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  • <Automotive>Automotive Packaging Engineer/Technical Manager

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗
    1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.
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  • DFT/MBIST engineer for advanced process node & package technology

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗
    1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip
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  • Advanced process technology development

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗
    1. 先進製程技術製程開發 2. 先進封裝技術開發
  • <Data center>Principal Product Engineer – Optical Products

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 10~11年工作經驗
    Role Summary: We are seeking a Principal Product Engineer to support advanced optical product development, NPI, manufacturing transfer, production ramp, and sustaining engineering in Taiwan. This is a senior individual contributor role requiring deep hands-on experience in fiber optics, optical module manufacturing, process integration, yield improvement, and cross-functional execution with engineering, operations, quality, supply chain, and contract manufacturing teams. The ideal candidate will serve as a technical lead for optical product engineering in Taiwan, helping drive products from development builds through qualification, pilot production, and high-volume manufacturing. Key Responsibilities: • Lead product engineering execution for optical products from prototype builds through qualification, production release, and sustaining support. • Support NPI planning, engineering builds, manufacturing readiness, test readiness, process transfer, and ramp execution. • Drive technical issue resolution across optical assembly, fiber attach, process integration, module test, final test, reliability, and customer quality. • Work closely with design engineering, optical engineering, packaging, test, reliability, operations, quality, and supply chain teams. • Partner with contract manufacturers and suppliers to resolve yield, quality, process, material, and production ramp issues. • Lead data-driven yield improvement using production data, failure pareto analysis, root-cause investigation, corrective action, and process optimization. • Support development and release of optical assembly and fiber attach processes, including process flows, control plans, inspection criteria, process windows, and manufacturing release criteria. • Provide technical leadership for product characterization, margin analysis, failure analysis, reliability learning, and production excursion response. • Help define manufacturing specifications, test limits, outgoing quality controls, and product-level production metrics. • Support customer or supplier technical escalations related to product quality, manufacturing performance, or reliability.
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  • IT 應用系統分析師 (FIN/Costing)

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗
    1. 與業務使用者進行需求訪談與流程討論 2. IT 相關服務的專案管理 3. 公司商務領域的數位化(應用系統、人工智慧、數據)轉型 1. Engagement and Process Discussion with Business Users. (FIN domain) 2. Project Management on IT Service 3. Digitalization (application, AI, data) Transformation for business domain
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  • FA工程師

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗
    1. 測試機台操作與管理. 2. 產品品質問題電性分析 3. 跨部門溝通以分析產品故障真因
  • <Data Center> 專案經理

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 8~9年工作經驗
    此職位高度重視執行力、組織協調以及所有ASIC設計的準時交付。 該職位負責協調涵蓋設計、驗證、PD、測試、DFT、封裝測試、營運和供應鏈等多個領域的複雜跨學科工作。 專案經理確保所有內部團隊從概念到生產全程保持一致,同時識別並克服所有風險和跨職能依賴關係。 This role is highly focused on execution excellence, organizational alignment and on-time delivery of all ASIC designs. This role coordinates complex multi-disciplinary efforts spanning, Design, Verification, Physical Design, Test Vehicles, DFT, Packaging Test, Operations and supply chain. The program manager insures that all internal groups are aligned from concept through production while identifying and overcoming all risks and cross functional dependencies.
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  • 客服機電工程師(新竹、台中、台南)_半導體設備大廠 (3010346)

    面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 工作經歷不拘
    職責要求 1. 無塵室自動化設備售後服務與技術支援。 2. 客戶端巡檢、維修、保養與異常處理。 3. 設備狀態紀錄、維護與檢查表管理。 4. 配合 ON CALL 輪值(提供 ON CALL 津貼)。 5. 完成主管交辦事項。 任職資格 1. 具無塵室廠區工作經驗 2. 持有職業安全衛生或室內配線相關證照 3. 跨部門協作與現場溝通能力佳
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  • 現場工安工程師(台南、新竹)_半導體設備大廠 (3010348)

    面議(經常性薪資達4萬元或以上) 40000元 台南市善化區 工作經歷不拘
    職責要求 1. 具半導體客戶廠區之工安作業經驗者佳。 2. 客戶現場作業施工區域之安全防護、作業表單督導及維護。 3. 機工具、暫存區、安全防護用具之檢點與檢查。 4. 現場異常突發事件處理與聯絡追蹤及緊急應變協助。 5. 需配合現場動態作業加班。 6. 執行主管交辦事項。 任職資格 1. 有科學園區工安經驗者佳,須配合業務需求調整工作地點。 2. 具丙種以上職業安全衛生業務主管資格者。
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  • 裝機工程師(台南、新竹)_半導體設備大廠 (3010347)

    面議(經常性薪資達4萬元或以上) 40000元 台南市善化區 工作經歷不拘
    職責要求 1. 客戶端新機安裝及驗機、交機。 2. 裝機前置作業(場刊、Move in、Marking)。 3. 裝機文件比對、填寫、送簽。 4. 客戶廠區工具、物料清點保管。 5. 完成主管交辦事項。 任職資格 1. 具無塵室廠區工作經驗 2. 持有職業安全衛生或室內配線相關證照 3. 跨部門協作與現場溝通能力佳
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