寫進履歷中。收到面試邀約後請確認自己能開始上班的日期~

【本職務僅接受台塑企業人才招募網站投遞】 請至本企業人才招募網站 https://hr.fpg.com.tw 投遞個人履歷。 工作內容：產業轉型開發碳纖材料及摺疊屋產品測試認證、導入生產。