轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5301&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Facility Computer Integrated Manufacturing Department (FDCIM) is part of the Intelligent Manufacturing Center (IMC) at TSMC. It is primarily responsible for the development and maintenance of the following products: 1. Development and maintenance of manufacturing-related report products for wafer fabs. 2. Development and maintenance of engineering-related report products for wafer fabs. 3. Development and maintenance of digital operation system products for facility management. 4. Development and maintenance of big data application system products for facility management. 5. Development and maintenance of facility management AI and machine learning related algorithm development and application system products. FDCIM also employs software engineering and modular development techniques, combined with high-performance database application technologies, to develop systematized software with a unified version control system that accommodates different time zones and languages globally. In addition to its regular software product development work, FDCIM is also engaged in the research and development of new technologies, including the application of DevOps, Microservices, MLOps, AIOps, and more. Responsibilities: 1. Develop and maintain AI/ML systems and algorithms 2. Collaborate with cross-functional teams to identify and solve business problems using AI/ML techniques 3. Design and implement machine learning models and data pipelines 4. Test and validate AI models for accuracy, scalability, and efficiency 5. Deploy AI solutions to production environments 6. Stay up-to-date with the latest advancements in AI technologies and industry trends 7. Write clean and efficient code using HTML, CSS, and JavaScript 8. Optimize web applications for speed and scalability 9. Test and debug web applications across multiple browsers and devices 10. Stay up-to-date with the latest front-end development trends and best practices Work Location: Longtan/Hsinchu/Zhunan/Taichung/Tainan/Kaohsiung Upon meeting qualifications, those with strong foreign language communication skills may have the opportunity to be assigned to overseas fabs.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5302&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Quality System Development (AQSD) is part of TSMC‘s Intelligent Manufacturing Center (IMC), responsible for three main directions: 1. Use statistical methods and conditional monitoring to inspect fab control charts, providing early warning of abnormal product yields; offer a fab defense system settings comparison platform to check that machines meet the internal control anomaly conditions set by the engineering department. 2. Develop online fab analysis platforms through Big Data, Machine Learning, and Deep Learning techniques for online yield/defect analysis to ensure the quality of wafers produced in the fab. 3. Develop systems and provide logical operations to control and implement escape mechanisms for material batch changes, measurement stages, and inspection stages, ensuring quality and optimizing product sampling rules. Responsibilities: 1. Apply machine learning/optimization algorithm to build up models for optimizing semiconductor production. 2. Develop analysis and optimization methods to enhance product quality, increase tool productivity and improve people productivity. 3. Design, develop and test prediction models with real applications in manufacturing. 4. Build a flexible framework to speed up the development process of AI models, with a focus on Large Language Models (LLMs) serving. 5. Turn exciting AI prototypes/ideas into products, leveraging LLMs and other advanced AI technologies. 6. Develop next-generation AI backend systems related to large-scale real-time data access, collection, analytics and monitoring. 7. Establish and maintain MLops processes and tools, including model deployment, monitoring, and automation. 8. Continuously improve the quality of AI production systems, particularly those utilizing LLMs. Work Location: Longtan, Hsinchu, Taichung, Tainan On-Call Needs: Newcomers do not need to be on duty for the first six months. On call for 1 week every 3 months.

我們是成運汽車的研發中心，主要針對電動巴士直流充電樁研究，與特斯拉電動車充電原理相同，加入我們就可以更了解電動車、電動巴士充電原理、相關通訊PLC技術上的能力成長。任何建議我們都樂意傾聽，大家一起分享自己的觀點，不畏懼挑戰，如果您對電巴充電樁研究有興趣，歡迎您的加入 #工作內容 1.透過雲端後台與管理系統分析問題與提出改善報告 2.現場與基礎建設廠商對應及安裝、測試充電站 3.技術服務協助（維護、分析和故障排除） 3.對客戶、服務團隊人員教育訓練 4.主管交辦事項

1.系統分析、需求訪談 2.全端OA系統開發(Java、MSSQL、HTML5、JavaScript、CSS3) 3.系統核心功能設計開發 請至永信藥品官網登錄線上履歷，將優先閱覽履歷機會。 (線上履歷登錄網址：https://www.ysp.com.tw/tw/hr_recruit)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4587&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop and implement test plans for HBM components and systems 2. Perform testing to validate design and ensure compliance with industry standards 3. Develop test programs and scripts to automate testing processes 4. Work with cross-functional teams to identify and resolve issues 5. Analyze test data and provide recommendations for design improvements 6. Collaborate with customers to understand their requirements and provide technical support 7. Keep up-to-date with industry trends and advancements in HBM technology

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4589&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop, test, and integrate HBM solutions into products. 2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 3. Work closely with memory vendors to develop and optimize HBM solutions. 4. Create and maintain technical documentation related to HBM integration and testing. 5. Troubleshoot and resolve issues related to HBM integration and performance. 6. Participate in the development of new products and technologies related to HBM.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4588&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop and implement test methodologies for HBM packages 2. Design and develop test hardware and software 3. Collaborate with design and product teams to ensure package designs meet specifications 4. Develop and execute test plans to validate package designs 5. Analyze test data and provide feedback to design and product teams 6. Develop and maintain test documentation and procedures 7. Participate in cross-functional teams to resolve issues and improve processes 8. Stay up-to-date with industry standards and trends

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=555&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Job Responsibilities: Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16482&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality. Job Responsibilities: Your responsibilities include: 1. Automation and Scripting (1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. (3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications. (2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability. (3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality. (4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5419&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC IT is actively seeking Software & DevOps Engineers to build and scale next-generation intelligent manufacturing platforms and products (e.g., Intelligent Manufacturing, Engineering Control, Tool Automation, and AI-based BOTs, etc.). In addition to software development, your duties involve interacting with various engineering teams and working closely with operations and infrastructure teams. This is a lifetime career opportunity to invent the future and propel TSMC to the next level. Responsibilities: 1. Cloud-native micro-service architecture design and implementation. 2. Refactor existing monolithic applications to cloud-native architecture. 3. Work with SRE to decide SLI (Service Level Indicator)/SLO (Service Level Objective) and monitor these SLIs. 4. Design the service monitoring and alerting system to monitor and resolve production service issues. 5. Constantly improve automation on service maintenance and operations. 6. Task management and product release management. 7. Drive a culture of high-quality software development and deployment processes. 8. Lead new IT technology evaluation and adoption. The complete interview process includes: 1. Manager interview. 2. Hackerrank test. 3. On-site personality and English test(which could be replaced if you have a script of an officially recognized English test. 4. HR interview. 5. Second manager interview. (Optional assessment) 6. Technical review. (Optional assessment)