轉職熱搜工作

負責車用電子產品研發階段之 EMC（Electromagnetic Compatibility）及 EL（Electrical Validation）測試規劃、驗證執行與問題分析，確保產品符合客戶及車用法規要求。 主要負責工作內容如下： 1.車用產品 EMC/EL驗證規劃 2.EMC測試執行與報告撰寫 3.車用電源擾動測試 4.問題分析與改善 5.第三方實驗室驗證管理

1.Design and integrate automotive power electrical systems, considering performance, reliability, and cost-effectiveness. 2.Conduct simulation and modeling of power electronic circuits and components. 3.Perform testing and validation of power electronics hardware and software. 4.Collaborate with cross-functional teams to integrate power electronics into vehicle systems. 5.Ensure compliance with automotive industry standards and regulations. 6.Troubleshoot and resolve issues related to power electronics systems. 7.Develop and maintain technical documentation and design specifications. 8.Participate in design reviews and provide technical input and guidance.

1. Datacenter Server or Automotive power DC to DC , HSC,.. circuit schematic & layout design. 2. PowerDC / Simplis / PDN simulation. 3. LDO/POL/Multiphase VRD power circuit debug & optimize solution implement. 4. CPU / chipset IC spec & document study & review check. 5. Project schedule follow up and issue tracking. 6. CN/EN communication with tier-1 customer/team. 7. Future & Innovation DC regulation technology development. 8. LabView / Python automation SW development.

1. Power system design validation planning and issue tracking 2. Customer coordination 3. Cross function coordination 4. Supplier coordination

1.電子產品組裝,修護。 2.電機裝配完成與調整各項電子電機產品。 3.檢測各類電子電機產品。 4.維修電子電機產品。 有電子/電機裝配維修相關經驗尤佳

1. 根據專案規格, 制訂測試計劃與執行 2. 電子與電源硬體功能驗證測試、分析與製作測試報告 3. 環境可靠度實驗執行、分析與製作測試報告 4. 與開發端設計者如EE、Power、Thermal等合作, 驗證與解決設計問題 5. 參與專案開發會議與整合測試部門進度與報告 6. 回報測試進度與提供報告給客戶

1. 客戶服務與技術支援 Customer Service & Technical Support - 處理客戶退回產品（RMA）的接收、初步篩檢與故障再現（Failure Reproduction）。 - 協助完成 8D 報告、FA 報告與客戶回覆信件撰寫。 - 追蹤問題改善狀態，協助品保部與研發部完成 CAPA。 2. 故障分析與測試驗證 Failure Analysis & Verification - 使用示波器、電源分析儀、CAN/LIN 分析儀等工具進行故障模擬與驗證。 - 支援返修（Repair）與零件替換測試，記錄測試結果並歸檔。 - 維護 FA Database、RMA History 與 Lessons Learned 資料庫。 3. 服務流程執行 Service Process Execution - 依據公司標準流程執行售後案件處理（Case Logging、RMA Flow、Claim）。 - 支援產品出貨後之軟體更新（OTA Support）、系統診斷（DTC Readout）與遠端維修（Remote Repair）。 - 協助製作服務手冊與維修指引文件。 4. 內外部稽核與持續改善 Audit Support & Continuous Improvement - 準備稽核文件、FA 記錄與客戶回覆資料。 - 協助改善流程效率、降低 TAT、提高一次修復率（First Pass Yield）。

-Foundry Transfer 1.Coordinate with respective backend NPI engineering teams the processing of technology-transfer lots from wafer fabrication out through wafer sort, characterization, qualification, and safe launch 2. Work with Fab Process Engineering and Process Integration to review process transfer status, risks, and action items. 3. Drive lot track schedules, milestones, and issues; communicate risks to the Technology Transfer Project Lead and Product Engineering Director. -Wafer Yield & Data Analysis 1.Review wafer sort data, wafer maps, WAT/PCM data, electrical yield, and parametric distributions. 2. Identify process-related yield loss, electrical anomalies, and parametric shifts. 3. Work with Fab Yield and Process Engineering teams on root-cause analysis, corrective actions, and yield improvement during safe launch through to product maturity. -Product Release Coordination - Probe, Characterization, Reliability Testing 1. Project coordinates the following key activities in the product transfer cycle 2. Wafer probe and engineering characterization activities before package assembly. 3. DC and AC characterization within the characterization team and support correlation between wafer probe, final test, and reliability data. 4. Assembly, Final Test, Reliability, Failure Analysis, Quality, Operations, and Supply Chain to support product release. 5. Interface with reliability teams for AEC-Q101 reliability tests such as HTRB, HTGB, Temperature Cycling, Power Cycling, HAST, THB, HTSL, Autoclave, and package qualification testing. 6. Support failure analysis reviews when yield, qualification, or test issues occur. 7.Prepare engineering build reports, yield summaries, qualification updates, and manufacturing readiness materials. **Please make sure to attach your most updated English resume along with your 1111 application.

1.負責半導體設備機台電路設計與規劃 2.繪製電路圖、配線圖及相關技術文件 3.進行電控元件選型(如電源、馬達、Sensor、Relay、PlC..等) 4.協助機台配線、測試、調機及異常排除 5.與機構、軟體及製造團隊合作，完成設備開發與改善

1.擬定及執行產品測試作業。 2.督導執行測試記錄與測試報告之完成。 3.規劃執行測試設備配置。 4.開發引進新測試技術。 5.改善測試設備。 6.測試技術傳承&教導。 ※依學經歷、工作年資敘薪