轉職熱搜工作

1. 新產品FBT (Functional test)測試治具規劃、發包、驗證、導入產線測試 2. 製作測試治具使用SOP 3. 優化治具使用效益 4. 具備治具問題原因分析、改善測試良率及效率經驗佳

1.PCB stack-up design & Constraint Rule setting. 2.Provide SI/PI design suggestions for PCB layout. 3.Signal integrity analysis of high-speed and low-speed signal interfaces. 4.Power integrity design includes DC impedance, AC resonance and capacitance optimization. 5.In addition to Cadence 2.5D EM solution as a daily necessary software, AMD SeaSim/S2Eye, Intel ICAT/IMLC/CCT are also required. 6.Use TCL and Python to shorten the complicated software operation process, generate reports and perform DOE analysis. 7.Familiar with PCB test coupon TDR/TDT measurement and Delta L 4.0 Measurement.

我們正在尋找一位具備豐富經驗的 FPGA 與 HIL 專家，主導自駕 L4 (ADAS L4) 系統的 FPGA-based HIL 模擬平台架構設計與開發。 您將負責將高頻寬的感測器訊號（如專有相機介面、LiDAR、Radar）在 FPGA 上進行即時 (Real-time) 模擬與注入 (Sensor Injection)，並與自駕域控制器 (AD ECU) 進行閉環 (Closed-loop) 測試，以驗證 L4 自駕演算法的安全性與可靠性。 一、核心職責 (Key Responsibilities) • HIL 架構設計：設計與搭建基於 FPGA (如 AMD Xilinx Zynq/MPSoC/Versal 或 Intel Agilex) 的 L4 自駕 HIL 測試平台系統架構。 • 感測器模擬與注入：開發硬體加速邏輯，實現多路相機 (GMSL2/GMSL3、FPD-Link)、LiDAR (乙太網路 Raw Data) 及 Radar 的原始數據即時模擬與硬體注入 (Hardware Injection)。 • 車用通訊整合：負責 FPGA 與域控制器之間的高速介面與車用網路通訊（如 PCIe、10G/25G Automotive Ethernet、CAN-FD、LIN）的 IP 整合與資料串流優化。 • 時鐘與同步 (Timing & Synchronization)：設計高精度的時鐘同步機制（如 PTP/IEEE 1588、GPS/PPS），確保所有模擬感測器訊號與 HIL 系統的時間戳記完全一致。 • 系統整合與測試：與自駕軟體團隊、模擬軟體團隊（如 Carla、Simulink、Cognata）合作，實現虛擬環境與真實硬體的閉環 (Closed-loop) 即時模擬。 二、必備條件 (Requirements) • 學歷背景：電子、電機、資訊、自動控制或相關科系碩士/博士學位。 • FPGA 開發經驗：5 年以上 FPGA 開發經驗，精通 Verilog / SystemVerilog 或 VHDL，並熟練使用 Vivado 或 Quartus 開發工具。 • 高速介面經驗：具備 PCIe, 10GbE/25GbE, DDR4/DDR5 等高速介面與通訊協定的開發與除錯經驗。 • HIL/即時系統經驗：具備 HIL 平台（如 dSPACE, NI, Speedgoat）或 Linux RT / RTOS 即時系統的實務開發經驗。 • 車用通訊協定：熟悉 CAN/CAN-FD, Ethernet (SOME/IP, DoIP), LIN 等車用通訊協定。

職位定位 參與應用系統與平台服務的可觀測性建置及日常維運，透過監控指標、日誌與分散式追蹤，及早發現異常、協助定位問題並恢復服務。 與開發及 DevOps 團隊協作，維護監控告警、參與事故應變、效能分析與復原演練；並透過腳本與工具開發降低重複性維運工作，依規範維護技術文件，持續提升服務可靠性。 主要工作內容 1.監控與告警處理:維護監控系統與儀表板，依告警分級處理日常告警，並回報異常狀況。 2.事故處理與檢討:參與事故應變，協助收集日誌與系統資訊進行故障排查；參與 RCA 與事後檢討，執行指派的改善項目。 3.系統效能與容量:執行負載測試與效能數據收集，協助分析系統瓶頸與資源使用狀況。 4.備份與復原:執行備份作業與還原驗證，參與災難復原演練。 5.維運自動化:撰寫腳本與自動化工具，減少重複性的人工維運作業。 6.文件與流程:依規範撰寫及更新 SOP 與技術文件，配合開發及執行部署驗證與變更作業。

