轉職熱搜工作

【レイアウト設計】 DRAMメモリコアおよび周辺回路のレイアウト設計を担当します。 対象となる回路例 ・Sense Amplifier ・Wordline Driver ・I/O回路 ・周辺制御回路（アドレスデコーダー、冗長回路、タイミング制御回路、テストモード論理回路など） ・内部電源生成回路（レギュレーター、ポンプ回路） ・温度判定回路

【回路設計・シミュレーション】 DRAMメモリコアおよび周辺回路の回路設計を担当します。 対象となる回路例 ・Sense Amplifier ・Wordline Driver ・I/O回路 ・周辺制御回路（アドレスデコーダー、冗長回路、タイミング制御回路、テストモード論理回路など） ・内部電源生成回路（レギュレーター、ポンプ回路） ・温度判定回路 FinesimやHSPICEなどのツールを用いたシミュレーションを行い、スピード・消費電力などの性能を検証しながら最適な回路構成を検討します。設計者自身で実際の製品設計へ反映されるような回路構成や改善案の提案ができる点が面白さです。 【レイアウト設計・物理検証】 Virtuosoなどのツールを用いて回路図をチップレイアウトへ落とし込みます。DRC（デザインルールチェック）やLVS（回路比較検証）などの物理検証を行い、台湾本社の製造ラインで問題なく製造できる設計データを完成させます。 【評価チームとの技術連携】 試作チップの評価は台湾本社の専門チームが担当します。 設計者は評価チームとの技術的なやり取りを通じて設計意図通りに動作しているかを確認し、必要に応じて設計改善を行います。

我們在找這樣的你！ (每位應徵者最多可投遞 5 個職缺，提供研發替代役名額) 如果你是 2027 年應屆畢業之碩士或博士生，具備電機、電子、資訊、資工、資管、電信、通訊、電控等相關背景，並對半導體技術、AI 運算、無線通訊、智慧裝置、多媒體平台等領域充滿熱忱，歡迎加入聯發科技，與我們一起打造影響全球的創新科技。 我們期待你樂於學習、勇於挑戰，能主動思考並提出想法，重視團隊合作，面對困難保持好奇心與解決問題的能力，持續突破自我、追求卓越。 在聯發科技，你將與來自世界各地的優秀人才攜手合作，參與全球領先晶片產品的研發，將創新想法轉化為改變世界的技術，共同迎接每一項挑戰。

1. Optimize 6G/5G modem architecture and associated hardware/software flows in aspects of system performance/power/area (PPA) to improve product competitiveness. 2. Develop architectural simulation, system-level modeling, and analysis platforms for modem baseband system performance, low-power optimization, and hard real-time (HRT) latency analysis. 3. Collaborate closely with domain architects to deliver quantitative reports based on simulation data, driving key architectural decisions. 1. 優化 6G/5G 解調架構及相關的硬體/軟體流程，提升系統效能／功耗／面積（PPA），增強產品競爭力。 2. 開發架構模擬、系統級建模與分析平台，用於評估基帶系統效能、低功耗優化與硬實時（HRT）延遲分析。 3. 與領域架構師緊密合作，根據模擬數據產出量化報告，推動關鍵架構決策。

高速類比SerDes電路全客製化佈局設計及自動化流程設計 Fully custom layout design for analog high-speed SerDes circuit and layout automation flow development.

