轉職熱搜工作

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Assembler - Mechanics/ Electrical is to manufacture SUSS products in accordance with the established specification statements. Ensure the planned outputs are delivered based on good quality standardization and on time delivery. Improvement / Kaizen for the quality, production activities and related processes. Tasks: - Assemble and trouble shooting for SUSS systems / modules in a clean room environment. - Support process improvements, Lean Manufacturing and Quality improvements - Quality: o Produce SUSS systems / modules in accordance with established specifications. o Observe and report systems / modules issues and support on solution to avoid the defect pass through to next steps. o Contribute to the quality improvement of products and processes. o Apply and follow 5S in all working area - Production: o Manufacture SUSS systems / modules according to the established procedures. o Solve any technical problems that occur during assembling. o Contribute to the improvement of products and processes. o Set an example to other members of the team. o To have overview of total process from assembly through to output and act as a reference source for problem solving in the area of expertise - Skills: o Acquire sufficient knowledge of new and established products and processes, modifications, sub-modules and complete systems. o Have an in-depth knowledge of the correlation between the module and the whole system and the relationship with other (sub) systems. o Support good teamwork by the search for solutions and ideas arising from input and the implementation of departmental tasks. - Planning: o Coordinate the activities given in the production plan and monitor the practical situation and progress. o Closely control the use of tools, materials and equipment. - Others: o Other tasks assigned by supervisor 工作內容: 1. 負責半導體設備、模組及機台組裝。 2. 依圖面及作業標準執行機械組裝、配線及配電作業。 3. 進行元件安裝、參數設定及功能測試。 4. 執行組裝過程中的異常排除與問題回報。 5. 使用相關工具及量測設備完成作業。 6. 依SOP執行生產作業，確保品質與交期。 7. 配合5S管理及品質改善活動。 8. 撰寫組裝、測試相關紀錄。 9. 配合無塵室作業。 10. 其他主管交辦事項。 Hands-on test 考試題目 (機械組裝): 1. 牙孔製作 2. 使用游標卡尺 3. 機械加工圖面視讀 Hands-on test 考試題目 (電子組裝): 1. 焊接 2. 配電 3. 簡易電路圖視讀

1. 自動化設備現場問題排除改善。 2. PLC程式控制、HMI人機介面使用(編寫與修改)。 3. 維護工廠自動化搬運設備(STK/AGV/LD/ULD)及異常排除。 4. 自動化設備功能優化，熟AutoCAD繪圖，邏輯能力佳優先。 5. 跨部門合作，配合上位系統及主製程設備溝通與討論。 6. 現場設備對應及包商管理。 7. 相關文件、報告撰寫。

1.維護機台的正常運作，例行性與預防性保養 2.瞭解機台的運作原理，具故障異常排除改善能力 3.建立機台使用及修繕SOP作業流程 4.根據產線及製程需求，進行機台的調整與改裝 5.設備相關專案執行 –––––––––––––––––––––––––––––––––––––––––––––––––––– *具備設備工作經驗1年以上，能夠獨立作業 *電機相關科系畢業 *常日班，不需輪班 *熟PLC，具設備規劃能力佳 ☆到職滿6個月，留任獎金最高20400元☆ ★提供汽/機車停車場 ★提供完善新人職前教育訓練課程，歡迎無經驗者加入 ★提供冷氣員工宿舍

**製程工程師** 1.製程設定(兼顧品質與效能) 2.異常分析與改善、良率提升 3.新製程/新技術導入 **設備工程師** 1.維護機台的正常運作，例行性與預防性保養 2.瞭解機台的運作原理，具故障異常排除改善能力 3.建立機台使用及修繕SOP作業流程 4.根據產線及製程需求，進行機台的調整與改裝 5.設備相關專案執行 **製造工程師** 1.據人力、設備、物料及能源等生產要素，制定及控制生產計畫 2.依據工程原則及安全規定，建立標準SOP作業程序 3.評估最適化之產品生產流程，制定製造程序及標準 4.現場品質良率改善、人員訓練管理/品質管控，工作進度跟催 **生管工程師** 1.接單和投料規劃 2.生產計劃與分析 3.負荷分析 4.資料庫維護及各項管理報表製作 5.跨部門溝通協調 6.主管交辦事項 **整合工程師** 1.NPI導入 2.專案開發 3.良率改善 4.客戶服務

1. 掌握產品製程流程、連續製程的維持與改良 2. 製程整合技術文件的維護與修訂 3. 分析製程數據，持續改進製程能力 4. 低良率分析，運用各類物性化性分析儀器及製程數據資料找出異常原因 5. 整合產品異常問題，提升產品良率，協助製程改善，以順利導入量產 6. 缺陷、異常問題跨製程研判處理、追蹤與解決 7. 支援製程開發所需之技術模組發展工作 8. 客戶端產品及技術支援 9. 態度積極進取，能獨立自主，跨部門溝通，使命必達 ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––- *製程相關工作經驗1-2年佳 *具備外語能力中等 *邏輯分析能力及對外客戶溝通能力 *熟 Microsoft 辦公室應用軟體(Excel/PowerPoint)者佳

*YIP主管: 1. 製程異常與生產履歷解析層別 2. 製程缺點解析 3. 良率解析與提升 4. 數據分析報表與報告 5. 定期召開良率檢討會議 6. 跨部門溝通協調 *YIP工程師: 1. 製程缺點解析與生產履歷解析層別 2. 數據分析報表與報告 3.Yield Dashboard資訊校確及介面維護改善 4. 定期召開良率檢討會議 5. 跨部門溝通協調 *YIP FM工程師: 1.無塵室潔淨度改善相關工作 2.SPC異常分析及PDCA循環改善 3.BKM 各廠FM改善方法

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Key Responsibilities: • Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN • Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events • Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope • Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team‘s technical proficiency • Take accountability and ownership of critical tasks and projects assigned by supervisor Requirements: • Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering • 6+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications • Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains • Demonstrated experience in managing complex projects or tasks • Analytical skills, self-motivated, resilience characteristics with good accountability

1.規劃每日工單下線排程及要求生產配合 2.收集與分析各製程站生產週期能力及限制條件 3.急件材料交期之跟催及回覆 4.排除廠內生控人員異常狀況 5.規劃與控制投入之材料規格 6.確認每日收料與營收達到預期目標 7.其他上級交辦事項