轉職熱搜工作

1. Perform pre-silicon and post-silicon correlation and modeling related to adaptive voltage scaling and on-die sensor 2. Develop and improve post-silicon testing methodologies related to adaptive voltage scaling and on-die sensor

1. Model development (includes behavior modeling/ cycle approximate modeling/ power modeling) 2. ESL platform and simulation technology development. 3. Next-generation processor architecure prototyping and design exploration 4. Next-generation modem platform architecure prototyping and design exploration

We are looking for a highly skilled DFT CAD and Methodology Expert to develop and deploy advanced test methodologies for next-generation data center and AI ASIC. Enhancing the efficiency and quality of our ASIC development and testing procedures. The successful candidate will work within the CAD team to innovate test solutions for complex 2.5D/3DIC, ensuring high quality and yield for advanced packaging technologies. Key Responsibilities • Methodology Development: Develop and deploy robust CAD flows for scan insertion, ATPG, pattern simulation, and Memory BIST (MBIST). • Tool Automation: Create scripts (Python, TCL, Perl) to enhance and automate DFT flows, accelerating simulation runtimes and improving quality of results (QOR). • EDA Tool Integration: Collaborate with EDA vendors to enhance tools for advanced packaging, including test verification and pattern generation. • Support & Debug: Support DFT integration teams with CAD flow issues, debug complex issues, and provide technical mentorship. • 3DIC/2.5D Expertise: Develop and implement testing strategies for chiplets and TSV-based 3D stacks. • Location: Hsinchu, Taipei, Singapore.

解讀客戶的網絡安全需求 從網絡安全需求中推導出功能和安全概念 制定和審查安全系統架構 與 IP 團隊和客戶溝通和協調安全設計 執行系統安全分析（例如：TARA）

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory. Furthermore, through collaboration with worldwide colleagues, you will have the rare opportunity to apply advanced Deep Learning theories to novel application areas such as AI-designed IC and General Intelligence Conversation. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

1. Develop high speed interface subsystem architecture and integrate PCIe, MIPI, or DisplayPort subsystem. 2. Develop security and FuSa function on PCIe, MIPI, or DisplayPor degital circuit.

1. 負責SOC內 bus 數位系統的 SystemC 平台建模與模擬，包括功能建模與性能分析。 2. 根據系統規格，建立可重複使用且具延展性的 SystemC 模型，支援系統架構規劃與驗證。 3. 參與 SoC（System-on-Chip）/IP 之行為層及高層次抽象（TLM, Transaction-Level Modeling）模型設計與驗證。 4. 與硬體、軟體和驗證團隊協同合作，協助流程整合、聯調與問題分析。 5. 撰寫技術文件與模型說明，支援團隊設計、驗證及客戶應用。

• Lead the DV effort of a high-end CPU project. • Manage, coach and guide DV engineers. Follow up status and keep up the schedule. • Architect and implement top-module testbenches and their components using UVM-based methods. • Lead the effort of building in-house BFMs to facilitate co-sim based module level verification. • Architect and implement formal verification based module level testbench. • Work with the design team to create testplans. Implement checkers/assertions/coverage check points. • Work with validation folks to improve design visibility

* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification.