轉職熱搜工作

該公司專注於特殊氣體之提供、相關設備維護等服務，過去之工程實績包括各種液晶顯示器(LCD)、半導體(IC)、發光二極體(LED)、整廠氣體管路(special gas、CDA)規劃、設計、施工、監工及完工測試，並針對不同的需求提案供客戶參考。 工作內容： 西半部常態性出差至大廠客戶端 (出差地點為新竹市、高雄市，主要地點為高雄) (出差津貼另計) 1. 負責設備的組裝/改造（半導體製程設備）與外國技師交流等　 2. 機台硬體組裝及驗收 　 3. 機台拆機，移機及組裝驗收 　 4. 拆移機，裝機之流程建立及改善 　 5. 拆裝機現場問題及異常排除 基本要求： 1. 工作內容有相關經驗者優先錄取 2. 派駐半導體科技廠、具備無塵室經驗佳 3. 具溝通協調能力、工作細心、態度嚴謹 4. 良好的職場安全意識

該公司專注於特殊氣體之提供、相關設備維護等服務，過去之工程實績包括各種液晶顯示器(LCD)、半導體(IC)、發光二極體(LED)、整廠氣體管路(special gas、CDA)規劃、設計、施工、監工及完工測試，並針對不同的需求提案供客戶參考。 工作內容： 西半部常態性出差至大廠客戶端 (出差地點為新竹市、高雄市，主要地點為高雄) (出差津貼另計) 1. 負責設備的組裝/改造（半導體製程設備）與外國技師交流等　 2. 機台硬體組裝及驗收 　 3. 機台拆機，移機及組裝驗收 　 4. 拆移機，裝機之流程建立及改善 　 5. 拆裝機現場問題及異常排除 基本要求： 1. 工作內容有相關經驗者優先錄取 2. 派駐半導體科技廠、具備無塵室經驗佳 3. 具溝通協調能力、工作細心、態度嚴謹 4. 良好的職場安全意識

【工作內容】 負責半導體製造設備之安裝、調整、升級與日常維護，確保設備穩定運作並持續提升產能與效能。 • 制定與執行設備維護與保養標準 • 建立及優化設備維修制度與流程 • 處理設備異常、故障排除與維修作業 • 管理設備零件並協助降低維護成本 • 持續改善設備效率與生產效能 • 協助新設備評估、導入與測試 【上班時間】 ❚ 日班： 07:30–19:30 ❚ 夜班： 19:30–07:30 ※ 做四休三、做三休四，雙週循環 ※ 3 – 4 個月日夜輪調 【福利制度】 • 12個月基本薪資+年終獎金(需當年度12月31日當日在職) • 績效分紅獎金 • 輪班津貼 • 到職當月即享特休假 • 全薪病假 80 小時（優於勞基法） • 勞退雇主提撥8％ ( 優於勞基法 ) • 員工配偶與子女免費團體醫療保險 • 育兒津貼（0–7 歲子女適用） •生日禮券、生育、婚喪賀奠及急難補助 •提供交通車搭乘 【我們想找的人才】 ✓ 理工相關科系畢業（電機／電子／機械／材料／化學 / 化工 / 材料 等 ) ✓ 非相關科系，具兩年以上相關工作經驗 ✓ 可接受全日穿著無塵衣 ✓ 可配合每3-4個月日夜輪班

