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  • 【白領專區】職缺豐富歡迎人才加入!(幼獅廠)-輪班 _新人獎金$40,000元

    月薪 31500~53000元 桃園市楊梅區 工作經歷不拘
    技術師: ◆ 工作內容 1. 機台操作、異常處理 2. 品質檢驗分析 3. 部份單位需穿著全套無塵服及使用顯微鏡 品管技術師: ◆ 工作內容 1. 品質檢驗、品質控管、 儀器校驗 2. 切片分析、化學藥劑品質檢驗分析 3. 機台操作、異常處理 4. 基本文書/電腦操作(Excel) 5. 部份單位需穿著全套無塵服及使用顯微鏡 設備助理工程師: ◆ 工作內容 1. 例行設備保養與維護 2. 設備異常排除 3. 相關科系畢業者(電子、電機、機械) 廠務助理工程師: ◆ 工作內容 電力: 1. 電機/電子相關科系佳 2. 有乙級鍋爐/甲匠,相關證照佳 水務: 1. 廠務系統例行保養維護及異常處理 2. 純軟水、廢水處理、回收、供藥等系統運作 空調: 1.冷凍空調/電機/電子科系相關科系。 2.生產區域反映問題處理及回報。 3.空調設備定期維保及故障排除。 4.有相關證照者佳。 月薪區間:另計”依營運需要常態性加班費”、”月紅利獎金”及”技術津貼” ◆ 工作時間 1.做四休二,每日12小時(實際工作10小時,內含固定加班2小時) 【日班】08:30~20:35 【夜班】20:30~08:35 2.依部門需求,需配合安排日/夜班別、加班、平均三個月輪班 3.依營運需求,需配合班制及配合固定加班或不加班 ◆ 面談時間 【週一~五】9:00~11:00、13:30~16:00 ◆ 期間限定招募獎金 1.新人獎金最高可領40,000元 2.回任獎金最高可領20,000元 註:發放金額及時間、相關規定,入職後請參閱公司內部公告,依入職後的公司實際內部公告內容為主。 ◆ 另計”依營運需要常態性加班費”、”月紅利獎金”、” 技術津貼”、”年終獎金”、”分紅” ◆備有員工宿舍(僅供外縣市同仁申請),員工汽機車停車場,歡迎各地求職者應徵
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  • 【白領專區】職缺豐富歡迎人才加入!(新豐廠)-日/夜/輪班 _新人獎金$40,000元

    月薪 31500~56500元 新竹縣新豐鄉 工作經歷不拘
    技術師: ◆ 工作內容 1. 機台操作、異常處理 2. 品質檢驗分析 3. 部份單位需穿著全套無塵服及使用顯微鏡 品管技術師: ◆ 工作內容 1. 品質檢驗、品質控管、 儀器校驗 2. 切片分析、化學藥劑品質檢驗分析 3. 機台操作、異常處理 4. 基本文書/電腦操作(Excel) 5. 部份單位需穿著全套無塵服及使用顯微鏡 設備助理工程師: ◆ 工作內容 1. 例行設備保養與維護 2. 設備異常排除 3. 相關科系畢業者(電子、電機、機械) 廠務助理工程師: ◆ 工作內容 電力: 1. 電機/電子相關科系佳 2. 有乙級鍋爐/甲匠,相關證照佳 水務: 1. 廠務系統例行保養維護及異常處理 2. 純軟水、廢水處理、回收、供藥等系統運作 空調: 1.冷凍空調/電機/電子科系相關科系。 2.生產區域反映問題處理及回報。 3.空調設備定期維保及故障排除。 4.有相關證照者佳。 ◆ 月薪區間:另計”依營運需要常態性加班費”、”月紅利獎金”及”技術津貼” ◆ 工作時間 1.做四休二,每日12小時(實際工作10小時,內含固定加班2小時) 【日班】08:30~20:35 【夜班】20:30~08:35 2.依部門需求,需配合安排日/夜班別、加班、平均三個月輪班 3.依營運需求,需配合班制及配合固定加班或不加班 ◆ 面談時間 【週一、三、五】13:30~16:30 ◆ 期間限定招募獎金 1.新人獎金最高可領40,000元 2.回任獎金最高可領20,000元 註:發放金額及時間、相關規定,入職後請參閱公司內部公告,依入職後的公司實際內部公告內容為主。 ◆ 另計”依營運需要常態性加班費”、”月紅利獎金”、” 技術津貼”、”年終獎金”、”分紅” ◆備有員工宿舍(僅供外縣市同仁申請),員工汽機車停車場,歡迎各地求職者應徵
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  • 機械維修工程師

