轉職熱搜工作

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。  職位描述： 熟悉高科技行業中連接性部門的調試、測試、組裝、配件製備、進度管理、進出管理等工作。  學歷： 高中畢業或以上，良好的英語能力為佳。  人格特質： 靈活且樂於助人，有耐心，願意學習。 【為三個月專案性質職缺】

Skills/Experience： • With working experience in the class 1000 or higher level clean room. • With experience of equipment operation on the process equipment such as coater, printers, dispensers, cleaners, or ovens. • Or experience working on instrument operation as an optical microscope, surface profiler, or other electrical testing instrument. • Familiar with the tool operation principles, troubleshooting, and maintenance in the slit coater or photolithography, ACF bonder, COF bonder, and Resin laminator. • Good communication skills in both written and oral. Responsibilities： • Line operation Mon-Fri. AM9:00 to PM 6:00. • Daily tools startup, calibration, and setup for processes. • Tool troubleshooting and PM. • Process setup for the experiments and execution. • Data collection and/or basic analysis. • Mask/Screen design capability with CAD is a plus. 此職缺為派遣職，一年一簽

為全球第一大IC設計公司，該公司第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 行政事務為主，辦公室職，若有需求才須穿靜電服進產線 2. 協助生產管理，包括規劃生產排程、追蹤生產進度、協調各部門、協助生產成本控制等 3. 根據產線開的工單看料況、安排生產排程與人力 4. 負責資料整理、文件管理 5. 需基本的excel能力，若有Agile, oracle經驗加分 人格特質： 細心、靈活且樂於助人，有耐心，願意學習。 福利： 除了月薪再加碼享有各種禮金 [生日禮金]: NT$1,000 元 [新年獎金]: NT$2,000 元 [端午獎金]: NT$1,000 元 [中秋獎金]: NT$1,000 元 此職缺為長期派遣職

為全球第一大IC設計公司，該公司第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 ◆ 美商公司名聲響亮，制度優於勞基法福利，高度彈性 ◆ 有心進入科技業的完美跳板，刷新履歷經驗 ◆ 月薪3萬5起跳，依學經歷核薪，不浪費過往相關經歷 ◆ 教育訓練完善且全方位，無經驗者亦可重頭學習 ◆ 不用穿無塵服!! ◆ 歡迎各個階段的求職者!! ◆ 周休二日可排加班亦可休假陪伴家人，工作和家庭同時兼顧!!  職位描述： ◆ 協助研發部門的產品樣本調試、測試、組裝工作。 ◆ 需使用手工具等組裝產品。 ◆ 樣本產品包含手機、數據機等。  學歷： 高中畢業或以上。  人格特質： 細心、靈活且樂於助人，有耐心，願意學習。 福利： 除了月薪再加碼享有各種禮金 [生日禮金]: NT$1,000 元 [新年獎金]: NT$2,000 元 [端午獎金]: NT$1,000 元 [中秋獎金]: NT$1,000 元 【派遣職缺】

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 Role and Responsibilities： With the approaching and widespread of WIFI technology, we are actively seeking talented engineers who will be responsible for system design, validation, and optimization in the hardware/system team. As a member of the WIFI Hardware System team, you will participate in Wi-Fi system design, development, validation, integration, and performance optimization. The responsibilities cover overall chip lifecycle development, including FPGA emulation, pre-silicon verification, ASIC bring as well as system performance tuning and customer support. You will need to collaborate with SOC, analog, and algorithm teams to develop new Wi-Fi features. Requirements Minimum Qualifications: Master‘s degree in Engineering, Electronic Engineering, Computer Science, or related field. Systems Engineering or related work experience with extensive lab experience and debugging capabilities. Good team communication, documentation, and interpersonal skills. Preferred Qualifications: Experience in at least one or more of the following areas: o Communication theory, signal processing, RF Systems, Microwave engineering, signal estimation and detection, automatic gain control, RF impairment estimation and correction, channel estimation, Power control, RF interfaces and digital mitigation of RF distortion, etc. o Experience with wireless standards (WiFi/BT/5G/LTE/UMTS) o Knowledge and/or experience in MIMO, OFDM, CDMA o PHY/MAC layer systems design, spectrum sharing, and next-generation WiFi. o Experience in performance analysis and system-level simulation. o Ability to program effectively in C/C++, Python, and/or Matlab. - Experience in verification on FPGA, and system simulation is a plus. - Hands-on lab debugging/measuring skills and characterization using Spectrum Analyzer, VSG, VSA, Network Analyzer & Power Meter. -Strong analytical problem-solving approach, good communication skills, self-motivated, cheerful, and optimistic attitude. 此職缺為派遣職，一年一簽

