轉職熱搜工作

伺服器機構設計 (課級~經理) 條件: Minimum qualifications - BS in Mechanical Engineering or equivalent practical experience. Excellent 3D CAD skills - Experience with ProE 5~8 years’ experience for the mechanical detail design on assigned components for server or PC - Experience with computer electro-mechanical assembly. Responsible for testing, analysis and debug on assigned mechanical prototypes. Preferred qualifications Understanding of precision sheet metal fabrication processes (NC punching, press brake forming, hardware insertion processes), hard tooling fabrication processes (metal stamping) and plastic injection molding processes. Excellent communication and interpersonal skills. Ability to analyze options for critical design elements and features and determines optimum selection.

1.新專案規劃 2.設計團隊領導與管理 3.客戶溝通與協調 大學以上機械工程科/系/所畢。 具8年以上Notebook PC設計與開發經驗(含1年以上專案主導及客戶溝通經驗，2年以上模具(塑膠、板金)發包製作流程管制經驗)。 熟PRO-E及設計流程。

1. 碩士(含)以上機械、工業設計 及模具相關科系畢 2. 曾擔任IT大廠機構設計處級主管( 含)以上職務五年以上經驗，且帶領25人以上的研發團隊 3. 有手機、電腦、 3C 產品等外殼之塑膠件及五金板金件等 產品之機構 設計、製作之經驗，並能設計該產品所需大量生產用之模具之經驗10年以上 4. 有規劃機構開發未來技術發展及執行的能力 5. 熟悉 ANSYS、LS-DYNA、Flotherm 者，優先錄用

大專以上機械工程系/所畢，具10年以上Notebook PC或相關產品機構設計經驗，具主管經驗者佳，略通英文，熟Pro/E和設計研發流程。

1.博士15年/碩士20年以上相關經驗 2.在國內電子大廠(5,000人以上，年營業額台幣300億以上)，擔任過Corporate One-down 或Two-down 至少三年之研發主管，且具有cross-site之管理實務 3.有巨觀系統產品整合的經驗, 對於客戶或BU所提出的PRD, 能展開成對應的執行計畫與列出合理的可完成的schedule. 4.有微觀系統整合的經驗, 能掌握key components, such as: Touch Panel, Scanner等之特性 5.可接受短期出差 1.提升機構設計/工業設計水準 2.擴大推展CAE之運用 3.改善開發設計流程 4.管理相容性測試和環境應力測試 5.負責安規之設計及認證申請 工作地點台北或竹科或中區

1.集團設備開發規劃與整合 2.集團研發專案績效管理 3.新市場新技術新應用規劃 4.技術人員能力培訓、精進與提升 需求條件: 1. 10年以上設備研發經驗並具有5年以上之研發主管經驗 2. 熟悉Auto CAD、Solidworks、Solidedge繪圖軟體或PLC控制系統... 3. 英文讀、寫精通，說普通

Thermal Department Leader [工作內容] Ø 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak) Ø Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. Ø Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. Ø Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. Ø Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. Ø Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. Ø Develop, review and edit project reports, and report to customers. Ø Assist with developing proposals and new business leads. Ø Maintain and grow existing customer contact and relations. Ø Extensive knowledge about heat transfer and energy conversion system is a must. Ø Ability to independently learn new engineering analysis tools and apply them into projects. Ø Previous research and development experience is preferred. Ø Software developing experience is requested, but not required.

設計經理 臺中市大肚區 120萬/年 碩士以上(含) 有機構設計經驗與資歷 熟悉Solidwork 有管理部門經驗 1. 規劃工程圖圖框 2. 專案設計開發、工程圖檔繪製 3. 圖面審核 4. 執行設計部ISO流程 5. 部門設計工作分配，進度規劃與掌握 6. 整機機台設計評估、規格及零件廠牌評估、自動化整合 7. 跨部門溝通協調與整合 8. 現場異常狀況排除、判斷 9. 現有機行優化 11. 年度工作計畫 12. 風險管理與品質控制 13. 主管交辦事件 14. 可配合加班

大專以上機械/航空/物理/系/所畢，具10/6年以上Notebook PC或相關產品熱模組熱流設計/測試/熱事件排處經驗，具3/1年主管經驗者佳，略通英文。