    月薪 35000~45000元 桃園市蘆竹區 1~2年工作經驗
    國內空壓機大廠~復盛空壓機之售後保養及維修.
  • 機械繪圖工程師(AutoCad)

    月薪 36000元 桃園市大園區 1~2年工作經驗
    1) 產品零件圖面繪製;工具軟體AutoCad 2) BOM表、結構圖製作。 3) ***具證照與實務機械繪圖經驗者薪資另議***。
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    交通補助年終獎金
  • 【2026 TSMC Campus Recruitment】儲備模組副工程師Module Associate Engineer (MAE)

    面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19045&source=1111&tags=Domestic+Campus+2026_1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 模組副工程師職位,旨在培育未來的工程專業人才。您將參與至多十二個月的全面性訓練課程,當通過考核展現您的技術能力與問題解決能力後,您將正式成為模組副工程師。在訓練期間,您將接受全面性的技術課程與實務操作,並參加相關考核,包括技術測試及工作績效評估。若考核結果未完全符合要求,公司將提供額外指導與學習資源,並安排您進入績效改善計畫,協助您提升技能並發揮潛力。若最終未達成預期目標,公司將與您討論職涯規劃的下一步安排。 工作內容: 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 需配合日、夜/假日班輪值(約每四週輪值一次大夜班,一次輪值六天),實際安排將依工作需求及培訓進度調整 5. 加入台積電,您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金:尚未成為正式模組副工程師期間,若跟值夜班,將發放跟值獎金NT$4,500;正式成為模組副工程師後,每月獨立輪值大夜班一次(六天),將發放大夜獎金NT$8,000。(上述獎金若大夜班未滿六天將依比率計算) (3) 分紅獎勵:每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展,以及職涯升遷: (1) 專業訓練:全球最先進的中科訓練中心,十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷:垂直往上或水平轉換的職務機會,永不設限 C. 高規格的工作環境: (1) 美食饗宴:24小時提供多樣化異國美食 (2) 休假優給:給予優於勞基法之彈性休假及病假 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。
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  • 【製程設計類】佈局工程師Layout Engineer(ABF Flip Chip/FC-BGA)(桃園廠)

    面議(經常性薪資達4萬元或以上) 40000元 桃園市新屋區 工作經歷不拘
    1.負責 ABF Flip Chip(FC-BGA / FC-CSP)載板 Layout 設計 2.依 IC 封裝規格進行: | Bump / Pad assignment | RDL / Trace routing | Power / Ground 網路規劃 3.與客戶進行技術溝通與問題改善
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  • Machine Learning SW Engineer

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. GPU computation for mask defect detection. 2. Transformer/style transfer to simulate tool’s inspection images for inline defect check. 3. CNN for auto defect classification. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 【2026 TSMC Campus Recruitment】Process Engineer (PE)

    面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19038&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 【2026 TSMC Campus Recruitment】Equipment Engineer (EQ)

    面議(經常性薪資達4萬元或以上) 40000元 新竹縣寶山鄉 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19039&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎,我們在生產線上,負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題;如此可減少機台當機的時間與提升機台可運轉的時間,進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • IT AI/ML Engineer

    面議(經常性薪資達4萬元或以上) 40000元 新竹市 工作經歷不拘
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=462&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As an AI/ML Engineer, you will be a key member of a versatile team focusing on both algorithm development and platform implementation for TSMC’s R&D, Fab, Business, IT, and Security functions to improve productivity and work quality. The role involves developing AI/ML solutions, implementing scalable platforms to support AI productionization, and maintaining the lifecycle of machine learning models. Responsibility: Common Responsibilities 1. Collaborate with cross-functional teams of data scientists, ML engineers, and software developers. 2. Drive the complete AI solution development stages from data collection, exploration, and feature engineering to model evaluation and error analysis. 3. Perform model lifecycle management to ensure the validity of models in production. 4. Exercise sound judgment in determining if business problems can be addressed through AI/ML and communicate results effectively to domain users. 5. Operate and maintain scalable, highly available AI platforms with continuous measurement and quality improvement to meet SLO/SLAs. Differentiated Responsibilities 1. AI/ML Solution Development (1) Develop AI/ML algorithms that optimize manufacturing processes, improving productivity and work quality. (2) Explain AI/ML models to internal customers and conduct error analysis. 2. AI Platform Development (1) Design and implement full tech stack solutions, including data-related technologies and AI platforms. (2) Develop tools, automation, and microservices to extend platform capabilities. (3) Manage container-based workloads and process high volumes of data in environments like Kubernetes. Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of officially English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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