轉職熱搜工作

【工作內容】 1. POS系統程式開發與維護 2. WebAPI開發與維護 3. 自動化報表開發與維護 4. 完成部門交付的其它任務 5. Online help

[Key Responsibilities] # Backend (Go) - Maintain and reconstruct RESTful API based on Gin + GORM framework - Implementation and optimization of ODB++/Allegro schematic file parser - Design and Implementation Physical View data model - Complete the migration CLI tool and establish an automated DB schema management process - Strengthen authentication and authorization # Frontend (React + TypeScript) - Maintain and expand the front-end UI based on the React-Admin framework - Integrate Cytoscape.js graphics engine for topology view interaction: node dragging, connection establishment, layout algorithm (Klay/COSEBilkent) - Implement custom DataProvider and error handling - Develop cable routing interactive interface: component panel, connection settings, attribute editing, multi-select operation - Work with backend APIs to ensure Content-Range pagination works correctly - Maintain i18n (Chinese and English), supplement UI components and styles # DevOps & Testing - Complete unit testing and integration testing - Optimize Makefile and CI/CD processes: wire/swag/tygo tool chain automation - Maintain Docker Compose development environment and deploy Dockerfile - Assist in creating test data sets and migration seed scripts

1. Software management of server/workstation products for customer. 2. Software includes BIOS, BMC, firmware, device drivers and OS.. 3. Work and coordinate with customer, 3rd party vendors and project members for: - Schedule and version control of project related software - Issue management of project related software. - Collect and deliver software list to customer. 4. Work with customer to enable IEC project members for SW related process or working model.

1.開發AI影像的嵌入式系統韌體、配套應用程式之開發及整合 2.撰寫底層驅動程式及配套應用程式進行軟硬整合 3.測試、調試以及優化韌體性能及系統穩定性 4.熟悉通訊協議，開發無線通訊相關應用程式 5.撰寫技術文檔，記錄設計說明與測試結果 6.與硬體工程師協作，確保硬體與韌體整合無誤 7.研究AIoT新技術，滿足物聯網市場需求

後勤組裝 1.簡易設備組裝 2.各機構做動測試 3.試運行-配合軟體工程師參與調整。 4.清潔打包-自動化設備入廠前各式整備。 5.可學習配電、PLC 享有三節獎金、含年終獎金(保證13個月)、季度績效獎金 前三個月適應期底薪32000元，三個月後底薪35000元，後續底薪視作業技能調整增加 非相關科系有興趣培養一技之長者，歡迎來學習!! 工作地點: 桃園市中壢區新生路三段255巷99號（勿直接來上班地點面試） ╭━━━✨░創░造░你░的░薪░人░生░✨━━━━╮ 請投履歷or 截圖+賴呦~ 截圖✂加 LINE ID: rock1100v 留下訊息〖姓名+電話/組裝維修人員〗 ╰━━☎ 預約℡ 0909-043-059 劉主任━━╯

1.Design/integration and fabrication of visual system optical module also design of freeform/aspheric optical lenses 2.Diffractive optics design 3.Operation of optical simulation software (Proficiency in LightTools, COMSOL, Zemax, ANSYS Lumerical preferred) 4.Drawing of microstructure patterns and process development 5.Development and process of miniLED secondary optical structures

1. Design/develop system architecture for 3D display system including display hardware and imaging software and develop 3D imaging computing algorithms. 2. Design testing flow and process. 3. Suggest and Develop related apllications.

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for high-performance computing. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. Research and development of multi-modal perception fusion algorithm software. 2. Machine learning/machine vision, and AI/GAI/Agentic AI algorithm research and development.

(1)Responsible for automotive product development: part survey, schematics capture, layout checking, simulation, BOM generating, debugging and testing. (2)Responsible for automotive product development documents: DFMEA, PPAP…etc (3)Collaborate with layout engineers, validation engineers, software engineers, firmware engineers, power engineers and other teams to discover and solve any issues of designs in early stage to ensure and enhance the quality of the products. (4)Accomplish the products to conform to engineering specifications, customer performance expectations. Understand the vehicle certification/regulations/customer testing requirements. (5)Understand the factory production process and testing methods.