轉職熱搜工作

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 Role and Responsibilities： With the approaching and widespread of WIFI technology, we are actively seeking talented engineers who will be responsible for system design, validation, and optimization in the hardware/system team. As a member of the WIFI Hardware System team, you will participate in Wi-Fi system design, development, validation, integration, and performance optimization. The responsibilities cover overall chip lifecycle development, including FPGA emulation, pre-silicon verification, ASIC bring as well as system performance tuning and customer support. You will need to collaborate with SOC, analog, and algorithm teams to develop new Wi-Fi features. Requirements Minimum Qualifications: Master‘s degree in Engineering, Electronic Engineering, Computer Science, or related field. Systems Engineering or related work experience with extensive lab experience and debugging capabilities. Good team communication, documentation, and interpersonal skills. Preferred Qualifications: Experience in at least one or more of the following areas: o Communication theory, signal processing, RF Systems, Microwave engineering, signal estimation and detection, automatic gain control, RF impairment estimation and correction, channel estimation, Power control, RF interfaces and digital mitigation of RF distortion, etc. o Experience with wireless standards (WiFi/BT/5G/LTE/UMTS) o Knowledge and/or experience in MIMO, OFDM, CDMA o PHY/MAC layer systems design, spectrum sharing, and next-generation WiFi. o Experience in performance analysis and system-level simulation. o Ability to program effectively in C/C++, Python, and/or Matlab. - Experience in verification on FPGA, and system simulation is a plus. - Hands-on lab debugging/measuring skills and characterization using Spectrum Analyzer, VSG, VSA, Network Analyzer & Power Meter. -Strong analytical problem-solving approach, good communication skills, self-motivated, cheerful, and optimistic attitude. 此職缺為派遣職，一年一簽

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 / 相關福利 / ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / WiFi MAC Engineering / System Validation Role and Responsibilities With the approaching and widely spread of WIFI technology, Qualcomm connectivity business is growing rapidly to fulfill these AP/Station chip demands, we are actively seeking talented engineer who will be responsible for MAC Host/FW development inside hardware/system team. The candidate needs to engage team across geos and possesses with solid knowledge of 802.11AX/BE MAC protocols, linux system, and testing infrastructure. The job requires to follow the timeline strictly and have capability of fast turn-around for solution of highly complex, challenging issues. The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with world-wide design team to complete the pre-silicon verification, ASIC bring up for MAC/FW/Host, as well as system performance tuning and customer support. / Qualifications / Master’s degree in Engineering, Electronic Engineering, Computer Science, or related field. proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. / Preferred Qualifications / -Comprehensive understanding of IEEE802.11 MAC protocol design, including data t3sfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience of 11AX/BE is a plus. - Linux/firmware/embedded-system design, kernel driver development. - Pre-silicon bring-up and verification. PHY layer experience is a plus. - Understanding of ASIC verification process, WIFI testing/issue analysis. IEEE Lab certification experience is a plus. - Source code management system such as Perforce, GIT.

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