轉職熱搜工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22577&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the APTD (Advanced Packaging Technology Development) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, COUPE and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, COUPE and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Wet/Etch/Polymer/Bonding/Thinning/Joint/Saw/Trim/Material module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

職責要求 ● 核心系統架構設計：負責制定底層架構，了解產品性質後規劃後續可快速迭代或復用的模組化功能，提升研發效率及確保品質穩定。 ● 遊戲業務邏輯及表現層開發：主導遊戲內容開發並隨時審視效果表現符合產品預期，基於專業提出更佳的解決方案討論。 ● 效能調校與優化：針對不同平台進行深度優化 (例如：Android、iOS)，包含但不限於 3D 模型、粒子特效、記憶體管理、GC 與 Draw Call 優化。 ● 工具鏈與工作流建立：依需求進行編輯器規劃及開發，產出及交付的流程討論等，提升與企劃和美術團隊的協作效率。 ● 技術決策及程式碼審查：參與技術選型及技術難題討論，制定客端協作規範及檢查流程 (Code Review / 自動化單元測試)，引導並協助初中階工程師確保產出品質及提升技術能力。 ● 跨職能技術對接：與後端工程師協作討論，考量使用者體驗設計高效且抗斷線的客戶端與伺服器的通訊機制 (例如：狀態同步、錯誤重試)。 任職資格 ● 具備架構能力，熟悉 C#、SOLID 原則且能規劃符合 Unity 特性的設計模式。 ● 具備 3D 數學基礎 (向量、矩陣、四元數) 且熟悉 Unity 引擎底層，深度理解 SRP/URP 及 Shader 原理。 ● 具備卡牌類養成遊戲開發經驗，熟悉其資料結構及流程設計。 ● 熟練掌握資源管理機制 (Addressables、AssetBundle)，具備完整的客戶端熱更新框架搭建及雙平台 (Android、iOS) 上架經驗。 ● 具備效能優化經驗，熟練使用各種輔助工具檢核效能和資源使用問題。 ● 具備良好的分析解決問題能力，能獨立承擔複雜系統開發工作。 ● 具備高度的責任心、良好的溝通能力和團隊合作精神。 【加分條件】 ● 具備遠端團隊協作經驗

• Lead the full lifecycle of office construction and facility development projects, from planning and design through procurement, execution, commissioning, and handover. • Manage multiple construction packages, including: o Office design and space planning o Interior fit-out and renovation works o Mechanical, Electrical, and Plumbing (MEP) systems o Fire protection, low-voltage, and other building infrastructure projects • Develop project execution strategies, schedules, budgets, and risk mitigation plans. • Oversee design consultants, contractors, suppliers, and internal stakeholders to ensure projects are delivered on time, within budget, and to quality standards. • Drive tendering and sourcing activities, including RFI, RFQ, RFP, bid evaluation, contract negotiation, and award processes. • Leverage knowledge of public works and tendering procedures to ensure regulatory compliance and effective project delivery. • Identify, evaluate, and onboard new suppliers and contractors to expand and strengthen the supplier base. • Manage project budgets, cost controls, change orders, claims, and contract administration. • Monitor project progress, safety, quality, and compliance requirements throughout execution. • Provide regular project updates and recommendations to senior management. 1. 負責辦公室及相關設施建設專案之全生命週期管理，包括規劃、設計、招標、施工、驗收及移交作業。 2. 主導各項工程標案及施工包管理，包括但不限於： o 辦公空間設計（Design Package） o 室內裝修工程（Fit-out / Renovation Package） o 機電工程（MEP Package） o 弱電系統、消防及相關配套工程 1. 熟悉公共工程相關法規、招標程序及履約管理機制，能獨立規劃並推動標案執行。 2. 與內部使用單位、設計顧問、施工廠商及外部利害關係人協調，確保專案依品質、成本及時程要求完成。 3. 建立並管理工程預算、成本估算及專案風險控管機制。 4. 負責工程供應商及承包商開發與管理，持續拓展及建立優質供應商資源。 5. 制訂招標策略，執行RFI、RFQ、RFP、競標及議價等採購活動，以確保最佳商業條件及供應品質。 6. 監督工程進度、品質、安全及合規要求，並定期向管理階層彙報專案執行情況。 7. 處理工程變更管理、合約管理及履約爭議等相關事宜。 8. 持續優化工程建設及採購流程，提高專案執行效率與成本效益。

1.實領36,000以上。 2.福利:育兒津貼14萬、生日6千、旅遊1萬、分紅最高12萬、調薪最高2500、三節5000、、、。 3.升遷透明。 4.無經驗可，一對一教學。 5.三日內必回覆。 6.工作內容 製程改善：產線優化與故障排除。 AI數據分析：製程數據監控與產線異常基礎分析。 日常巡檢：定期設備巡視與產線安全維護。

1.執行設備定期保養 2.維修受損的設備 3.設備修改及改善 4.填寫定期保養及維修紀錄 5.執行設備緊急搶修 6.支援協助進出貨 7.每月於六或日輪值1~2天

1.需機械工程技能，須具備基本英語能力。 2.設計規劃生產設備。 3.協助生產設備安裝及管路施工問題。 4.設計並維護生產設備。 5.機械工科相關系所畢，具機械或化工產業工作經驗佳。

1. 5G NR通訊系統分析 (a) 5G NR實體層規格及流程驗證 (b) 基頻演算法設計驗證及訊號分析 (c) 整體系統效能驗證與流程分析 2. 5G NR通訊平台開發 (a) 內部測試平台開發 (基本功能,算法) (b) 系統性能以及RRM分析平台開發