轉職熱搜工作

We are looking for a highly experienced PISI Technical Leader to join our team. The ideal candidate will have extensive experience in Power Integrity and Signal Integrity, with a strong background in high-speed IO interface simulations and PDN analysis. As a PISI Technical Leader, you will guide customers through Signal Integrity and Power Integrity signoff, model and optimize system components, and collaborate with various teams to ensure optimal package, PCB, die, interposer, and substrate designs. 1. Guide customers to complete Signal Integrity and Power Integrity signoff. 2. Model and optimize vias, connectors, sockets, breakouts, and various system components using commercial tools. 3. Perform system-level signal integrity simulation in high-speed IOs such as PCIe, SerDes 4. Architect and simulate power delivery systems, including multiple dies, substrate, interposer, PCBs, and on-die PDN models. 5. Collaborate with multiple teams, including layout, design, and customers, to optimize package, PCB, die, interposer, and substrate designs.

1. SoC IC implementation 規劃設計 2. DFT 規劃設計 以及timing closure signoff 3. 設計方法流程開發及優化 4. 工作地點:新竹/台北

1. 分析AI應用業務落地需求，與相關部門和用戶溝通，了解系統需求和功能 2. 分析和解決系統運行中的問題，找出系統瓶頸 (包含模型推理及應用pipeline) 3. 持續改進系統性能，提出優化建議和實施方案 4. 與其他工程部門充分溝通，共同找出可行優化方案

1. AI處理器和相對應周邊IP/系統驗證環境開發 2. 從IP到系統的功能驗證和自動化環境 3. 開發低耗電和效能的測試 4. post-sillicon除錯 5. emulator 環境建立

1.Propose design verification plan and do the execution based on IP and system HW architecture/application 2.Develop design verification environment 3.Develop required verification methodology and adopt into project

• Lead the DV effort of a high-end CPU project. • Manage, coach and guide DV engineers. Follow up status and keep up the schedule. • Architect and implement top-module testbenches and their components using UVM-based methods. • Lead the effort of building in-house BFMs to facilitate co-sim based module level verification. • Architect and implement formal verification based module level testbench. • Work with the design team to create testplans. Implement checkers/assertions/coverage check points. • Work with validation folks to improve design visibility

CPU Physical design, - floorplanning, - timing closure - Physical verficiation - DFT

1. 智慧型手機系統記憶體與儲存: DRAM (LPDDR4, LPDDR5, LPDDR6...) / Storage (UFS, eMMC...)驗証 2. 系統驗証方法研究與開發 3. 規畫驗証計畫 (test plan, test case) 4. 自動化測試環境開發

* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification. * (If manager) Manage the design architecture team, focusing on both technological advancement and talent development.