轉職熱搜工作

IC 測試開發工程師 負責高速數位、類比晶片測試程式開發(AP/compu AI/ASIC/…)，產品特性異常分析與改善 新產品導入量產與生產良率測試時間優化 俱獨立帶產品作業為佳。

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

* Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification. * (If manager) Manage the design architecture team, focusing on both technological advancement and talent development.

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification

* Define and optimize SOC hardware architecture and associated software flows in aspects of system performance/power/area to improve MediaTek‘s product competitiveness. * Develop simulation and analysis platforms for performance/power/area analysis. * Work Loction : HsinChu, Taipei

- RTL/Logic Integration and Verification - Develop Timing Constraints for RTL-Synthesis and PrimeTime-STA for the blocks and the top level including SOC. - Use cdc tool to check RTL/SDC quality - Develop Power Intent Specification in UPF for the multi-vdd designs.

1.從系統應用功秏分析, 與 IP, SoC 與軟體團隊合作, 推進 SoC low power 軟硬體架構的演進. 2.產品規格定義時, 分析不同架構與 IP 選項, 在系統應用功秏體驗的差異, 產出產品應用 power dash board, 提供產品規格決策的依據. 3.執行或協助功秏量測, 與power model預估的功秏做校正 4.分析PMIC/Power rail 設計, SoC power state 與 data-path power等, 並且提出SOC 設計優化方案 5.提出系統優化的方向, 達到最佳的產品電池使用續航時間與使用體驗

1. 優化相機、影音播放與編輯等多媒體架構，最大化系統效能與使用者體驗。 2. 分析 SoC 效能瓶頸並執行系統調優，提出軟硬體架構優化策略。 3. 建立 SoC 異質運算（CPU/GPU/ISP/NPU）系統模型，探索並驗證最佳化方案。 4. 提供效能分析報告，向決策團隊提出技術發展與架構演進方向。