1. BMS軟韌體程式設計與開發 2. 電池相關SOC, SOH演算法撰寫 3. 儲能產品的安規認證取得 4. 儲能系統測試規範建立與測試程式開發 5. 儲能系統軟體架構規劃與應用

該公司為一家美國特殊玻璃和陶瓷材料的製造商，成立於1851年，公司總部於1868年搬遷至紐約州的康寧市。 基於150多年在材料科學和製程工藝領域的知識，該通公司創造並生產出了眾多被用於高科技消費電子、移動排放控制、電信和生命科學領域產品的關鍵零件。 【主要工作內容】 • 設計電控系統，包括選擇硬體、設計整體結構、並檢查電路圖。 • 撰寫控制軟體，包含定義功能規格及編寫 PLC、HMI、SCADA 等程式。 • 參與各類型的工程專案，例如廠房擴建、新技術開發、技術轉移及流程控制改善。 • 從設計、安裝、啟動、教育訓練到技術交接，參與整個專案的全流程。 • 運用自動化整合與資料傳輸技術。 • 提供設備控制邏輯及流程設計上的建議。 【需求期待】 • 歡迎新鮮人 • 學士以上機械 / 電機 / 自動化工程或相關科系 • 對於 C, C++, C#,Python熟悉且會撰寫 • 至少 1 年工業控制或自動化相關的工作經驗或學校經驗 【薪資福利】 • 月薪$76,000~$120,000 (年薪91萬起) (依學歷/經歷核薪，應屆生起薪76K起) 【此職缺為派遣職，派遣合約一年一簽】

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / - Test planning, test case development and execution. This includes hands-on testing with various mobile/laptop/router wifi/BT products in lab and in the field. - Test case automation and maintenance. - Must be capable of prototyping, reworking, and soldering small electronic components such as resistors, capacitors, inductors, jumper-wiring, etc. in a clean method utilizing conventional lab techniques. - During chip development, power consumption and system performance verification analysis. - Collaborate with software, hardware, system team to verification new Wi-Fi features. / Required Skills / - familiar with power converter ( SMPS , LDO , PMIC ) - Ability to understand spreadsheets, schematics, layout, component datasheets, BOM parts list, etc - Familiar with TCP/IP protocol and Wi-Fi network concepts. - Comprehensive knowledge in using bench equipment (e.g. Wi-Fi tool tester, Oscilloscope, Spectrum analyzer, Sniffer, …). - Knowledge of computer programming fundamentals (Python/Perl/Shell). - Experience in Windows and Linux/IOS/Android operating system. - Experience with wireless standards (WiFi/BT) - Analytical problem-solving approach, good communication skills, self-motivated, cheerful and optimistic attitude. / Preferred Skills / - Knowledge and/or experience in MIMO, OFDM, CDMA. - ands on lab debugging/measuring skills and characterization using Spectrum Analyzer, VSG, VSA, Network Analyzer & Power Meter.

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 / 相關福利 / ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / WiFi MAC Engineering / System Validation Role and Responsibilities With the approaching and widely spread of WIFI technology, Qualcomm connectivity business is growing rapidly to fulfill these AP/Station chip demands, we are actively seeking talented engineer who will be responsible for MAC Host/FW development inside hardware/system team. The candidate needs to engage team across geos and possesses with solid knowledge of 802.11AX/BE MAC protocols, linux system, and testing infrastructure. The job requires to follow the timeline strictly and have capability of fast turn-around for solution of highly complex, challenging issues. The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with world-wide design team to complete the pre-silicon verification, ASIC bring up for MAC/FW/Host, as well as system performance tuning and customer support. / Qualifications / Master’s degree in Engineering, Electronic Engineering, Computer Science, or related field. proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. / Preferred Qualifications / -Comprehensive understanding of IEEE802.11 MAC protocol design, including data t3sfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience of 11AX/BE is a plus. - Linux/firmware/embedded-system design, kernel driver development. - Pre-silicon bring-up and verification. PHY layer experience is a plus. - Understanding of ASIC verification process, WIFI testing/issue analysis. IEEE Lab certification experience is a plus. - Source code management system such as Perforce, GIT.

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