轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址：https://careers.tsmc.com/careers/JobDetail?jobId=293&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Mask equipment maintenance and trouble shooting. 2. New mask equipment installation. 3. Efficiency and throughput improvement on mask equipment. 4. Continuous improvement on mask quality. 5. Cooperation with equipment vendors and cross-functional engineers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=344&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop scientific computing software for multi-physics simulations and explore applications in semiconductor technology. 2. Engage with cross-function teams for process development to meet the target product requirements.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=286&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for Mask process 2. Smooth product pilot run for next generation process 3. Continue improvement in tools reliability and stability. 4. Advanced technology transfer and Continuous Improvement Plan(CIP). 5. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 6. Working with a team which may include device, integration, yield, lithography or external suppliers to drive leading-edge integrated module development, control, and improvements. 7. Be responsible for sustaining ownership, such as day-to-day operations, equipment troubleshooting, and mentoring technicians.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15983&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a Principal Operations Research Engineer within the AI4BI division of TSMC’s Corporate Planning Organization (CPO), you will serve as a technical lead, spearheading efforts in optimization and automation to revolutionize CPO business processes. Your work will span from automation and data analytics to business intelligence. Responsibilities: 1. Digital Transformation and Solution Optimization: Identify and capitalize on opportunities for digital transformation in CPO business processes, such as capacity planning, business forecasting, and operational optimization. Frame and solve a broad spectrum of problems, such as demand-supply matching, scheduling, and operational efficiency, using advanced optimization algorithms. 2. Research and Strategy Development: Lead in researching, developing strategies, and creating roadmaps that incorporate new AI/ML, business intelligence, and intelligent automation technologies. Foster collaborations with universities and industry partners to advance the AI4BI agenda, while also spearheading the creation of patent applications and contributing to technical publications, thereby enhancing TSMC’s reputation in AI/ML innovation. 3. Leadership and Collaboration: Lead the AI/ML team and collaborate with cross-functional teams to drive or co-drive the initial ideation, development, and deployment of innovative solutions. Mentor and guide a team of AI/ML scientists and data engineers, fostering a collaborative and high-performance culture. 4. Project and Stakeholder Management: Interact and engage with IT/business stakeholders, user executives, technical leads, and partners to manage project scope, priorities, deliverables, risks/issues, and timelines. Effectively communicate to ensure alignment and success, ultimately delivering successful implementations of AI application.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15984&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a Principal AI Engineer within the AI4BI division of TSMC’s Corporate Planning Organization (CPO), you will serve as a technical lead spearheading AI/ML innovations to revolutionize CPO business processes, encompassing automation, data analytics, and business intelligence. This role offers a unique opportunity to drive cutting-edge AI/ML advancements and significantly impact TSMC‘s business processes through digital transformation. Responsibilities: 1. Digital Transformation and Solution Design: Identify and capitalize on opportunities for digital transformation in CPO business processes, such as capacity planning, business forecasting, and operational optimization. Design and implement AI/ML solutions tailored to these business use cases, leveraging the internal AI/ML and data platform. 2. Research and Strategy Development: Lead in researching, developing strategies, and creating roadmaps that incorporate new AI/ML, business intelligence, and intelligent automation technologies. Foster collaborations with universities and industry partners to advance the AI4BI agenda, while also spearheading the creation of patent applications and contributing to technical publications, thereby enhancing TSMC’s reputation in AI/ML innovation. 3. Leadership and Collaboration: Lead the AI/ML team and collaborate with cross-functional teams to drive or co-drive the initial ideation, development, and deployment of innovative solutions. Mentor and guide a team of AI/ML scientists and data engineers, fostering a collaborative and high-performance culture. 4. Project and Stakeholder Management: Interact and engage with IT/business stakeholders, user executives, technical leads, and partners to manage project scope, priorities, deliverables, risks/issues, and timelines. Effectively communicate to ensure alignment and success, ultimately delivering successful implementations of AI application.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=332&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Operation Resources Planning Engineers support the company’s profitable growth through capital effective demand fulfillment and catalyzing the company’s optimal business operation by managing capacity and improving process. Your main responsibilities will include, but are not limited to: 1. Capacity planning and management. 2. Productivity improvement. 3. Capital investment evaluation and control. 4. Fab space layout planning.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=462&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As an AI/ML Engineer, you will be a key member of a versatile team focusing on both algorithm development and platform implementation for TSMC’s R&D, Fab, Business, IT, and Security functions to improve productivity and work quality. The role involves developing AI/ML solutions, implementing scalable platforms to support AI productionization, and maintaining the lifecycle of machine learning models. Responsibility: Common Responsibilities 1. Collaborate with cross-functional teams of data scientists, ML engineers, and software developers. 2. Drive the complete AI solution development stages from data collection, exploration, and feature engineering to model evaluation and error analysis. 3. Perform model lifecycle management to ensure the validity of models in production. 4. Exercise sound judgment in determining if business problems can be addressed through AI/ML and communicate results effectively to domain users. 5. Operate and maintain scalable, highly available AI platforms with continuous measurement and quality improvement to meet SLO/SLAs. Differentiated Responsibilities 1. AI/ML Solution Development (1) Develop AI/ML algorithms that optimize manufacturing processes, improving productivity and work quality. (2) Explain AI/ML models to internal customers and conduct error analysis. 2. AI Platform Development (1) Design and implement full tech stack solutions, including data-related technologies and AI platforms. (2) Develop tools, automation, and microservices to extend platform capabilities. (3) Manage container-based workloads and process high volumes of data in environments like Kubernetes. Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of officially English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=393&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16570&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.