轉職熱搜工作

8+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enab...

1. 2.5D/3.5D package technology development​ 2. SoC/Memory heterogeneous integration package development​ 3. Package technolo...

1. Android平台相關軟體問題，SCM, Code line管理等...主要客戶聯絡窗口。 2. 分析、釐清並解決或轉交客戶回報的系統層級問題。 3. 進行問題根因分析，並提供即時解決方案或替代方案。 4. 與內部工程團隊協作，確保問題有效解決...

• Conduct regular market analyses and benchmarking studies (e.g., annually or quarterly) to ensure the company‘s compensation...

根據不同專案使用的各種CPU架構: * Function validation * Margin characterization & validation * System stability validation * Power/VF/Bench...

1. 參與CPU IP電路設計弱點之檢視與審查。 2. 開發 CPU IP 電路穩定度之測試項目，以排查/篩選出電路弱點。 3. 制定 CPU 電源完整性與電源量產品質方法

1. Familiar with chip digital design flow, including RTL integration, simulation, STA, power analysis 2. Basic knowledge of a...

Responsible for GPU IC product development, Post-silicon validation, production yield enhancement, and debugging of customer ...

1. Supplier Management: Manage key substrate suppliers and conduct rigorous QCDST evaluations to ensure alignment with MediaT...