轉職熱搜工作

1. 主導系統電控設計或數位電路設計 2. 了解客戶需求,評估設備維修與控制器/功能/系統升級優化可行性 3. 電路問題調查研究、優化設計、控制器規格制訂與電路圖繪製 4. 制訂控制器組裝、測試標準規範 5. 安裝、調適及功能Debug 6. 部門例行事務及主管交辦事項

職責要求 1.推廣產品(PWM/SR IC, HV/LV MOSFET, Diode)在Consumer/Computing/Industrial…電源相關的應用。 2.掌握客戶案子進度並提供專業的技術建議與適合的產品組合。 3.其他主管交辦事項。 任職資格 1.具備SMPS 相關電源產品研發或FAE經驗三年以上

職責要求 1.負責主機板 ,伺服器 ,顯卡 ,筆電之電源相關產品(DC-DC)的客戶技術應用支援。 2.推廣DC-DC相關產品 ,有效提供客戶產品建議 ,設計討論等相關技術諮詢。 3.完成與客戶端 project 的 design-in/win follow up。 4.能有效處理schematic/layout check以及debug。 5.其他主管交辦事項。 任職資格 1.兩年以上電源相關工作經驗 (具VRM or High Power DC-DC 設計經驗、熟Intel VRTT或AMD SDLE測試經驗者優先錄取)。 2.熟悉電源架構Buck/Flyback topology或Battery charger ,MOSFET等技術應用。 3.有R&D/FAE工作經驗三年以上。

1.帶領團隊進行產品開發 如STK/EFEM/ROBOT/周邊設備等專案執行 2.機械結構評估分析、零組件設計 3.機構拆解、故障分析、零件工程圖面製作 4.組裝、測試、作業標準書建立 5.機械手臂機構設計整合與分析驗證 6.主管交辦事項

職責要求 1.設備工程單位工作規劃、各項業務之營運管理、人員管理 2.熟悉測試相關機台技術與稼動率管控 3.改善設備問題與功能提升 3.規劃及審核各項管理制度以符合經營管理之要求 任職資格 1. 專科/大學，理工相關科系 2. 10年以上,測試產業或半導體產業設備經驗 3. 曾任半導體測試設備經驗5年以上，具3年以上主管經驗尤佳。(無主管經驗，測試設備資深經驗亦可) 4. 擅溝通協調，具高度執行力與整合能力。 5. 熟悉IC測試作業流程者佳。 6. 具基本英文讀寫能力佳。

1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Tool installation and service support based in Taichung but not limited to work in Taichung area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.

職責要求 ＞ Need to visit customer sites to perform SW installation, upgrades and troubleshooting. ＞ Strong analytical and debugging skills to identify and resolve software and hardware issues on-site. ＞ Ability to adapt quickly to unexpected challenges in the field. ＞ Effective communication skills to explain technical concepts to non-technical audiences. ＞ Proactively collect field issues and work with engineering SW dept. to find solution I the filed. 任職資格 1.Technical Skills: • Knowledge of C++, Visual Studio programming and PLC programming • Knowledge of relevant SEMI standards (e.g. SECS/GEMS) 2.Field Experience: • Ability to work in dynamic environments, including on-site installations, testing, or support. • Experience interfacing directly with customers to gather requirements and provide technical solutions.

1) 新建廠房環保相關空、水、廢、毒之評估規劃及許可證申請等 Assessment, planning and permit application related to the air, water, waste and toxic environmental protection of the new factory and comply with Taiwan‘s environmental protection regulations. 2) 既有廠房環保相關空、水、廢、毒之管理 Management of air, water, waste and poison related to environmental protection in current factory buildings. 3) 環保相關內、外部稽核管理 Environmental protection related internal and external audit management 4) 環保法規收集彙整、鑑別與查核 Collection, identification and check of environmental related regulations 5) ISO 14001環保相關管理系統建置及維護 Establish and manage ISO 14001 system 6) 總部ESG相關事項 ESG related topics from Headquarters 7) 溫室氣體盤查、碳足跡盤查作業管理 Greenhouse gas and carbon footprint inventory 8) 環保相關緊急應變處置 Environmental protection related emergency response

職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.