轉職熱搜工作

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory. Furthermore, through collaboration with worldwide colleagues, you will have the rare opportunity to apply advanced Deep Learning theories to novel application areas such as AI-designed IC and General Intelligence Conversation. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory, to obtain insights beyond mythical theories as well as to apply the right solution to novel application areas such as AI-designed IC and General Intelligence Conversation. Furthermore, you shall actively engage with worldwide colleagues and academics to nurture and build a collaborative and effective R&D environment. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

1. 應用正規方法在硬體或軟體的驗證上 2. 正規方法文獻回顧與論文分析以改善目前的使用限制 3. 規劃安排跨部門的技術教學與討論課程 4. 相關的文件撰寫與審查修改

IC 測試開發工程師 負責高速數位、類比晶片測試程式開發(AP/compu AI/ASIC/…)，產品特性異常分析與改善 新產品導入量產與生產良率測試時間優化 俱獨立帶產品作業為佳。

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. Model development (includes behavior modeling/ cycle approximate modeling/ power modeling) 2. ESL platform and simulation technology development. 3. Next-generation processor architecure prototyping and design exploration 4. Next-generation modem platform architecure prototyping and design exploration

* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. Support SoC debug flow and issue localization 5. Collaborate with cross-functional teams to optimize debug performance 6. Documentation and test specification for SoC debug features 7. Location: Taipei/Hsinchu

Requirements Elicitation, Requirements Analysis, and Architectural Design - Analyze product requirements from customer - Discuss the expectations and requests with customer - Agree or reject the requirements - Make architectural design proposals