職責要求 •Design and debug PLL/DLL architectures and circuits (integer/fractional-N; analog or digital-assisted). •Oscillators: LC or ring-oscillator (RO) VCO/DCO, frequency synthesis, phase noise/jitter analysis and budgeting. •Delay lines, measurement/ruler circuitry, phase interpolators, and calibration/trim techniques. •DCC/DCM/DCA, clock tree/distribution, and clock management units; low-jitter clock generation and distribution networks. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Behavioral modeling (e.g., Verilog-A/SystemVerilog) to explore loop dynamics, spur/jitter mitigation and system interactions. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Design TX/RX, analog front-end, serializers/deserializers, high-speed level shifters, predrivers/drivers, and termination/impedance calibration blocks. •Equalization: Feed-Forward Equalization (FFE), DFE, CTLE and related adaptation/control loops. •Clocking support for links (e.g., CDR interactions, low-jitter clock generation/distribution as needed by PHY). •SI analysis and creation/validation of IBIS/IBIS-AMI models; channel characterization (insertion loss, return loss, crosstalk) and eye diagram margin assessment. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Support interface integration and sign-off: PPA optimization, reliability checks (e.g., EM/IR, aging/overstress), and timing closure collaboration. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Reference generation: bandgap, bias circuits, reference voltages/currents; high-accuracy, low-noise design techniques. •Low offset / low-noise voltage regulators (LDO) and stability/compensation networks; PSRR and transient response optimization. •Voltage and power monitoring circuits: droop detection, voltage detectors, PowerGood and POR generation, analog sensing, and housekeeping blocks. •Power-management components, linear and/or switching-adjacent blocks, charge pumps, as applicable to the SoC/PHY environment. •Design/support ADC/DAC blocks and associated analog support circuits (sampling, references, amplifiers/comparators, clocking). •Voltage and temperature sensor design and characterization. Bandgap and PTAT-based temperature sensing; process corner detection circuits. Sensor readout, digitization, and calibration techniques. •Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization. •Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics. •Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness. •Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists. •Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up. 任職資格 •BS/MS in Electrical/Electronics Engineering (or related). •Typically 7-10+ years of relevant experience in analog/mixed-signal IC design. •Strong fundamentals in CMOS device operation, analog design, feedback/stability, noise/jitter, and deep-submicron effects. •Proficiency with industry-standard tools (typical): Cadence Virtuoso, Spectre/ADE or HSPICE; plus modeling/scripting (e.g., Verilog-A/SystemVerilog, Python) as needed by the domain. •Ability to communicate clearly, document design decisions, and drive results in a cross-functional environment. Preferred / Nice-to-Have Experience •Experience with any high-speed interface protocols is a plus (e.g., DDR/LPDDR, HBM, UCIe, MIPI, LVDS).

職責要求 •Design high-speed TX/RX analog buffer circuits for LPDDR6 memory interfaces, including output drivers, input receivers, level shifters, termination, impedance calibration, biasing, and reference circuits. •Define and implement programmable drive strength, slew-rate control, and on-die termination schemes to meet LPDDR6 electrical and timing requirements. •Translate system and interface specifications into detailed transistor-level circuit architectures and design specifications. •Own end-to-end block/IP delivery, including architecture studies, schematic design, pre-layout simulation, post-layout extraction, and sign-off. •Build and maintain verification test benches; validate performance across PVT corners, mismatch/Monte Carlo, aging, and post-extraction parasitics. •Analyze high-speed performance metrics such as eye margin, jitter, timing skew, voltage noise sensitivity, and simultaneous switching effects. •Work closely with layout engineers to provide floorplanning guidance, review critical layouts, and ensure robust matching, isolation, and parasitic control. •Support interface integration and sign-off, including power, performance, area (PPA) optimization and reliability checks (e.g., EM/IR, overstress, aging). •Support testchip and product silicon bring-up, characterization, and correlation with simulation results; drive root-cause analysis and ECOs as needed. •Collaborate effectively with digital design, verification, layout, package, SI/PI, product, and test teams. 任職資格 •BS or MS in Electrical/Electronics Engineering or related field. •Typically 5+ years of relevant experience in analog/mixed-signal IC design, with emphasis on high-speed I/O or memory interface circuits. •Strong fundamentals in CMOS device operation, analog circuit design, feedback and stability, noise/jitter analysis, and deep-submicron effects. •Hands-on experience designing high-speed TX/RX buffers, termination and impedance calibration circuits, and voltage-domain level shifters. •Proficiency with industry-standard design tools, typically including Cadence Virtuoso, Spectre/ADE or HSPICE, and post-layout extraction flows. •Ability to clearly communicate design intent, document trade-offs, and drive results in a cross-functional environment. •Basic written English proficiency required. Candidates must be able to read and write emails in simple English to communicate effectively with non-Mandarin-speaking colleagues. Preferred / Nice-to-Have Experience •Experience with memory or high-speed interface protocols such as LPDDR, DDR, HBM, or similar interfaces. •Experience with post-layout sign-off, EM/IR analysis, and reliability-aware analog design. •Familiarity with signal integrity concepts, channel effects, and interaction between I/O circuits and package/channel parasitics. •Experience supporting silicon validation, ATE characterization, and simulation-to-silicon correlation. •Scripting or automation experience using Python, SKILL, Verilog-A, or similar for simulation regression and result analysis.