轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=462&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As an AI/ML Engineer, you will be a key member of a versatile team focusing on both algorithm development and platform implementation for TSMC’s R&D, Fab, Business, IT, and Security functions to improve productivity and work quality. The role involves developing AI/ML solutions, implementing scalable platforms to support AI productionization, and maintaining the lifecycle of machine learning models. Responsibility: Common Responsibilities 1. Collaborate with cross-functional teams of data scientists, ML engineers, and software developers. 2. Drive the complete AI solution development stages from data collection, exploration, and feature engineering to model evaluation and error analysis. 3. Perform model lifecycle management to ensure the validity of models in production. 4. Exercise sound judgment in determining if business problems can be addressed through AI/ML and communicate results effectively to domain users. 5. Operate and maintain scalable, highly available AI platforms with continuous measurement and quality improvement to meet SLO/SLAs. Differentiated Responsibilities 1. AI/ML Solution Development (1) Develop AI/ML algorithms that optimize manufacturing processes, improving productivity and work quality. (2) Explain AI/ML models to internal customers and conduct error analysis. 2. AI Platform Development (1) Design and implement full tech stack solutions, including data-related technologies and AI platforms. (2) Develop tools, automation, and microservices to extend platform capabilities. (3) Manage container-based workloads and process high volumes of data in environments like Kubernetes. Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of officially English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=328&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Develop AI rule generator and QC pattern generator for complex design rule. 2. Automation for Design Rule Quality Check flow by python. 3. Automation for Design Rule Quality Check flow by excel VBA. 4. Advance technology and design co-optimization for manufacturing & PPAC.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=323&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Overseeing the daily operations of IC foundry to ensure that all profiling operations, work flow, and customer reports are consistent with agreed upon service operations. 2. Analyze production related data and provide dynamical strategies to achieve organization production goals & KPI. 3. Assisting with scheduling projects to be completed, running projects upon compound receipt, analyzing data using database systems/tools built and updating tracking programs to keep operating smoothly. Schedule work plans in order to meet customer and business expectations. 4. Responding quickly to change priorities and handle multiple projects with potentially overlapping deadlines. 5. Contributing ideas and suggestions to improve standard techniques, protocols and processes. 6. Interacting with different functions like PE, PID and EQ to ensure robotic workstations, detection instruments, and database/informatics tools are built to meet the demands on the service. 1. 智慧製造工程師將學習領先全球之人工智慧製造技術。 2. 大數據分析、提升生產製造效率 : 透過數據分析，找出瓶頸機台，提升機台生產效率。突破性的分析派工專案系統，優化生產資源與最佳化製造效率。 3. 機器學習、創造無限可能 : 利用機器學習的研究方法，應用於生產流程改善，進而開發獨步全球的創新應用，達成生產排程的最佳化以及晶圓產出極大化。 4. 世界職涯舞台、晉升科技菁英 : 加入全球最先進的科技行列，與全球接軌，航向無限可能的未來！等待你的加入！

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=322&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Overseeing the daily operations of IC foundry to ensure that all profiling operations, work flow, and customer reports are consistent with agreed upon service operations. 2. Analyze production related data and provide dynamical strategies to achieve organization production goals & KPI. 3. Assisting with scheduling projects to be completed, running projects upon compound receipt, analyzing data using database systems/tools built and updating tracking programs to keep operating smoothly. Schedule work plans in order to meet customer and business expectations. 4. Responding quickly to change priorities and handle multiple projects with potentially overlapping deadlines. 5. Contributing ideas and suggestions to improve standard techniques, protocols and processes. 6. Interacting with different functions like PE, PID and EQ to ensure robotic workstations, detection instruments, and database/informatics tools are built to meet the demands on the service. 1. 智慧製造工程師將學習領先全球之人工智慧製造技術。 2. 大數據分析、提升生產製造效率 : 透過數據分析，找出瓶頸機台，提升機台生產效率。突破性的分析派工專案系統，優化生產資源與最佳化製造效率。 3. 機器學習、創造無限可能 : 利用機器學習的研究方法，應用於生產流程改善，進而開發獨步全球的創新應用，達成生產排程的最佳化以及晶圓產出極大化。 4. 世界職涯舞台、晉升科技菁英 : 加入全球最先進的科技行列，與全球接軌，航向無限可能的未來！等待你的加入！

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=517&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Ideal candidates would have either a Master’s degree or a Ph.D. in computer science, information systems, information science or related fields. The responsibilities of this role include developing machine learning, deep learning, text mining, and/or network science-based approaches to extract insights from structured (transactional) and unstructured data sources.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The AI4BI team serves as the central intelligence hub within the Corporate Planning Organization (CPO). Our mission is to empower business users with AI-driven solutions that enhance customer satisfaction and streamline operational efficiency. We work closely with stakeholders who blend deep domain expertise in areas like demand and capacity planning with strong analytical capabilities. As an AI Engineer in the Product Innovation department, you will collaborate closely with product managers, designers, and internal business users to prototype and integrate new features into products. You are self-motivated and naturally curious, driven to innovate and deliver impactful results. Responsibilities: 1. Drive Innovation and Impact: Pioneer novel AI/ML solutions from initial concept to functional prototype. Shape the future of our internal product with your discoveries. 2. Collaborate with Business Users: Work closely with internal stakeholders to understand needs and translate them into actionable AI-driven solutions that create measurable value. 3. Apply Smart AI Techniques: Choose and implement the appropriate methods—classic machine learning, deep learning, or generative AI—to effectively solve diverse problems. 4. Partner Across Teams and Geographies: Collaborate with cross-functional, global teams including AI researchers, engineers, and domain experts to integrate AI into production systems. 5. Share Knowledge and Stay Current: Communicate insights through data storytelling, mentor colleagues, and proactively adopt emerging AI/ML trends to continuously improve solutions.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.