轉職熱搜工作

職責要求 - Lead the service team in Taiwan, providing technical support, preventive maintenance, and repairs for lithography and bonding systems. - Ensure high-quality and timely customer service for products, including coaters, developers, and wafer bonders. - Collaborate with the application engineering team to resolve technical issues and optimize equipment performance at customer sites. - Manage and monitor service contracts, warranties, and spare parts inventory to ensure availability and timely service interventions. - Conduct on-site troubleshooting, diagnostics, and repairs, ensuring minimal downtime for customer operations. - Develop and deliver training programs for customers on the use and maintenance of equipment. - Maintain service documentation, track key performance indicators (KPIs), and report on service activities to management. - Work closely with customers to understand their technical challenges and provide proactive solutions. - Coordinate with the global service and support team to share best practices and ensure consistent service quality. 任職資格 - Bachelor‘s degree or Master degree in Engineering field. - Minimum of 5 years of service or technical support experience, preferably within the semiconductor or high-tech equipment industry. - Minimum of 2 years service management proved experience - Strong technical knowledge of semiconductor lithography and bonding processes and equipment. - Proven experience in customer service management and troubleshooting complex technical issues. - Excellent communication and leadership skills, with the ability to lead a team and engage effectively with customers. - Fluent in English and Mandarin, with strong documentation and reporting skills.

職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.

- People management and leading a department to achieve team target. The main tasks of the department shown as below: - MRP planning implementation - Conduct material planning including BOM parts, Bulk materials, consumable parts and others. - SAP material master data set up, maintain and trouble shoot - Demand and Supply investigation to ensure the resources are able to meet customer demand - Securing all planned resource for production will be ready on time - Execute production plan with consideration of all resource constrains. (such as material, manpower, tools and facility) - Consolidate the need from production and coordinate with procurement team to ensure the material on-time delivery from supplier to factory. - Proactively to drive and find out the solution for material shortage to minimize production progress impact. - Conduct reverse logistics for parts repair / rework whenever needed. - Controls inventory level and facilitates the provision of necessary material and components - Managing and control the part introduction and phase out activities within Engineer Change process - Warehouse management and dispatch activity - Continuous improvement / Lean production introduction and implementation for logistics flow - Identifying risks and drive actions for mitigation - Other tasks assigned by supervisor

工作任務： - 在無塵室環境中執行機台測試和故障排除。 - 支援生產過程改善、精實製造和產品品質改進。 品質： - 根據既定規格生產機台。 - 觀察和報告系統問題，並支持解決方案以避免缺陷影響後續流程。 - 促進產品和過程的質量改進。 - 並在所有工作區域應用和遵循5S標準。 生產： - 根據既定程序製造機台。 - 解決在組裝過程中出現的技術問題、促進產品和過程的改進、樹立榜樣，帶領團隊成員。 - 了解從組裝到產出的整體過程，並在專業領域內作為問題解決的參考依據。 技能： - 獲取足夠的知識以完善系統，包括新產品和既有產品。 - 具備各模組與整個系統和其他（子）系統之間關聯性的相關知識及概念。 - 通過尋求解決方案和從部門任務中提出的想法來支持良好的團隊合作。 計劃： - 協調生產計劃中的生產活動，並掌握實際生產情況和進展。 - 密切控制生產工具、材料和設備的使用。 其他： - 完成主管指派的其他任務。

職責要求 1.擬定規劃產品策略方向並負責原廠產品線推廣規劃、價格商議與庫存管控能力；包含主動/被動產品線等。 2.具市場業務開發能力與行銷策略執行；並與原廠搭配產品策略，協助業務單位管理/提升現有業績、新專案拓展開發及協助產品導入。 3.研究市場趨勢和機會並定期拜訪客戶追蹤案子進度。 4.維繫原廠與客戶關係；且能與原廠合作並協助業務單位開發市場且能及時同步市場變化及分析競爭對手擬定相關策略。 5.配合原廠市場規劃、即時同步客戶狀況與市場變化，並統籌相關原廠報告。 6.具有積極度/領導能力/解決問題能力。 7.了解產品功能、特性，並針對相關單位進行教育訓練。 8.其他主管交辦事項。 任職資格 1.產品線管理15年以上 2.具有代理商/原廠PM進銷存管理工作&推廣經驗尤佳

1.生產計劃最適化、計畫執行監控，滿足訂單出貨需求。 2.生產線平衡，降低生產天數、在製品停留天數。 3.人員/製程效率最佳化，追求最佳產出與效能。 4.品質穩定與優化，符合客戶對於品質要求，並達成品質系統規範。 5.成本控管，杜絕浪費與閒置，達到投入產值最高。 6.課組織發展與管理，人員能力提升、教育訓練規劃、績效管理。 7.各項標準維護，包含標準工時、作業指導書、管理與程序一致性。 8.生產製造相關管理報表建構，符合量化管理依據。 9.其他專案推進與主管交辦事項達成。

1. 負責新產品行銷企劃案之撰寫、規劃與執行。 2. 蒐集市場情報，並擬定、分析行銷策略和價格策略。 3. 充分理解公司業務及行業特點，結合客戶要求以制定個別方案。 4. 規劃與產出行銷工具。 5. 維護既有客戶，開發新客戶，並推展業務。 6. 負責產品生命週期之維護。 7. 提供客戶產品技術支援。 8. 負責現有代理經銷業務之進、銷、存貨管理，並進行毛利控管。 9. 協助制訂業務銷售策略及改進銷售成績。 10. 支援各項業務專案之企劃工作。

1.負責品管體系完善，對出現的各種質量問題進行跟蹤處理 2.改善產品信賴度、可靠性、品質，進而全面提升產品品質。 3.負責ISO13485管理與推行，IQC、 IPQC及OQC管理。 4.推行並落實QA管理制度，以及規劃品質系統相關之教育訓練。 5.主導內部稽核活動及外部認證，監督及管理TQM執行成效。 6.負責產品檢驗規劃之制定，以及產品功能之測試與驗證。 7.解析競爭產品之品質規格，以改進品質，降低品質成本之損失。 8.導入新產品，並處理製程品管問題。 9.負責文件管理中心之建立與維護，及客戶服務的品保程序之規劃。 10.督導及辦理各國醫材法規規定之研析、標準之建立及導入。 11.法規事項與各部門進行溝通與合作。

職責要求 1.負責管理部(資訊/環安/廠務/人資/行政總庶務等)相關業務規劃。 2.廠區相關管理制度建立與執行。 3.協助優化管理部作業與流程。 4.固定資產及宿舍維護與管理。 5.建立及指導作業及行政程序，規劃及指導日常行政相關作業。 任職資格 1.學歷要求:專科以上 2.語文條件:英文(聽:精通、說:精通、讀:精通、寫:精通) 3.具備普通小型車駕照 4.具有西文能力者尤佳

職責要求 1.領導工程開發團隊與客戶進行BIOS專案開發 2.進行開發過程中必要之溝通協調工作 3.專案問題除錯、客製化功能開發與後續專案維護 4.未來儲備幹部人選 任職資格 1.熟悉x86 assembly and C language 2.具相關韌體開發、ARM系統開發、OEM專案經驗 3.熟悉PC系統架構 4.熟悉UEFI及EDK II框架