Education & Experience • Bachelor’s or Master’s Mechanical Engineering or a related field. • 10+ years of experience in mechanical design, with a focus on server, data center or RAN hardware. • Experience in designing and architecting rack-level and system-level mechanical solutions. • Hands-on experience in thermal, structural, and mechanical system design for HPC and AI server architectures. Technical Skills • CAD software proficiency (SolidWorks, Creo, CATIA, or similar). • Strong knowledge of thermal management (heat sinks, liquid cooling, airflow optimization..). • Expertise in sheet metal, plastics, and die-casting design and manufacturing processes. • Familiarity with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) for structural and thermal simulations. • Experience with server chassis design, PCB and component integration, and EMI shielding. • Understanding of rack-level power and cooling infrastructure. • Familiarity with L10~L12 internal/external cable form factors and applications, as well as cable routing management, space planning, and related infrastructure assessment. Industry Knowledge & Standards • Familiarity with server industry standards. • Knowledge of data center environments and operational constraints. Soft Skills & Leadership • Strong problem-solving and analytical skills. • Ability to lead and collaborate with cross-functional teams, including electrical, thermal, and manufacturing engineers. • Experience in DFM (Design for Manufacturability) and DFA (Design for Assembly) principles. • Good communication skills for technical documentation and presentations.

1. 專案設計：負責 AWS 伺服器相關產品（包含 PCBA、系統與機櫃）之機構與 Cable 設計。 2. 解決方案提供：依據產品規格與設計規範，提供機構零件、系統及 PCBA 的最佳設計解決方案。 3. 驗證與量產：鐵/塑膠等模具試模；樣品試組驗證；機構零組件承認，使產品符合量產標準。 4. 技術文件管理：提供內部團隊、客戶及供應商機構相關的產品規格與要求（如 2D/3D 工程圖）。 5. 系統維護：負責 BOM 表的建立與維護，並操作 PDM 系統進行相關管理。 6. 問題分析：分析並解決產品機構相關問題，匯整資料並提供建議報告或解決方案。 7. 跨部門協作：與跨部門團隊、客戶及供應商進行溝通協調，確保設計與物料時程順暢。

-Foundry Transfer 1.Coordinate with respective backend NPI engineering teams the processing of technology-transfer lots from wafer fabrication out through wafer sort, characterization, qualification, and safe launch 2. Work with Fab Process Engineering and Process Integration to review process transfer status, risks, and action items. 3. Drive lot track schedules, milestones, and issues; communicate risks to the Technology Transfer Project Lead and Product Engineering Director. -Wafer Yield & Data Analysis 1.Review wafer sort data, wafer maps, WAT/PCM data, electrical yield, and parametric distributions. 2. Identify process-related yield loss, electrical anomalies, and parametric shifts. 3. Work with Fab Yield and Process Engineering teams on root-cause analysis, corrective actions, and yield improvement during safe launch through to product maturity. -Product Release Coordination - Probe, Characterization, Reliability Testing 1. Project coordinates the following key activities in the product transfer cycle 2. Wafer probe and engineering characterization activities before package assembly. 3. DC and AC characterization within the characterization team and support correlation between wafer probe, final test, and reliability data. 4. Assembly, Final Test, Reliability, Failure Analysis, Quality, Operations, and Supply Chain to support product release. 5. Interface with reliability teams for AEC-Q101 reliability tests such as HTRB, HTGB, Temperature Cycling, Power Cycling, HAST, THB, HTSL, Autoclave, and package qualification testing. 6. Support failure analysis reviews when yield, qualification, or test issues occur. 7.Prepare engineering build reports, yield summaries, qualification updates, and manufacturing readiness materials. **Please make sure to attach your most updated English resume along with your 1111 application.

1.測試團隊管理與領導： 領導 TE 部門，負責人員培訓、績效考核及資源調度。 建立標準化測試開發流程，提升團隊技術能力與專案執行效率。 2.RFI/RFQ 專案評估與提案： 負責新專案（NPI）的測試技術評估，撰寫與回覆 RFI/RFQ。 規劃測試治具/設備（Fixture/Equipment）之架構與預算成本分析（Cost Estimation）。 3.車用電子系統整合測試開發： 主導車用電子產品（Automotive Electronics）之軟/硬體整合測試方案開發。 定義測試計畫（Test Plan），涵蓋功能測試（FCT）、整合測試（EOL )及壓力測試。 4.測試方法驗證與導入： 開發自動化測試程式，驗證測試覆蓋率（Test Coverage）與穩定性。 協助工廠端導入量產測試，並解決 NPI 階段之工程問題。

1. Test Engineering management; 2. Test yield/coverage enhancement and test process enhancement; 3. Test program/fixture/equipment maintenance; 4. Leading program/fixture testing solution developmen and improvement; 5. Drive on product/ function defect analysis.