*公司介紹: 外商公司已有165年歷史 於1971年進入台灣,為第一家在台灣設立LCD玻璃基板工廠並製造的供應商，在台南科學園區和台中中部科學園區建立了最現代、最高效率的生產工廠,提供市場領先技術製造高品質LCD玻璃基板. *我們正在尋找一個高度稱職的Modeling Simulation Development Engineer,未來您所會參與的工作內容如下 : Scope of Position and Day to Day Responsibilities: • Use knowledge of physics to build deep understanding of the materials and processes at CDT • Use existing tools and develop new analytical and numerical models to resolve process problems • Correlate simulation with experimental results • Support development and validation testing • Communicate results both orally and in written form of English • Protect Corning’s intellectual property by filing invention disclosures for patent application in timely fashion • Document all project findings in internal technical reports Required Skills: • Experience of using or programming in any one of the commercial software like ABAQUS, NASTRAN, ANSYS or DYNA3D • Strong foundation in physics and engineering science with programming skills • Sold Mechanics fundamental • Capability to design and plan the verification experiment for modeling • Creative/innovative problem solving via scientific or engineering methods • Results oriented and high commitment /energy • Sold Mechanics fundamental or computational fluid dynamics 參與實驗設計、計畫、執行 負責模擬分析 使用電腦及專業軟體進行模擬，校正設定條件，讓模擬接近真實情境 擅長使用工具:ABAQUS、C++、Java、Python、Pro/E 面試流程：一次面試，以視訊方式進行，一周內會得知結果

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 / 相關福利 / ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / WiFi MAC Engineering / System Validation Role and Responsibilities With the approaching and widely spread of WIFI technology, Qualcomm connectivity business is growing rapidly to fulfill these AP/Station chip demands, we are actively seeking talented engineer who will be responsible for MAC Host/FW development inside hardware/system team. The candidate needs to engage team across geos and possesses with solid knowledge of 802.11AX/BE MAC protocols, linux system, and testing infrastructure. The job requires to follow the timeline strictly and have capability of fast turn-around for solution of highly complex, challenging issues. The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with world-wide design team to complete the pre-silicon verification, ASIC bring up for MAC/FW/Host, as well as system performance tuning and customer support. / Qualifications / Master’s degree in Engineering, Electronic Engineering, Computer Science, or related field. proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. / Preferred Qualifications / -Comprehensive understanding of IEEE802.11 MAC protocol design, including data t3sfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience of 11AX/BE is a plus. - Linux/firmware/embedded-system design, kernel driver development. - Pre-silicon bring-up and verification. PHY layer experience is a plus. - Understanding of ASIC verification process, WIFI testing/issue analysis. IEEE Lab certification experience is a plus. - Source code management system such as Perforce, GIT.

成立於1985年的美國IC設計公司為全球領先的無線技術創新者，也是 5G 開發、推出和擴展的驅動力，為知名手機品牌晶片設計，專門設計並販售可用於無線網路連線領域的半導體產品，提供優於勞基法福利，歡迎參考相關職缺。 ★生日禮金：1000元 ★新年獎金：2000元 ★端午獎金：1000元 ★中秋獎金：1000元 ★特休優於勞基法：第一年給予七天特休假 / Job Overview / - Test planning, test case development and execution. This includes hands-on testing with various mobile/laptop/router wifi/BT products in lab and in the field. - Test case automation and maintenance. - Must be capable of prototyping, reworking, and soldering small electronic components such as resistors, capacitors, inductors, jumper-wiring, etc. in a clean method utilizing conventional lab techniques. - During chip development, power consumption and system performance verification analysis. - Collaborate with software, hardware, system team to verification new Wi-Fi features. / Required Skills / - familiar with power converter ( SMPS , LDO , PMIC ) - Ability to understand spreadsheets, schematics, layout, component datasheets, BOM parts list, etc - Familiar with TCP/IP protocol and Wi-Fi network concepts. - Comprehensive knowledge in using bench equipment (e.g. Wi-Fi tool tester, Oscilloscope, Spectrum analyzer, Sniffer, …). - Knowledge of computer programming fundamentals (Python/Perl/Shell). - Experience in Windows and Linux/IOS/Android operating system. - Experience with wireless standards (WiFi/BT) - Analytical problem-solving approach, good communication skills, self-motivated, cheerful and optimistic attitude. / Preferred Skills / - Knowledge and/or experience in MIMO, OFDM, CDMA. - ands on lab debugging/measuring skills and characterization using Spectrum Analyzer, VSG, VSA, Network Analyzer & Power Meter.

