轉職熱搜工作

我們正在尋找一位技術精湛且經驗豐富的資深應用工程師加入我們的團隊。理想的候選人需具備公共工程方面的成功經驗，對台灣的採購法有深入了解，熟悉電子產品及整合解決方案，並且精通英語。本職位需要一位主動積極且注重細節的專業人士，能夠在技術解決方案和客戶需求之間架起橋樑，確保工程成功執行、符合規範並滿足客戶需求。 主要職責： 1. 進行技術評估（硬體和軟體系統），並根據客戶需求定制解決方案。 2. 作為公司與客戶之間的主要技術聯絡人，及時回應技術查詢並高效解決客戶問題。 3. 與銷售團隊、客戶、承包商以及內部團隊協作，提供符合項目目標的高質量解決方案。 4. 與亞洲投標管理部門密切合作，處理日常的詢價單（RFQ）和投標管理工作。 5. 協助審核招標文件，確保其符合法規和內部標準。 1. Conduct technical evaluations (hardware and software systems) and customize solutions to meet client requirements. 2. Serve as the primary technical liaison between the company and clients, providing timely responses to technical inquiries and resolving customer issues efficiently. 3. Collaborate with sales teams, clients, contractors, and internal teams to deliver high-quality solutions that meet project objectives. 4. Work closely with Bid Management, Asia, to handle routine RFQs and tender management. 5. Assist in reviewing tender documents to ensure compliance with regulations and internal standards.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址：https://careers.tsmc.com/careers/JobDetail?jobId=258&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Advanced module process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability qualification. 3. Process/tool transfer to volume manufacturing.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=427&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ Responsibilities: 1. Risk assessment and provide mitigation plan for IC packages by simulation and experiment. 2. Development and evaluation of new materials. 3. Continue improvement in simulation methodology, material modeling and script automation.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=435&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區，歡迎領有身障手冊或證明者加入台積公司！ Responsibilities: 1. Advanced 3DIC process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability 3. 需值小夜班 (1-2週/per year), 假日值班 (1次/2月)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=261&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Memory related circuit design. 2. 3D IC testchip design. 3. Research for in-memory & near memory computing design.

1.客戶圖面報價處裡、規格確認、承認書製作 2.五金零件製程規劃 3.協助繪製零件 4.料號建立與編碼、BOM相關資料 5.文書資料製作、整理與傳遞 6.主管交辦事項