轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4997&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our company is seeking a skilled Software Development Engineer in Test (SDET) to help lay the groundwork for our engineering teams to build robust automation tests more efficiently and effectively. The SDET will be instrumental in enhancing our testing capabilities and ensuring the highest quality of software delivery. Joining our dynamic team, you will be at the forefront of cutting-edge technology, working to support our expansive growth across the globe. Responsibilities: 1. Design, develop, and maintain the automation test framework and infrastructure that allows for efficient creation, execution, and maintenance of automated tests. 2. Collaborate with software engineers to understand product architecture and features, to build effective test plans and automation scripts. 3. Implement best practices in test automation and ensure that automated tests are integrated into the continuous integration and deployment pipelines. 4. Mentor and support other engineers in writing testable code and developing automated tests, enhancing the team‘s overall testing expertise. 5. Troubleshoot, identify, and document bugs, and work with development teams to resolve issues. 6. Optimize test automation strategies to increase test coverage, test efficiency, and lower defect rates. 7. Engage in code reviews and provide constructive feedback to improve the quality and maintainability of test code. 8. Stay updated with the latest trends in test automation and introduce new tools and frameworks that can enhance testing workflows. Additional information for the job: 1. Job Location: Taipei Site, Hsinchu Site. 2. On-call needs: On-call 1 week every 2 months. The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(could be replaced if you have a script of an officially recognized English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5302&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Quality System Development (AQSD) is part of TSMC‘s Intelligent Manufacturing Center (IMC), responsible for three main directions: 1. Use statistical methods and conditional monitoring to inspect fab control charts, providing early warning of abnormal product yields; offer a fab defense system settings comparison platform to check that machines meet the internal control anomaly conditions set by the engineering department. 2. Develop online fab analysis platforms through Big Data, Machine Learning, and Deep Learning techniques for online yield/defect analysis to ensure the quality of wafers produced in the fab. 3. Develop systems and provide logical operations to control and implement escape mechanisms for material batch changes, measurement stages, and inspection stages, ensuring quality and optimizing product sampling rules. Responsibilities: 1. Apply machine learning/optimization algorithm to build up models for optimizing semiconductor production. 2. Develop analysis and optimization methods to enhance product quality, increase tool productivity and improve people productivity. 3. Design, develop and test prediction models with real applications in manufacturing. 4. Build a flexible framework to speed up the development process of AI models, with a focus on Large Language Models (LLMs) serving. 5. Turn exciting AI prototypes/ideas into products, leveraging LLMs and other advanced AI technologies. 6. Develop next-generation AI backend systems related to large-scale real-time data access, collection, analytics and monitoring. 7. Establish and maintain MLops processes and tools, including model deployment, monitoring, and automation. 8. Continuously improve the quality of AI production systems, particularly those utilizing LLMs. Work Location: Longtan, Hsinchu, Taichung, Tainan On-Call Needs: Newcomers do not need to be on duty for the first six months. On call for 1 week every 3 months.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4673&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Be responsible for test program development of logic SOC device, mixed-signal, RF/5G mmWave, PMIC. (digital & analogy) 2. Be a focal contact between customer and tsmc testing for test validation and release to production. 3. Collaboration for test optimization and test efficiency improvement. 4. Test yield improvement with process engineers to solve the yield related problems by process optimization. 5. Leading edge test technology development. 6. Test program development and project management from NPI phase to MP phase.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4672&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Define advanced testing hardware technology architecture. 2. Create world-class method and role model tech structured problem solving. 3. Conduct advanced electrical/mechanical/thermal analysis and PI/SI improvement. 4. Be a focal contact between customer and tsmc testing for test validation and release to production. 5. Exhibit good and open communication skills, be able to work within cross-functional teams.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5292&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC is searching for a Computer Vision and Machine Learning Software Manager for Mask-Making and computational application. As the leader of the in-house image and AI team, you will be responsible for delivering state-of-the-art technology for defect image inspection, evaluation, treatment, and analysis. Our software focuses on defect image inspection, evaluation, treatment, and analysis. The objective is to become the leading team in mask-technology software, supported by the most cutting-edge tools and the largest database accessible. Responsibilities: 1. Manage in-house inspection project, including image processing code and model structure design, implementation, and verification. 2. Code for GPUs to optimize computing resources for image processing and machine learning. 3. Implement style transfer and GAN for high-accuracy image simulation. 4. Develop image processing and deep-learning model for image segmentation and classification.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5305&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Infrastructure and Platform Engineering Department (IPED) in TSMC‘s Intelligent Manufacturing Center (IMC) is dedicated to enhancing system stability and developer productivity. As TSMC‘s production scale continues to expand, the core focus is on smart manufacturing through deep system integration to maintain high yield and efficiency. Within this team, you will assist in implementing new cloud architectures (K8S) and other related cloud-native technologies to achieve the goals of DevOps. Responsibilities: General job responsibilities for this job position are: 1. Develop and maintain cloud-native related systems based on the K8S architecture. 2. Tune system configurations based on metrics and user feedback. 3. Work closely with internal development teams and seek new tools that can enhance productivity. 4. Conduct POC (proof of concept) and assist internal development teams with implementation. Job Location: Hsinchu/Taichung (preferred) On-Call Needs: 1. Regular rotation: On-call for 1 week every 3 months. 2. Event: In cases affecting the production line, remote connection to the company for issue resolution is required.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15470&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 1. 參與新廠廠務監控系統設計與發包 2. 提出創新、前瞻的技術及架構，創造更安全、穩定及有效率的監控架構 3. 導入國際法規接軌設計，如：UL (US)、CE (Europe)、JIS (Japan) 4. 參與海外設計專案，針對公司目前海外建廠區域（美國、歐洲、日本）

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=391&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced module process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability qualification. 3. Working with a team which may include device, integration, yield, module, manufacturing and external suppliers to drive leading-edge integrated module development, control and improvements. 4. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 5. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 6. Hands-on participation and a strong sense of ownership. 7. Willingness to make frequent fab presence.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=540&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: We are seeking outstanding engineers to join TSMC IT infrastructure team to build and orchestrate cloud services to support world-class semiconductor foundry. This team is responsible to design, implement and optimize IT infrastructure toward software-defined computing, storage and networking with cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Responsibilities: 1. Assist the cloud architect to refactoring or migrate the legacy systems as cloud native services. 2. Participate in architecture planning and build cloud environment with cloud architects, project technical support, enterprise solutions based on Azure, AWS or GCP 3. Effective use of professional domain knowledge to assist in maintenance and troubleshooting 4. Cloud services technical support

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=389&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems.