轉職熱搜工作
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資深工程師_ChuPei
面議(經常性薪資達4萬元或以上) 40000元 新竹縣竹北市 2~3年工作經驗1. Work on 7nm~3nm physical design implementation, methodology, and sign-off 2. Perform floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution展開 -
手機DRAM/Storage系統應用工程師
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗1. 智慧型手機系統記憶體與儲存: DRAM (LPDDR4, LPDDR5, LPDDR6...) / Storage (UFS, eMMC...)驗証 2. 系統驗証方法研究與開發 3. 規畫驗証計畫 (test plan, test case) 4. 自動化測試環境開發展開 -
Senior Package Design Engineer
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗1. Package design and planning of various product. 2. Design & layout of BGA substrate. 3. Co-work with package houses for package design 4. Development of advanced package technology. 5. Package design platform development.展開 -
RF IC design engineer
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 工作經歷不拘The candidate will design, supervise layout, help characterize transceiver front-end circuits for WiFi and Bluetooth production.展開 -
IC 測試開發工程師
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗IC 測試開發工程師 負責高速數位、類比晶片測試程式開發(AP/compu AI/ASIC/…),產品特性異常分析與改善 新產品導入量產與生產良率測試時間優化 俱獨立帶產品作業為佳。展開 -
Stress/Thermal simulation engineer
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 2~3年工作經驗1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation展開 -
DFT 工程師 – 先進製程平台(Scan / MBIST / BSD / Silicon Diagnosis)
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 4~5年工作經驗加入 MediaTek「先進製程平台 DFT」團隊,你的工作直接影響 N4/N3/N2 及更先進世代 Cloud ASIC 的可靠度與良率。 - DFT 架構與插入:針對先進節點 SoC 及 chiplet/3D-IC 設計,定義並實作 Scan(full-scan、compressor)、MBIST、BSD/JTAG 架構;使用 Synopsys / Siemens (Tessent) EDA 工具執行端到端插入流程。 - ATPG 與 Advanced Fault Model:開發並優化 stuck-at、transition delay、cell-aware、path-delay 等 fault model 的 ATPG pattern;驅動 fault coverage closure 並交付 DRC-clean pattern。 - 模擬與驗證:透過 gate-level simulation(VCS/Xcelium)驗證 DFT 邏輯正確性;解決 DFT rule violation 與 coverage gap,確保 tapeout 品質。 - 後矽驗證與測試:主導 CP / FT / HTOL / HVS 各階段 DFT 工作,包含 test mode 驗證、scan chain 連通性測試、MBIST 執行與 repair 確認。 - Volume Diagnosis 與 Yield Ramp:運用 scan/MBIST diagnosis 資料分離系統性缺陷,與製程及 FA 團隊協作加速 yield learning 與技術成熟。 - RMA / DPPM 除錯:利用 DFT diagnosis 流程調查 field return,協助降低 DPPM 並防止 escape。 - 產業前沿:持續追蹤 Cloud ASIC chiplet 測試趨勢、ATE 技術進展與 EDA 新功能,主動將新觀念帶入團隊。 職務要求展開 -
GPU HW Micro-Architecture Enginee
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 5~6年工作經驗Role and Responsibilities • Responsible for GPU cluster uArch specification, PPA (power, performance and area) optimization for industry-leading GPU hardware IP • Collaborate with Arch/Model/SW team, develop cluster level HW specification that meets feature functionality and PPA metrics • Collaborate with Arch/SW/Design team to identify and solve performance bottlenecks, power/area inefficiency issues • Guide IP design process all the way from RTL coding, verification to tape out and post-silicon debug • Proficiently use AI agent and tools to improve RTL coding, function debug and PPA analysis productivity • Execute & deliver to meet milestones/schedules. • Analyze and debug code pre-silicon and post-silicon issues. • Analyze and influence future GPU architectures. • Construct reliable & trustable relationships across teams internally & externally. • Delivering best in class GPU IP for mobile, automotive, laptop and ASIC applications展開 -
<Automotive>Automotive SoC System Architect
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 10~11年工作經驗* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification.展開 -
<Automotive>Senior Automotive SoC System Architect or Manager
面議(經常性薪資達4萬元或以上) 40000元 新竹市東區 10~11年工作經驗* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification. * (If manager) Manage the design architecture team, focusing on both technological advancement and talent development.展開
