轉職熱搜工作

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

28nm及以下先進製程(含FinFET) IO電路和ESD防護設計, 工作內容包含 (1) GPIO電路設計(包含ESD/LU防護) (2) 特殊應用IO (SD3.0/SIM card/eMMC等)電路設計(包含ESD/L防護) (3) 高速IO和特殊應用IO在事業部專案上展開和執行 - Advance node (28nm and beyond, including FetFET) IO circuitry and ESD protection design covering fields for (a) General purpose IO circuit design (with ESD/LU protection) (b) Specialty IO (SD3.0/SIM card/eMMC etc.) circuit design (with ESD/LU protection) (c) Project related implementation for high speed/specialty IO Interface - High speed IO, specialty IO circuit design, ESD protection circuit design and simulation. Work with project leader, layout, packaging and system engineers to meet design and system specifications. Work with IO library modeling, characterization teams closely for IP release.

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. 屬於DE部門 2. 支援 WiFi/BT, 手機與 ARM computing等產品晶片開發計畫的FPGA與Emulation驗證工作與驗證技術開發 3. 主要為獨立貢獻者； 長期可依照潛力培養團隊領導能力，並有機會與全球科技產品的領導廠商有直接溝通合作的機會，可藉此培養個人與跨國的領導企業一起合作技術開發的能力。 4. 工作目標如下: a) 支援計畫功能與系統驗證與除錯 b) 規劃及協調驗證資源、項目及時程 c) 改善和加速multi-FPGA與Emulator工作流程 d) 增進FPGA與Emulator驗證效能 e) 研發SoC系統電路分析工具

- Logic/Physical Synthesis by using advanced optimization techniques(below N7) and generate optimized Gate Level Netlist for Timing, Area, Power. - Debug the timing/area/congestion issues and work with RTL & Physical designers to resolve them. - Run Formal Verification checks between RTL and Gate level netlist and debug the aborts, inconclusive and Logic Equivalency failures. - DFT insertion, ATPG and gate-level simulation - Developing Automation scripts and Methodology for all FE-tools including (Lint, CDC, RDC, Synthesis, STA, Power). - Interact with Physical Design Engineers and provide them with timing/congestion feedback.

1.Propose design verification plan and do the execution based on IP and system HW architecture/application 2.Develop design verification environment 3.Develop required verification methodology and adopt into project

As deep sub-micron process requires longer research cycle and higher manufacture cost, DV(design verification) has become an inevitable part of design group in Mediatek chip development flow. CDG DV is in charge of development and implementation of smart phone, TV, and ASIC product line verification plan. It included: integrated simulation/verification env development, big data analysis and efficiency improvement, bus fabric / EMI (External memory interface ) / Low power functions verification plan and implementation Need to build up verification plan/bench and continuously improve methodology, and you will understand both detail scenario and global view of cell phone/ASIC operating schemes Need to leverage the latest EDA tool and concept to accomplish the verification plan Work location: Hsinchu/Taipei

1. 應用正規方法在硬體或軟體的驗證上 2. 正規方法文獻回顧與論文分析以改善目前的使用限制 3. 規劃安排跨部門的技術教學與討論課程 4. 相關的文件撰寫與審查修改

1. HSI IP development 2. Short term: Help integration of on-going project including QC. 3. Long term: Deep learn into 3rd party HSI IP. Know the detailed spec of PCIe/UCIE/USB4 and able to co-work with DV.

1. Develop systematic algorithms to alleviate design challenges, including implementation, process what-if assessment, system performance evaluation, in advanced nodes or package 2. Closely work with foundry and EDA vendors to define innovative HPC, Chiplet design methodologies 3. Explore new EDA features and define improvement direction from MTK product requirements