轉職熱搜工作

北美電信商晶片認證 1.北美各電信商(ex: AT&T, Verizon, T-mobile) 的晶片認證所需的儀表, 基站, 實網等不同領域的驗證需求. 2.針對不同類型的客戶產品評估需求/風險, 提前規劃預測試協助客戶順利取得北美電信產品認 3.內部多專案與客戶專案並行時, 內部協調測試資源優化各專案進行度並避免客戶緊急問題延燒

我們正在尋找一位具備先進製程元件特性量測與 SPICE 元件模型經驗豐富的工程師。 * 驗證 SPICE 模型並追蹤來自晶圓廠的模擬與實測 (S2S) 一致性 * 執行廣泛的元件特性量測與分析，以利製程與元件評估及基準比較 * 建立符合內部需求的客製化內部模型 * 為設計人員提供元件與 SPICE 模型相關的諮詢與指導方針

職責要求 1.執行1.5KW~7.5KW永磁同步馬達（PMSM）及無刷直流馬達（BLDC）的驅動硬體開發，包含功率電子、電源管理、驅動電路設計。 2.熟悉DC-DC、AC-DC電路設計，包括逆變器、功率開關（如 MOSFET、IGBT）的選型與應用確保系統效率與穩定性。 3.熟悉 霍爾感測器、編碼器、電流檢測、溫度監測等感測電路 設計 4.具有電磁干擾分析(EMI)及電磁相容性(EMC)設計與測試經驗 5.跨部門溝通與協作-與企劃、研發及生產團隊緊密合作，進行產品設計、驗證與量產導入 6.會使用 Altium Designer 尤佳 任職資格 學歷與經驗： 1.電機工程、自動化控制、電子工程或相關領域本科以上學歷，碩士以上尤佳 2.3年以上馬達驅動器或電機控制系統開發經驗 分析與測試能力： 1.熟練使用示波器、功率分析儀等測試工具進行調試與性能驗證 2.具備故障排除和系統穩定性測試的經驗 3.撰寫設計驗證報告及可靠度測試計畫 加分條件： 1.具備高速電機（如無人機電機、伺服電機）控制經驗者優先考慮 2.熟悉功能安全標準（如 IEC 61508、IEC62061）者尤佳

•重點開發技術: 系統開發、高速資料實體層(physical layer) 資料傳輸軟體開發、優化硬體效能及產品量產品質控管 •主要目標: 完成Enterprise/AI/xPU等相關產業客製化IC的軟韌體開發與系統整合，並協助客戶產品量產，有SLT的經驗 •負責新產品的系統設計與開發，確保符合公司及客戶的需求 •協助量產過程中的技術問題解決，並提供專業建議以提升生產效率與品質 •與跨部門團隊合作，確保產品從設計到量產的順利過渡 •分析並改善現有系統和流程，以提高產品質量和生產效率 •參與產品測試和驗證，確保產品符合相關標準和規範

• Lead GPU verification efforts across unit, subsystem, and full-chip levels, partnering closely with GPU architects, RTL design leads, performance engineers, modeling teams, and software/firmware teams. • Develop a deep understanding of GPU specifications and microarchitecture, including the 3D graphics pipeline, compute workloads, shader cores, memory hierarchy, cache/coherency, command processing, scheduling, and control subsystems. • Define the overall verification strategy, methodology, test architecture, milestones, and quality metrics for assigned GPU IPs and/or top-level GPU integration. • Drive creation and execution of comprehensive verification plans, ensuring traceability from architectural and RTL specifications through test implementation, functional coverage, assertions, and closure. • Lead development and maintenance of scalable SystemVerilog/UVM verification environments, including reusable agents, BFMs, scoreboards, reference models, checkers, and HW/SW co-simulation infrastructure. • Guide the team in developing directed, constrained-random, stress, error-injection, and scenario-based tests for graphics, compute, memory, and control features. • Drive functional and code coverage closure through rigorous coverage analysis, identification of verification gaps, and creation of targeted tests for corner cases and late-stage bug escapes. • Own regression health for the verification scope: establish regression strategy, monitor quality metrics, prioritize failures, coordinate triage, and drive root-cause resolution with design and architecture teams. • Review verification plans, testbench architecture, test code, coverage models, and debug approaches; provide technical mentorship and guidance to DV engineers. • Partner with performance, architecture, and design teams to develop performance-verification workloads, execute emulation/prototyping runs, analyze bottlenecks, and support performance, power, and area (PPA) optimization. • Drive efficient debug of complex RTL, testbench, firmware, and HW/SW co-simulation failures, clearly communicating root cause, impact, and resolution plans to cross-functional stakeholders. • Collaborate effectively across geographically distributed teams and communicate verification status, risks, and closure plans to project leadership.

1. 協助新產品或新功能的開發專案 2. 協助工程師電子電路設計及驗證 3. 生產線測試設備的維護。 4. 熟悉烙鐵、熱風槍、示波器等電子相關工具。 5. 其他主管交辦事項

1. 測試硬體設計(Probe card, Load board, Socket) 2. 晶片驗證 3. CP/FT 測試程式開發 4. 量產維護