轉職熱搜工作

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip

1. Interpret customers’ functional safety requirements 2. Derive functional and technical safety concepts from functional safety requirements 3. Develop and review the safety IP design 4. Communicate and coordinate safety designs with IP teams 5. Perform system safety analysis (ex: FMEDA)

AI Model development, system level modeling and HW/SW system level bottleneck analysis

1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases

1) 移植及建置Linux/Android/Yocto系統與相關軟體至既有SoC平台 2) 負責IC模組驗證，平台開機問題分析與解決 3) 建構及優化Booting流程 4) 系統分析與效能改善 5) 記憶體管理優化任務

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip

使用者體驗指標定義和品質保證，使用者體驗驗證工程師。 負責定義旗艦/高端/中端/低端的使用者體驗指標，預估未來用戶體驗發展，確保產品具競爭力。分析競品與客戶對接討論，開發測試手法與測試用例。 有Android phone 使用者體驗/功耗性能 設計或測試經驗，尤其有手機大廠相關測試規劃經驗者，將優先考慮。

1)建立系統級熱模型，並設計具市場競爭力的散熱解決方案。​ 2)參與制定、分析、評測SOC TDP(Thermal Design Power)​ 3) 設計、設置、執行並交付各種thermal和TDP實驗的結果，驗證SOC 和系統硬體性能。​ 4) 支援技術專案，並與其他內部組織和客戶合作，支援開發週期中的執行過程。​ 5) 執行熱模擬和驗證，並與合作單位展示和溝通成果。

1. 與業務使用者進行需求訪談與流程討論 2. IT 相關服務的專案管理 3. 公司商務領域的數位化（應用系統、人工智慧、數據）轉型 1. Engagement and Process Discussion with Business Users. (FIN domain) 2. Project Management on IT Service 3. Digitalization (application, AI, data) Transformation for business domain