轉職熱搜工作

程式設計工程師 1.系統開發設計與維護。 2.程式功能測試。 必要條件: 1. 熟悉.NET C# , .NET MVC，基本JavaScript 2. 熟悉 MS SQL及SQL Stored Procedures

□.Net程式設計師 □從事電腦軟體的程式設計、修改、安裝、測試及維護 □臨床醫療應用軟體及物聯網開發 □歡迎僑生加入行列

1.具有視覺美感，對於新事物有強烈好奇心。 2.瞭解當前網頁設計趨勢，依據使用需求進行設計。 3.熟悉WEB、APP介面，提供良好的使用者體驗。 4.具有 Flow Chart、WireFrame 與 Mockup 的規劃與設計經驗。 5.熟悉使用者行為，並能對設計產品提出發想理念與看法。 6.具備良好溝通、獨立作業的能力，重視團隊合作。 7.擅於使用Figma開發。 8.主管交辦事項。

1. MR產品內的操作介面，從視覺風格定義到使用方式的設計及實作 。對多人社群，娛樂類別，及富有實驗性的產品有高度熱忱 。能獨立思考及設立目標，也可以與專案團隊共同討論協作 。需要勇於挑戰以及嘗試的精神，不斷探求設計及最終的成果 進行公司產品 Web、APP 的 UI/UX 設計 2.依據團隊的策略和目標，探索與發想設計方案，最佳化產品體驗 3.透過 Wireframe、UI Flow、Prototype 與團隊溝通、測試與驗證設計 4.定義設計規範並建構維護 Design System，以維持介面的一致性與可預期性 工作技能： 。Figma優先 。Sketch 。Zeplin 。Illustrator/photoshop 我們公司⼯作環境很酷，請⾒連結： https://vc.mygo.com/ 以下為相關平台， ⽬前正積極拓展海外市場，敬請參考： https://www.mygo.com/international http://www.mygo.com/ http://www.mygonews.com/

1. Development of computer vision models, including classification, object detection, and segmentation. 2. Implementation of factory projects involving data cleaning and software development. 3. Creation of new computer vision tasks and projects. 4. Maintenance of MLOps systems and the implementation of workflow pipelines. 5. Proficiency in Linux, Docker, and familiarity with MLOps is a plus.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4277&source=1111&tags=2024DomesticCampus_1111 Description: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. Integration: 1. Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. 2. Package level reliability, failure mode analysis and improvement plan. 3. Customer technical interface, new tape out and lot handle. 4. Handover developed technologies to manufacturing groups for production. Module Development: 1. Be responsible for CVD / PVD / CMP / Lithography / Etch / Polymer / Bonding / Clean module development for 3DIC projects. 2. New technology, materials survey, and process improvement on 3DIC package structures. 3. Process development and tool transfer to mass-production development. Simulation: 1. Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. 2. Practice FEM and DOE in problem solving and path finding particularly on packaging. 3. Continue improvement in simulation methodology, material modeling and script automation. Qualifications: 1. Master‘s degree or above in Chemical Engineering, Material Science, Chemistry, Physics, Mechanical Engineering, or related field in science or engineering 2. Experience in TV design or IC packaging is a plus 3. Good communication skills in Chinese and English 4. Hands-on participation and a strong sense of ownership are required 5. Strong technical problem-solving and analytical skills 6. For simulation positions, mastery of FEM software such as Ansys, LS-DYNA, Abaqus and others

The Inventec Digital Center is a research and development facility for all things related to Digital Transformation, Data-Centric AI, and Trustworthy AI. Our primary mission is to influence and empower business and corporate units with digital knowledge constructively and collaboratively. We are responsible for implementing the digital strategy, discovering insights from the data, and executing them in the company. We are a team with a broad spectrum of talents, including project managers, data scientists, AI researchers, and software engineers. The group is a flat organization, and we frequently collaborate with colleagues outside of our center, academic consultants, and business partners outside of the company. Our members thus enjoy the unique opportunity to publish in top-tier academic venues, author technical patents, and produce real-world impacts during their career in the center. 1. Anchor the stakeholders‘ or users’ problems to conceptualize and prototype improvements with company data assets. 2. Lead technical delivery on prototype analysis pipelines including but not limited to data collection, analytical method development, and presentation. 3. Capture data-added value by discovering opportunities for new methods or applications. 4. Coordinate projects and interact with cross-functional departments to enable a data-driven culture and make company data comprehensive, approachable, and trustworthy. 數位中心為一研究與發展部門。主要負責公司數位轉型以及資料驅動／人工智慧專案／可信賴人工智慧的開發。我們與公司各單位／部門合作，從資料出發，發現資料中隱含之潛力與價值，進而提出具有建設性的建議。除了公司內部各單位／部門，數位中心也頻繁的與外界產學單位合作，其中包含國內外知名大學、企業合作夥伴。中心主要工作內容包含但不局限於數位決策、挖掘資料價值、以及系統落地與執行。中心組織結構扁平，直屬於部門主管，部門同仁多元且合作密切，涵蓋專案經理、資料科學家、人工智慧研究員、以及軟體工程師。數位中心鼓勵中心同仁將成果投稿至學術會議與期刊、技術專利並期許產出能對世界產生影響 工作內容： 1. 資料結構分析: 釐清資料定義、剖析資料特性、整合資料、資料視覺化 2. 問題的定義和判別: 發掘與分析問題，提出觀察與建議，並與團隊合作建立機器學習模型演算法 3. 研究及執行可數據驅動的解決方案: 實作並改良機器學習技術，分析並建構研發、製造、營銷、管理等數據指標 部門額外福利： 【專業延伸】定期舉辦讀書會，部門同仁自發性地講解不同的專業知識，延伸同仁的技能組。 【接軌國際】鼓勵同仁參與國際會議，定額補助國際會議的差旅支出。

【工作描述】 1. 維運服務監控及回報 2. 機器效能與網路品質監控 3. 排除網路第一線問題，簡易的調整與清除快取 4. 對系統、網路、資安維運紀錄，定期追蹤並回報案件的後續處理進度 5. 對於資訊領域有熱情，能細心地完成文件記錄，並願學習相關新技能 6. 具備協調能力，態度積極並樂於解決問題 7. 系統日常debug，資料庫管理 【需求技能】 1. 具備OSI七層網路架構概念 2. 能解讀各項電腦資訊的指標名詞，如：IOPS, Mpbs, pps, bps 等 3. 良好的邏輯思考與文件撰寫能力 4. 具備基礎網路設定技術 5. 具備資料庫及程式撰寫能力 - 擅長工具：Linux,Git,Python 【其他加分條件】 1. 有CCNA或其它系統證照者 2. 計概/網路等應用相關學歷背景 3. 曾任職資訊網路產業維運工作