轉職熱搜工作

1. 數位 IC 設計與整合 2. 執行與管理數位 IC 設計 FE Integration相關任務 (2.a) RTL level QC，例如 Lint, CDC, RDC (2.b) STA timing analysis 與 fixing (2...

1. 整合IR 資訊和內部團隊合作解決 IR 問題 2. 產生並分析 power 資訊 3. 和客戶溝通 IR 相關的 methodology 並開發流程解決問題

1. Analyze market need and competition landscape of automotive compute SoC for cockpit and ADAS applications 2. Define SoC pr...

1. Master project management for all Automotive programs 2. Coordinate with internal and external HW, SW, Board lead, and Bu...

1. Develop and implement DRAM controller/PHY solutions for data-center applications. Validate functionality, improve design t...

• Chip to Chip 介面類比 PHY 電路，例如 UCIe 標準或客製化的 Die to Die 連結類比電路設計 • HBM/DDR/LPDDR類比PHY電路設計與混合模式/高速電路設計等。

1. SIP Module Business model & Technology Roadmap Planning 2. SIP (System in Package) Module strategy, state of Art technolog...

1.Telematics product market analysis and strategy planning 2.Telematics product competition analysis and roadmap planning 3....

The Senior Manufacturing and Test Engineer is responsible for improving manufacturing and test flows to optimize quality, yie...

The Senior Power Integrity Engineer is responsible for the design and analysis of Power Delivery Networks (PDNs), encompassin...