轉職熱搜工作

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 / 相關福利 / ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / WiFi MAC Engineering / System Validation Role and Responsibilities With the approaching and widely spread of WIFI technology, Qualcomm connectivity business is growing rapidly to fulfill these AP/Station chip demands, we are actively seeking talented engineer who will be responsible for MAC Host/FW development inside hardware/system team. The candidate needs to engage team across geos and possesses with solid knowledge of 802.11AX/BE MAC protocols, linux system, and testing infrastructure. The job requires to follow the timeline strictly and have capability of fast turn-around for solution of highly complex, challenging issues. The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with world-wide design team to complete the pre-silicon verification, ASIC bring up for MAC/FW/Host, as well as system performance tuning and customer support. / Qualifications / Master’s degree in Engineering, Electronic Engineering, Computer Science, or related field. proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. / Preferred Qualifications / -Comprehensive understanding of IEEE802.11 MAC protocol design, including data t3sfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience of 11AX/BE is a plus. - Linux/firmware/embedded-system design, kernel driver development. - Pre-silicon bring-up and verification. PHY layer experience is a plus. - Understanding of ASIC verification process, WIFI testing/issue analysis. IEEE Lab certification experience is a plus. - Source code management system such as Perforce, GIT.

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽

1.資訊相關業務處理 2.公司內部電腦及系統設備安裝 設定及問題排除 3.廠區資訊系統,機房及網路環境相關規劃與維運 4.遵行並配合台北總公司相關政策佈達與實行 5.主管交辦事項 **報到初期須配合至台北總公司受訓3-6個月(提供公司宿舍)*