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 Role and Responsibilities： With the approaching and widespread of WIFI technology, we are actively seeking talented engineers who will be responsible for system design, validation, and optimization in the hardware/system team. As a member of the WIFI Hardware System team, you will participate in Wi-Fi system design, development, validation, integration, and performance optimization. The responsibilities cover overall chip lifecycle development, including FPGA emulation, pre-silicon verification, ASIC bring as well as system performance tuning and customer support. You will need to collaborate with SOC, analog, and algorithm teams to develop new Wi-Fi features. Requirements Minimum Qualifications: Master‘s degree in Engineering, Electronic Engineering, Computer Science, or related field. Systems Engineering or related work experience with extensive lab experience and debugging capabilities. Good team communication, documentation, and interpersonal skills. Preferred Qualifications: Experience in at least one or more of the following areas: o Communication theory, signal processing, RF Systems, Microwave engineering, signal estimation and detection, automatic gain control, RF impairment estimation and correction, channel estimation, Power control, RF interfaces and digital mitigation of RF distortion, etc. o Experience with wireless standards (WiFi/BT/5G/LTE/UMTS) o Knowledge and/or experience in MIMO, OFDM, CDMA o PHY/MAC layer systems design, spectrum sharing, and next-generation WiFi. o Experience in performance analysis and system-level simulation. o Ability to program effectively in C/C++, Python, and/or Matlab. - Experience in verification on FPGA, and system simulation is a plus. - Hands-on lab debugging/measuring skills and characterization using Spectrum Analyzer, VSG, VSA, Network Analyzer & Power Meter. -Strong analytical problem-solving approach, good communication skills, self-motivated, cheerful, and optimistic attitude. 此職缺為派遣職，一年一簽

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽

➸line ID：@331eipuj 歡迎加入生活圈截圖職缺+詢問➜ https://lin.ee/mDBSgyC 直接截圖+賴詢問，超快速回覆安排!! ================================ 【關於我們】 ✦ 全球前三大半導體設備商，產業領導品牌 ✦ 完善培訓與透明升遷 ✦ 訂單穩定，職涯長期發展 【錄取就是正職!!此為正職代招!!不收取費用!!】 【工作內容】需穿著無塵衣 依照電腦說明安裝零件，使用手動工具、扭力扳手、設備和夾具組裝晶圓製造設備。 ＜＜提供完整教育訓練，無經驗可＞＞ 【上 班 時 間】 - 日班 08:00 ~ 17:00 ｜核薪33,000元-55,000元(加班另計) - 中班 16:00 ~ 01:00 ｜月薪37,950元-63,250元(加班另計) - 夜班 00:00 ~ 09:00 ｜月薪41,250元-68,750元(加班另計) 【福利制度】 1. 年薪上看16個月、免費供餐 2. 免費團保、免費汽機車停車位 3. 完整教育訓練，無經驗可 4. 三節禮金或禮品、尾牙等

✅ 全球前三大半導體設備商，訂單穩定 ✅ 可立即上班 ✅ 固定早／中班 ✅ 加班彈性 ✅ 環境乾淨+免費供餐+獎金 ✅ 不用搬重 【工作內容】 ◆拆貨、分貨 【上班時間】(可固定班別) ◆日班 早上08:00 ~ 下午05:00 ◆中班 下午16:00 ~ 隔日01:00 ◆周休六日 【薪資福利】 ◆薪資34,000 / 中班39,100 (額外有期滿獎金，三個月就領一次!!) ◆免費汽機車位 ◆免費供餐 ◆體檢補助 ◆可參與公司活動：慶生會、尾牙晚宴、部門聚會等 ↓＜求職快速通道＞↓ 如果對該職缺有興趣，可以加入我的line生活圈––@765zqtam 請留言：姓名+電話+職缺截圖，快速幫您安排!!! 聯絡窗口：Jenny 舒小姐 03-370-1558#304