轉職熱搜工作

1. Expertise in managing critical IP technologies for HPC, such as high-speed interface, SerDes, D2D, 2.5D/3D, HBM, and advanced node process technologies, with a strong understanding of market dynamics 2. Investigate and analyze critical IP technology roadmaps, market trends and critical IP licensors business analysis as a basis to IP sourcing strategy forming 3. Mastering the decision-making groups, processes, key persons and underlying information circulated within major IP licensors, and driving substantial influence on their roadmap planning following corporate strategy 4. Leadership in collaborating with external partners, internal product marketing, internal engineers, business, financial and legal teams to proceed with on-target business negotiation and quality contract process management 1. 精於管理高效能運算（HPC）中的關鍵IP技術 (例如高速介面、SerDes、D2D、2.5D/3D、HBM等技術) 及先進製程相關技術、以及相關產業發展動態。 2. 調查並分析關鍵IP技術藍圖／市場趨勢，以及關鍵IP授權廠商之商務分析，作為制定IP採購策略的依據。 3. 掌握主要IP授權廠商之決策組織、流程、關鍵人員及資訊，配合公司策略，具體引導其相關藍圖規劃 4. 領導外部夥伴、內部產品行銷、內部工程、業務、財務及法務團隊的合作，完成符合技術合作目標之商務談判及合約管理

1. Define the roadmap and product portfolio of tablet, eReader, OTT, smart display and wearable. Drive product positioning and value propositions. 2. GTM strategy planning and execution, win design awards, and deliver revenue. 3. Customer engagement and relationship build up. 4. Collaborate closely with internal RD, PM team to understand product architecture, roadmap, and differentiating features, ensuring marketing deliverables are technically accurate. 5. Work with sales teams to support customer engagements, respond to technical inquiries, and drive product adoption.

1. Develop Playbook for ASIC design 2. Monitor the project execution based on the Playbook 3. Coordinate among different teams to improve Playbook

1. MTK AOP/LTP (Long term plan) analysis Foundry strategy. 2. Worldwide node/supplier/location capacity. 3. Foundry cost structure and pricing trend. 4. Market Intelligence and competitor intelligence.

★工作時間： 月休8~10天，固定班－中午11:00~晚上21:00，需配合公司現場狀況調整上下班時間（依勞基法規定工時規範進行排班）。 ★工作內容： 1.主要工作：負責回覆顧客訊息協助點餐、準備食材、送餐及回收餐具、入戶服務協助擺盤，並維護環境與器具設備的清潔。 2.次要工作：協助餐廳營運各項事務：如鍋底菜品傳遞、擺盤傳菜、整理餐桌、協助物品擺放、環境維護等。 3.公司提供外送服務員意外險、第三責任險及補償契約險，費用全由公司承擔。 ★應徵條件： 1.須具備合格駕照並自備機車。 2.經評估錄取需提供餐飲從業人員供膳體檢合格報告。 ★薪資： 實習期間月薪36,000元，經考核通過轉正後另享績效薪資。 ★福利： 全日免費供膳、多元獎金制度、員工折扣、春節團圓假、春酒、定期健康檢查。 ★其他補貼：油錢補貼每公里2元(按外送公里數計算)，電話補貼每月200元，公司提供外送服務員意外險、第三責任險及補償契約險，費用全由公司承擔。

- Lead and manage RFI/RFQ/SOW processes and negotiate commercial terms with AI data center clients, ensuring timely and accurate responses. - Collaborate closely with engineering, sales, and marketing teams to deliver data center ASIC solutions tailored for AI workloads. - Develop compelling product positioning and messaging for both internal and external stakeholders. - Work with field teams to assess competitive landscape and maintain market intelligence. - Support business development activities to the sales team to foster strong customer relationships. - Drive cross-functional teams to align on product specifications, timelines, and deliverables. - Prepare and present detailed product proposals and reports to executive leadership and customers. - PLM (Product Lifecycle Management), manage program from kickoff, execution, NPI all the way to volume production

1. Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful project execution. 2. Work closely with manufacturing teams to streamline processes, improve efficiency, and ensure product quality. 3. Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve any supply chain or manufacturing issues. 4. Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management. 5. Implement project management best practices, lean manufacturing principles, and continuous improvement methodologies.

1. Automotive Packaging development, New product introduction, Mass production, Supplier management.​ 2. Develop and evaluate the advanced IC Package technology.​ 3. Collaborate with the assembly subcontractors to complete the technology development.​ 4. Qualification and yield improvement for the advanced IC Packages.​ 5. Audit subcontractors.

－Product marketing, planning, and strategy for AI data center products (e.g., Server CPU, AI accelerators/XPU, switch/networking products, optical interconnect) －Product lifecycle management, from ideation and requirements definition through development, launch, go-to-market, and end-of-life －Proactively identify new market opportunities and initiate new product concepts based on market trends, customer pain points, competitor analysis, and technology evolutions. －Develop and communicate clear value propositions and product stories that resonate with customers, stakeholders, and executive leadership. －Drive cross-functional alignment with engineering, business development, marketing, and support teams to successfully deliver and launch products. －Conduct deep market and competitive analysis to inform product strategy, pricing, and positioning. －Engage with key customers, industry leaders, and ecosystem partners to gather feedback, validate product ideas, and drive adoption.

1. Work with Sales teams to get design wins for MediaTek Connectivity (Wi-Fi, and BT) at Tier-1 and leading customers 2. Promote Product Roadmap and Technology 3. Develop Ecosystem: discuss with partners (chip, HW, SW) to align on product roadmap and Go-To-Market strategy 4. Drive customer design wins and help BU to manage customer programs 5. Understand Connectivity industry trends and drive competitive positioning