轉職熱搜工作

1.設備組裝、安裝、拆機。 2.完成現場主管交辦事宜。 3.工作場所為無塵室工作環境 4.無經驗可,簡單易學,專人帶新人,團隊合作 5.依照工作表現適時調薪 6.工作時間 09:00~18:00 (加班費另計)配合現場為主 7.有勞保/健保/團保 (合法合規) 8.(注意)本職缺不適用年終獎金及三節獎金/禮品福利制度，勞保/健保/團保則皆有。 9.需(營造業)職安六小時證件(沒有可協助辦理)

Responsibilities: 1. Advise customer on hardware requirements to realize IC ATE device testing PCB design projects, including Probe card, load board and others. 2. Perform PCB PI/SI simulation task for High speed digital, RF, and High current power design. 3. Solve the PI/SI issue with PCB design team and customer. 4. Manage simulation schedules and keep customers informed of the simulation status. Manage customer to ensure project success and customer satisfaction. 5. Gather and understand customer requirements. Verify whether the information is enough to initiate a design project.

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

1.進料檢驗執行：負責原物料、零組件之進場檢驗，確保品質符合 SIP（檢驗規範）與工程圖面要求。 2.儀器操作與量測：熟練操作游標卡尺、高度計、二次元或投影儀等精密量測設備。 3.抽樣計畫管理：依據 ISO 9001 (MIL-STD-105E) 抽樣標準進行 AQL 判定與允收。 4.異常處理與追蹤：發現進料品質異常時，開立不良報告並即時反應至採購與品保主管、工程師，追蹤供應商改善成效。 5.報表製作：登錄檢驗數據於 SAP系統，並彙整每日/每週進料合格率報表。 6.環境維護：負責 IQC 檢驗區 6S 維護及檢驗儀器之日常保養校正。 7.主管交辦事項。

1.檢查、測試、或測量材料、產品、裝置，使之符合規格。 2.使用測量儀器(卡尺高度規/二次元/三次元 等)測量產品的尺寸以符合圖面規格。 3.整理檢驗區的料件擺放(偶須搬貨品) 有量測經驗，薪資可另談

DIS Tech’s Project Management team designs custom hardware connecting DUTs to ATE testers (e.g., Teradyne, Advantest). We’re hiring a Project Manager to lead interface projects from concept to delivery. This customer-facing role involves translating requirements into test hardware while managing timelines, resources, and scope. Ideal candidates are engineers ready to grow into leadership, with strong communication, spatial reasoning, attention to detail, and urgency. Mentorship and hands-on training provided. Key Responsibilities: • As a Project Manager, you will be responsible for leading, executing and managing all the engineering activities of the new product design and development project with a high degree of independence and creativity. • Work closely with customers (both internal and external) to gather requirements and acceptance criteria. • Perform project sizing (scope, cost, schedule). • Create statement of work to align clearly with customer about scope, deliverables, schedule, acceptance criteria, risks and mitigation plan. • Create, track and manage detailed project plans and keep customers informed of project status. • Track, assess and communicate impact of changes (change management). • Drive PCB schematic and layout design, working with internal PCB design team. • Drive SI/PI performance optimization, working with internal simulation team. • Manage design reviews and milestone approvals. • Understand our supplier’s DFM rules/requirements/capabilities, and guide design accordingly. • Define PCB materials, stack-up, layout rules. • Work with operations team to ensure project manufacture/assembly/logistics are on-track, lead to resolve any schedule slipping by working out improvement plan • Provide continuous technical support for products already in the field. • Visit or travel to DIS Tech and customer sites as required. • Attend periodic night-time meetings with customers or teams in other regions (EU, US oversea customer when needed).

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

Role Summary/Purpose Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. Job Description • Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers • Collect and analyze customer input, make sure it is complete and feasible • Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project • Evaluate and provide project sizing including schedule, cost, resource, feasibility • Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly • Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control • Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication • Execute assigned technical roadmap research and development • Support team development through mentoring, knowledge sharing and training • Deliver hardware design training and seminars to customers • Keep close communication with worldwide Teradyne teams and customers

主要為自動化機台維修操作 需自動化機台維修操作相關工作經驗，有熱忱自信挑戰困難者佳! 親洽面試者請自備履歷 每個月有績效獎金2000(固定) / 獎金(依生產線數量計算) 工作年資滿三個月 薪資約40000 三節獎金(工作年資滿半年) 中秋 端午 年終獎金(底薪1個月以上) 詳情面洽