轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=520&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Electrical RC and Electromagnetic tool related work: 1. Work with TCAD, device and model team to simulate electrical phenomenon by 3D Quasi-Static field solvers or 3D Full-Wave Electromagnetic (EM) field solvers to come out device parasitic RC, interconnect parasitic RCLK (R: resistance, C: capacitance, L: self-inductance, K: mutual-inductance) network or passive device S-parameter/sub-circuit models for digital transient and high speed/frequency circuit simulations. 2. Collaborate with EDA partners to enable required features and target accuracy for RC extraction tools. 3. Develop RC collaterals to meet customers’ tape-out requirements. 4. Analyze RC accuracy issues, perform process and performance impact analysis, and provide novel and effective solutions. RC software related work: 1. RC extraction utility development from LVS database handling, pattern matching to final RC netlist. 2. Define software architecture, specification, algorithms, and functions for future extensions on novel device structures. 3. Software pseudocode and final coding development and maintenance. 4. Interface definition and development among TSMC RC utility and EDA RC tools. 5. Build regression and QA system. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

誠徵：品保助理工程師 1. 電子/電機相關科系畢.專上。 2. 電子廠產品品質改善或異常分析, 製程巡檢, ISO 規範執行工作 3. 無經驗可 4. 有SMT/DIP製程改善或機板維修經驗者佳 5. 有汽車駕照者佳。 NTD30,000-NTD35,000 面試時間:上午9點至12點半,下午13點半至17點 請親洽面試 (※中午12點半至13點半休息時間，謝謝~!) 《薪酬制度》 1.員工紅利 2.年終獎金 3.季績效獎金 4.三節禮品 5.勞退提撥 6.定期調薪 《員工保險》 1.勞保 2.健保 3.職災保險 《職工福利》 1.員工國內外旅遊活動 2.員工聚餐 3.年度尾牙晚宴 4.婚喪喜慶、住院等津貼補助 5.生日禮金 6.員工停車位補助 《公司制度》 1.週休二日 2.符合勞基法規定之各項休假制度 《公車、捷運資訊》 ◎公車：520或橘17搭到五權五工三路口站，藍色大樓，一樓是7-11，面試地點在6樓。 ◎捷運：(機場線)新北產業園區捷運站，轉乘公車520或橘17搭三站到五權五工三路口站，藍色大樓，一樓是7-11，面試地點在6樓。

1. 車用客戶品質窗口，負責前期品質相關討論(APQP,RFQ,PPAP..etc)與量產品質持續改善 2. 負責車用客戶異常退貨分析與溝通 3. 協助車用客戶生產品質改善 4. 推動內部品質系統流程精進

生產管理主管之儲備人才。 負責生產現場的資源調度、人員領導與品質控管，確保產線達成高效、穩定且安全的生產目標。 並落實現場 5S 與安全管理。 主要工作內容 1.生產管控：依據生管排程精準調度工序並靈活應對突發狀況，確保訂單準時交付與產線流暢。 2.人力領導：負責作業員派工、出勤管理及新進人員 SOP 培訓，擔任跨團隊溝通橋樑。 3.品質管理：落實自主檢查並協作品保進行異常分析，即時修正製程以持續降低不良率。 4.設備維護：監督機台日常點檢與自主保養，協助排除基礎故障以確保設備最大稼動率。 5.現場工安：推動 5S 環境標準化管理並嚴格執行安衛準則，確保零災害作業環境。 6.執行主管交辦事項 需能配合訂單進度彈性加班 具堆高機執照優 工作特質：具備良好的溝通協調能力、抗壓性強，能配合訂單進度進行彈性加班。 職涯意願：具備領導潛質，對製造業管理職涯有明確目標與熱忱者。

1. 主導解決客戶生產品質異常 2. 客戶端品質問題溝通協調與不良分析 (FA/8D report) 3. 推動廠內品質流程改善

1. Conducting quality check procedures to ensure high-quality deliverables.​ 2. Coordinating product quality issue to provide best-fit disposition for quality event impact material.​ 3. Ensure lessons learned from prior projects are used to improve quality management process.​ 4. Customer quality communication and RMA/FA management.

1、具有RA知識和HTOL硬體設計經驗的資深可靠性工程師。 2、展現積極的態度，開發系統級HTOL以滿足全球頂級ASIC客戶對超高速IP的需求。

1. 新產品開發討論 2. 電源管理IC及電源管理單元晶片整合 3. 與設計/生產/品保/軟體部門溝通協調 4. 晶片開發滿足智慧手機, IOT, 車用, 以及ASIC的需求