轉職熱搜工作

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling fo...

1.負責 ASIC Memory IP Driver 軟體開發與 IC驗證環境 2.熟悉軟/韌體、優化、IC驗證 及 除錯 等工作項目 3.執行 IC bring up 與韌體系統整合的工作

We are looking for experienced ML/DL candidates to join our team of PhD-level researchers and interns. The ideal candidate is...

1. CoWoS和2.5D封裝技術開發 2. 3D封裝技術開發 3. CPC/CPO封裝技術開發 4. 封裝技術整合和NTO管理

1. Model development (includes behavior modeling/ cycle approximate modeling/ power modeling) 2. ESL platform and simul...

1. 負責Smart TV顯示技術（含SoC、Panel、RGB mini-LED 背光等）產品規劃、行銷策略制定與推動，協助公司產品在市場中建立差異化優勢。 2. 深入了解電視SoC架構與設計原理，能將技術優勢轉化為市場溝通語言，協助業務團隊與客...

1. 屬於DE部門 2. 支援 WiFi/BT, 手機與 ARM computing等產品晶片開發計畫的FPGA與Emulation驗證工作與驗證技術開發 3. 主要為獨立貢獻者； 長期可依照潛力培養團隊領導能力，並有機會與全球科技產品的領導...

Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadma...

We are looking for AI hardware architect/designer to join our team and play a pivotal role in designing, developing, and opti...

1. Collaborate with engineers to understand product specifications and assist in writing detailed, high-quality English docum...